Patents by Inventor Feng Peng

Feng Peng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10898829
    Abstract: Disclosed is a continuous process for the purification of steviol glycosides extracted from the dried stevia leaves using continuous simulated moving bed processes and nanofiltration without the addition of organic solvents to obtain a purified steviol product comprising sweet steviol glycosides. The sweet steviol glycosides can be used as substitutes for caloric sweeteners in beverages and in other food items.
    Type: Grant
    Filed: January 24, 2019
    Date of Patent: January 26, 2021
    Assignee: Orochem Technologies Inc.
    Inventors: Anil R. Oroskar, Babu Siddegowda Antharavally, Pravin Ramkrishna Ninawe, Asha A. Oroskar, Xinjie Chen, Feng Peng, Rahuljit Pal
  • Publication number: 20210017436
    Abstract: The present invention relates to a modification method for graphene, a modified graphene and a composition containing graphene. The modification method for graphene comprises: mixing graphene oxide, a silicate ester, an inorganic alkali solution, a water-soluble polymer compound and a surfactant, followed by reacting at 10 to 50° C. for 0.1 to 10 hours, collecting and drying solid product of the reaction to obtain the modified graphene.
    Type: Application
    Filed: November 26, 2018
    Publication date: January 21, 2021
    Applicants: TUNGHSU TECHNOLOGY GROUP CO., LTD., TUNGHSU OPTOELECTRONIC TECHNOLOGY CO., LTD.
    Inventors: Feng GUO, Fei PENG
  • Patent number: 10866128
    Abstract: The embodiments of the present application disclose a method and an apparatus for determining flow rates of components of multiphase fluid. The method comprises: performing a first magnetization treatment and a second magnetization treatment on multiphase fluid in a pipeline in a target oil and gas well, respectively, to obtain first magnetized multiphase fluid and second magnetized multiphase fluid; determining a first echo train signal set and a second echo train signal set corresponding to the first magnetized multiphase fluid and the second magnetized multiphase fluid, respectively; determining contents of an oil phase component, a water phase component, and a gas phase component of the multiphase fluid at a specified horizon position, and determining a flow velocity of the multiphase fluid at the specified horizon position; and determining flow rates of the oil phase component, the water phase component and the gas phase component in the multiphase fluid.
    Type: Grant
    Filed: May 18, 2018
    Date of Patent: December 15, 2020
    Assignee: PETROCHINA COMPANY LIMITED
    Inventors: Feng Deng, Ruidong Zhao, Junfeng Shi, Xin Zhang, Jianjun Zhang, Chunming Xiong, Xishun Zhang, Yi Peng, Shiwen Chen, Wei Yang
  • Patent number: 10867987
    Abstract: An integrated circuit device with ESD protection includes a substrate with a well having a first conductivity type formed on the substrate. A drain region has at least one drain diffusion with a second conductivity type implanted in the well and at least one drain conductive insertion on the well. The drain conductive insertion is electrically connected to the drain diffusion and an I/O pad. A source region includes a plurality of source diffusions having the second conductivity type implanted in the well, and the source diffusions are electrically connected to a voltage terminal.
    Type: Grant
    Filed: September 29, 2017
    Date of Patent: December 15, 2020
    Inventors: Po-Lin Peng, Li-Wei Chu, Yi-Feng Chang, Jam-Wem Lee
  • Publication number: 20200387200
    Abstract: An electronic device includes a first body, a second body, two hinges, and at least one electronic assembly. The two hinges are connected between the first body and the second body, and the first body and the second body are adapted to rotate relatively through the two hinges. The electronic assembly is connected to the second body and is located between the two hinges.
    Type: Application
    Filed: January 21, 2020
    Publication date: December 10, 2020
    Applicant: COMPAL ELECTRONICS, INC.
    Inventors: Ming-Chung Peng, Ko-Fan Chen, Chun-Yi Ho, Chien-Ting Lin, Yu-Jung Liu, Hsin-Jung Lee, Hsin-Yu Huang, Jih-Houng Lee, Ming-Feng Liu, Kuo-Jung Wu, Kuo-Pin Chen, Chia-Ling Lee, Jing-Jie Lin
  • Publication number: 20200381534
    Abstract: Semiconductor structures are provided. The semiconductor structure includes a fin structure protruding from a substrate and a doped region formed in the fin structure. The semiconductor structure further includes a metal gate structure formed across the fin structure and a gate spacer formed on a sidewall of the metal gate structure. The semiconductor structure further includes a source/drain structure formed over the doped region. In addition, the doped region continuously surrounds the source/drain structure and is in direct contact with the gate spacer.
    Type: Application
    Filed: August 17, 2020
    Publication date: December 3, 2020
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Shahaji B. MORE, Chun-Hsiung TSAI, Cheng-Yi PENG, Shih-Chieh CHANG, Kuo-Feng YU
  • Publication number: 20200370554
    Abstract: A rotary screw compressor includes a compressor assembly and a drive motor assembly. The compressor assembly includes a compressor housing, a first screw rotor and a second screw rotor installed in the compressor housing and engaged with each other. An end of the first screw rotor is an engaging end. The drive motor assembly includes a motor housing, a motor rotor, a motor stator and a centering bushing installed in the motor housing, and the motor stator installed on an outer side of the motor rotor and capable of driving the motor rotor to rotate, and the centering bushing is passed and connected to the inner circumference of the motor rotor and has an end sheathed on the engaging end, so that the motor rotor can drive the first screw rotor to rotate through the centering bushing and the engaging end.
    Type: Application
    Filed: April 1, 2020
    Publication date: November 26, 2020
    Inventors: Yung-Sheng PENG, Yu-Feng WU, Feng-Yung LIN
  • Publication number: 20200357946
    Abstract: In one example embodiment, a PCBA, an optoelectronic module, an electrical coupling, and/or a high speed interconnect may include a first contact pad, a second contact pad adjacent to and spaced apart from the first contact pad, a first wire coupled to the first contact pad via a first ball bump, and a second wire coupled to the second contact pad via a double ball bump.
    Type: Application
    Filed: May 22, 2019
    Publication date: November 12, 2020
    Inventors: Tao SUN, Feng WANG, Wei Peng NIAN, Ting SHI, Bing QIU, Shao Jun YU
  • Patent number: 10819486
    Abstract: Disclosed is a sounding reference signal (SRS) transmission method. The method comprises: determining a resource on an unlicensed carrier for transmitting an SRS; and transmitting the SRS according to the determined resource. The invention solves a problem in the prior art in which transmitting an SRS on an unlicensed carrier is less feasible, thereby increasing feasibility of transmitting an SRS on an unlicensed carrier. Also disclosed are an SRS reception method, an apparatus, a system, and a storage medium.
    Type: Grant
    Filed: March 31, 2017
    Date of Patent: October 27, 2020
    Assignee: ZTE CORPORATION
    Inventors: Ling Yang, Wei Gou, Yajun Zhao, Focai Peng, Feng Bi
  • Patent number: 10813129
    Abstract: A method and apparatus for sending and receiving uplink data, a terminal, and a base station are provided. The method comprises: determining, according to a self-defined instruction message or an instruction message received from a base station, a start symbol position or the start symbol position and an end symbol position for transmitting a subframe on a physical uplink shared channel (PUSCH) on an unlicensed carrier; and sending uplink data according to the start symbol position or according to the start symbol position and the end symbol position. By means of the embodiments of the present invention, the problem of failing to determine the time point of transmitting uplink data on an unlicensed carrier by a terminal is resolved, thereby achieving the effect of determining the time point of transmitting the uplink data on the unlicensed carrier by the terminal, and providing the effect of improving the data transmission efficiency.
    Type: Grant
    Filed: January 18, 2017
    Date of Patent: October 20, 2020
    Assignee: ZTE CORPORATION
    Inventors: Xincai Li, Yajun Zhao, Wei Gou, Focai Peng, Feng Bi, Ling Yang
  • Publication number: 20200329493
    Abstract: Provided are a method and apparatus for configuring contention-based access parameters of a Licensed-Assisted Access (LAA) device. The method includes: determining, according to different priority classes, different Listen Before Talk (LBT) mechanisms or different LBT mechanism parameter sets corresponding to the different priority classes; executing contention-based access to an unlicensed carrier by using the different LBT mechanisms or the different LBT mechanism parameter sets corresponding to the different priority classes; and when a right of using the unlicensed carrier is successfully gained based on a used LBT mechanism or a used LBT mechanism parameter set, transmitting data by utilizing the unlicensed carrier.
    Type: Application
    Filed: June 24, 2020
    Publication date: October 15, 2020
    Inventors: Ling YANG, Wei GOU, Focai PENG, Feng BI, Xincai LI, Yajun ZHAO
  • Publication number: 20200312763
    Abstract: Chip package structure and chip package method are provided. The chip package structure includes an encapsulating layer, a first metal layer, a second metal layer, and bare chips. The bare chips include first bare chips and second bare chips. First-connecting-posts are formed on a side of the first bare chips and on a side of the second bare chips. The encapsulating layer covers the bare chips and the first-connecting-posts. The first metal layer is disposed on the side of the first-connecting-posts away from the bare chips and includes first capacitor polar plates and conductive parts. The first capacitor polar plates are electrically connected to the first-connecting-posts on the first bare chips, and the conductive parts are electrically connected to the first-connecting-posts on the second bare chips. The second metal layer is disposed on a side of the first metal layer away from the encapsulating layer and includes second capacitor polar plates electrically connected to the conductive parts.
    Type: Application
    Filed: June 14, 2019
    Publication date: October 1, 2020
    Inventors: Kerui XI, Feng QIN, Jine LIU, Xiaohe LI, Tingting CUI, Xuhui PENG
  • Patent number: 10790225
    Abstract: Chip package structure and chip package method are provided. The chip package structure includes an encapsulating layer, a first metal layer, a second metal layer, and bare chips. The bare chips include first bare chips and second bare chips. First-connecting-posts are formed on a side of the first bare chips and on a side of the second bare chips. The encapsulating layer covers the bare chips and the first-connecting-posts. The first metal layer is disposed on the side of the first-connecting-posts away from the bare chips and includes first capacitor polar plates and conductive parts. The first capacitor polar plates are electrically connected to the first-connecting-posts on the first bare chips, and the conductive parts are electrically connected to the first-connecting-posts on the second bare chips. The second metal layer is disposed on a side of the first metal layer away from the encapsulating layer and includes second capacitor polar plates electrically connected to the conductive parts.
    Type: Grant
    Filed: June 14, 2019
    Date of Patent: September 29, 2020
    Assignee: SHANGHAI AVIC OPTO ELECTRONICS CO., LTD.
    Inventors: Kerui Xi, Feng Qin, Jine Liu, Xiaohe Li, Tingting Cui, Xuhui Peng
  • Publication number: 20200303549
    Abstract: A method for forming a FinFET device structure is provided. The method includes forming a fin structure extended above a substrate and forming a gate structure formed over a portion of the fin structure. The method also includes forming a source/drain (S/D) structure over the fin structure, and the S/D structure is adjacent to the gate structure. The method further includes doping an outer portion of the S/D structure to form a doped region, and the doped region includes gallium (Ga). The method includes forming a metal silicide layer over the doped region; and forming an S/D contact structure over the metal silicide layer.
    Type: Application
    Filed: June 11, 2020
    Publication date: September 24, 2020
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chun-Hsiung TSAI, Shahaji B. MORE, Cheng-Yi PENG, Yu-Ming LIN, Kuo-Feng YU, Ziwei FANG
  • Patent number: 10783203
    Abstract: A data processing method is provided, wherein the method includes for each region in multiple regions, generating, according to a correspondence between location information of a user in a user group and the region, a user appearing information bit set corresponding to the region, where a bit value of each bit in the user appearing information bit set indicates whether a corresponding user in the user group appears in the region; receiving a request message carrying a region indication parameter; querying, according to the region indication parameter, for a user appearing information bit set corresponding to a region indicated by the region indication parameter, and performing data processing according to the found user appearing information bit set. Thus, a user appearing information bit set corresponding to a region is generated, thereby reducing data storage space, and increasing computing efficiency and a computing speed when performing data processing.
    Type: Grant
    Filed: November 27, 2017
    Date of Patent: September 22, 2020
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Chibing Chen, Feng Zhu, Xinsheng He, Chuan Peng
  • Publication number: 20200286926
    Abstract: The present disclosure provides a display backplane and a method for manufacturing the same, a display panel, and a display device. The display backplane includes: a substrate; a first thin film transistor located on one side of the substrate; and a second thin film transistor located on the one side of the substrate, wherein: the first thin film transistor comprises a first active layer, the second thin film transistor comprises a second active layer, wherein the first active layer and the second active layer are located in a same layer, and a material of the first active layer is different from that of the second active layer.
    Type: Application
    Filed: January 3, 2019
    Publication date: September 10, 2020
    Inventors: Yanan NIU, Jiushi WANG, Lei CHEN, Hongwei TIAN, Zhanfeng CAO, Feng GUAN, Feng ZHANG, Shi SHU, Kuanjun PENG, Yichi ZHANG, Qi QI
  • Patent number: 10771986
    Abstract: The present disclosure provides a clear channel assessment detection method and apparatus. The method includes: acquiring a clear channel assessment (CCA) detection pattern or a Muting pattern; and performing a CCA detection to an unlicensed carrier channel on resources corresponding to one of the CCA detection pattern or the Muting pattern.
    Type: Grant
    Filed: November 4, 2016
    Date of Patent: September 8, 2020
    Assignee: ZTE CORPORATION
    Inventors: Ling Yang, Wei Gou, Focai Peng, Yajun Zhao, Xincai Li, Feng Bi, Chenchen Zhang
  • Patent number: 10767230
    Abstract: Disclosed are methods of determining the likelihood of a subject having or developing a gastric cancer. The methods comprise measuring the expression level of at least one miRNA having at least 90% sequence identity with an miRNA as described herein in a non-cellular biofluid sample obtained from the subject, wherein differential expression of miRNA expression in the sample obtained from the subject, as compared to a control, may be indicative of the subject having gastric cancer and wherein the miRNA may be either an miRNA listed as “up-regulated” or an miRNA listed as “down-regulated”. Also disclosed is a method of determining the likelihood of a subject having or developing a stage of a gastric cancer.
    Type: Grant
    Filed: August 11, 2015
    Date of Patent: September 8, 2020
    Assignees: Agency for Science, Technology and Research, National University of Singapore, National University Hospital (Singapore) Pte Ltd.
    Inventors: Heng-phon Too, Lihan Zhou, Ruiyang Zou, Khay Guan Yeoh, Bok Yan So, Feng Zhu, Wei Peng Yong
  • Publication number: 20200281019
    Abstract: The present disclosure provides a method and an apparatus for determining a Listen Before Talk (LBT) mode, as well as a method for LBT mode switching. The method includes: determining (100) an LBT mechanism and/or an LBT mechanism parameter set based on related indication information and/or priority information and/or measurement information; and performing (101), by a transmitting device, contention-based channel access based on the determined LBT mechanism and/or LBT mechanism parameter set. With the present disclosure, an LBT mode can be determined. With the selection of the LBT mode, it is possible to avoid waste of channel resources and indication information due to an improper LBT mode, thereby improving an efficiency of contention-based channel access.
    Type: Application
    Filed: May 18, 2020
    Publication date: September 3, 2020
    Inventors: Ling Yang, Wei Gou, Focai Peng, Feng Bi, Yajun Zhao
  • Patent number: 10759689
    Abstract: A forming method for curved glass has been provided. The method comprises: placing a flat glass plate in a pattern die, and placing the pattern die in a forming apparatus; and subjecting the pattern die successively to staged heating, staged forming and staged cooling, so as to obtain the curved glass, wherein the staged heating is performed over stages which are different from each other in temperature, the staged forming is performed over stages which are different from each other in temperature, and during at least one of the stages, a varying pressure which varies from low pressure to high pressure is applied to the pattern die, the staged cooling is performed by cooling the glass plate in the pattern die over stages which are different from each other in temperature. The glass product could be used as front and rear covers of electronic products including notebook computers, mobile phones, tablet computers and smart watches.
    Type: Grant
    Filed: September 10, 2015
    Date of Patent: September 1, 2020
    Assignee: Lens Technology (Changsha) Co., Ltd.
    Inventors: Kwan Fei Chau, Qiaobing Rao, Feng Peng