Patents by Inventor Feng Peng

Feng Peng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20020060287
    Abstract: A structure of a photosensor for receiving optical signals and converting the optical signals into electrical signals to be transmitted to a circuit board, the structure of the photosensor includes a substrate, a photosensitive chip, and a transparent layer. The substrate has a first surface formed with signal input terminals, and a second surface opposite to the first surface and formed with signal output terminals for electrically connecting the substrate to the circuit board. The photosensitive chip is mounted on the first surface of the substrate and electrically connecting to the substrate. The transparent layer is adhered onto the first surface of the substrate. A cavity is formed at a central portion of the transparent layer. The photosensitive chip on the substrate is located within the cavity of the transparent layer, and the photosensitive chip is capable of receiving the optical signals via the transparent layer.
    Type: Application
    Filed: January 24, 2001
    Publication date: May 23, 2002
    Inventors: Mon Nan Ho, Hsiu Wen Tu, Kuo Feng Peng, Li Huan Chen, Joe Liu, Jichen Wu, Wen Chuan Chen, Yung Sheng Chiu
  • Publication number: 20020043709
    Abstract: A stackable integrated circuit for electrically connecting to a circuit board and for a second integrated circuit body to be stacked on. The stackable integrated circuit includes an integrated circuit body, a plurality of first contacts, a projecting layer, and a plurality of second contacts. The integrated circuit body has a first surface and a second surface opposite to the first surface. The first contacts are formed on the first surface of the integrated circuit body for electrically connecting the integrated circuit body to the circuit board. The projecting layer is arranged on the second surface of the integrated circuit body. The second contacts are formed on the projecting layer for electrically connecting the integrated circuit body to a second integrated circuit body.
    Type: Application
    Filed: January 23, 2001
    Publication date: April 18, 2002
    Inventors: Nai Hua Yeh, Mon Nan Ho, Hsiu Wen Tu, Yung Sheng Chiu, Kuo Feng Peng, Jichen Wu, Kuang Yu Fan, Wen Chuan Chen
  • Patent number: 6129108
    Abstract: A fluid delivering system receives a fluid from a supplying device, transfers the fluid to an operational device and then dumps the used fluid into an extraction device. The fluid delivering system has a main pipeline system and at least a secondary pipeline system. Each pipeline system uses a first flow valve to control the back flow of fluid to a first flow controller, a second flow valve to protect a pressure gauge and a third flow valve to control the flow of fluid to a pressure controller. Through the relative positioning and the concerted actions of these three valves, any malfunctioning in the fluid delivering system can be detected quickly so that on-going processing operation can stop immediately to minimize product damages.
    Type: Grant
    Filed: December 3, 1999
    Date of Patent: October 10, 2000
    Assignees: United Semiconductor Corp, United Microelectronics Corp
    Inventors: Yu-Feng Peng, Ming-Fa Liu, Morris Chang, Mike Hou