Abstract: A method for color correction of a pair of colorful stereo microscope images is provided, which transmits the color information of the foreground areas and the background area of the reference image to the aberrated image separately for avoiding transmission error of the color information of the varied areas of the pair of the images, thus sufficiently improves the accuracy of the color correction, reduces the difference between the color of the reference image and the color of the aberrated image, and well prepares for the stereo matching of the pair of colorful stereo microscope images as well as for the three-dimensional reconstruction and three-dimensional measurement; on the other hand, during the correction, the correcting procedure is provided automatically without manual work.

Abstract: A method for objectively evaluating quality of a stereo image is provided. The method obtains a cyclopean image of a stereo image formed in the human visual system by simulating a process that the human visual system deals with the stereo image. The cyclopean image includes three areas: an occlusion area, a binocular fusion area and a binocular suppression area. Representing characteristics of the image according to the singular value of the image has a strong stability. According characteristics of different areas of the human visual system while dealing with the cyclopean image, the distortion degree of the cyclopean image corresponding to the testing stereo image is presented by the singular value distance between cyclopean images respectively corresponding to the testing stereo image and the reference stereo image, in such a manner that an overall visual quality of the testing stereo image is finally evaluated.

Abstract: A semiconductor light-emitting device includes a circuit board with a layout layer and a die bonding area. At least one positive endpoint, negative endpoint and function endpoint are disposed on the layout layer. At least one semiconductor light-emitting chip is disposed within the die bonding area, and is electrically coupled to the positive endpoint, the negative endpoint and the function endpoint to facilitate various connection configurations.

Abstract: An illuminating device includes at least one light-emitting source. The light-emitting source includes a substrate; at least one light-emitting chip disposed on the substrate; and at least one constant-current component electrically coupled to the light-emitting chip. The light-emitting chip includes multiple light-emitting units that are electrically coupled in series, in parallel, or in series-parallel; a first-type electrode, disposed on at least one of the light-emitting units, for electrically coupling to a central DC power source; a second-type electrode disposed on at least one light-emitting unit different from the one, on which the first-type electrode is disposed; and a tapped point configured for electrically coupling at least one of the light-emitting units to the constant-current component.

Abstract: A method for detecting a parfocality of a zoom-stereo microscope includes: acquiring four highest definitions corresponding to a plurality of images with a cooperation of four definition judging functions, acquiring a relatively clearest position according to the four highest definitions, comparing a definition in the relatively clearest position with a definition in a parfocal position to judge whether the relatively clearest position is the parfocal position, then adjusting a magnification of the zoom-stereo microscope to acquire the parfocal positions at a finite number of the discrete magnifications, and finally fitting a parfocal curve at the continuous magnifications. The method according to the present invention implements a parfocality detection of the stereo microscope automatically and effectively and increases a productivity, and has a high detecting precision. In addition, the method according to the present invention has a good robustness, so that users needn't intervene and adjust frequently.

Abstract: Provided are acid addition salts of (Z)—N-[2-(diethylamino)ethyl]-2-methyl-7-(1,2-dihydro-5-fluoro-2-oxo-3H-indol-3-ylidene)-4,5,6,7-tetrahydro-1H-indol-3-carboxamide, wherein the salt comprising at least one of a number of salts including L-malate, hydrochloride, phosphate, L-tartrate, benzenesulfonate, sulfate, methanesulfonate, succinate, citrate, fumarate, p-toluenesulfonate, hydrobromate, L-mandelate, lactate, acetate or maleate salt. Also provided is a pharmaceutical composition comprising the salt compounds, and a method of treatment by administering a therapeutically effective amount of the salt compounds as preparation of medicaments.

Abstract: A light emitting package includes a base and one or more LED units coupled to the base. The LED unit includes a plurality of vertically stacked epitaxial structures. Each epitaxial structure includes at least a first doped layer, at least a light emitting layer, and at least a second doped layer. At least one luminescent element is spaced a distance from the one or more LED units.

Abstract: A light emitting diode array comprises a plurality of light emitting diode units connected in series and arranged for forming an array with n rows and m columns. At least one of the numbers m and n of the array is an odd number.

Abstract: This invention provides lenses having a pendant shape profile and their applications and forming methods. In an embodiment, the lenses are used to encapsulate one or more light-emitting diode chips so as to increase the light extraction efficiency.

Abstract: A mouse assembly used for a computer includes a first mouse module and a second mouse module. The first mouse module includes a first connector, and the second mouse module includes a second connector. The second mouse module is detachably and electrically connected to the first mouse module through the first connector and the second connector. When the first connector is mechanically and electrically connected to the second connector, the first mouse module and the second mouse module are assembled together, and the mouse assembly is used as a wireless mouse. When the first connector is mechanically disconnected from the second connector, the first mouse module intercommunicates with the second mouse module, and the mouse assembly is used as touch input device.

Abstract: The subject matter disclosed herein relates to a system and/or method offline data generation for online system analysis.

Abstract: A method for packaging LED chip modules is provided. First, a first sacrificial layer is disposed on a substrate. Afterwards, LED chips are synchronously disposed on the first sacrificial layer before the first sacrificial layer cures. Next, a first material, a second sacrificial layer, and a second material are used to form a support layer on the first sacrificial layer. The first sacrificial layer and the second sacrificial layer are then removed, so that LED chip modules are obtained, wherein each LED chip module has a corresponding support layer. Furthermore, a moving fixture is provided to synchronously remove chips from a wafer and dispose them on the sacrificial layer.

Abstract: A computer-implemented method for matching a display advertisement to a user within a large-scale, non-destructive user modeling and experimentation environment using real-time traffic. The method commences by populating a user profile object (containing demographics, history, and behaviors of the user) for use during concurrent operation of a production platform and an experimentation platform. To implement non-destructive testing, the method continues by cloning a portion of the real-time traffic for use by the experimentation platform while concurrently delivering the real-time traffic to the production platform. The production platform and the experimentation platform operate concurrently, scoring matches between the user profile objects and a plurality of display advertisements for selecting among the best-scored advertisements.

Abstract: The subject matter disclosed herein relates to a system and/or method offline data generation for online system analysis.

Abstract: A cutting method for wafer-level packaging capable of protecting the contact pad, in which several cavities and precutting lines are formed at the front surface of a cap wafer, and the depth of each precutting line is lesser than the thickness of the cap wafer, followed by the bonding of the cap wafer to the device wafer, which has several devices and several bonding pads disposed on the surface of the device wafer, followed by performing a wafer dicing process, along the precutting lines cutting through the cap wafer, and after removing a portion of the cap wafer that is not bonded to the device wafer, for exposing the bonding pads at the surface of the device wafer, and finally performing a dicing process for forming many packaged dies.

Abstract: A cap wafer with cavities is etched through areas not covered by a patterned photoresist to form a plurality of openings. The cap wafer is bonded to a transparent wafer at the surface having the cavities and is segmented around the cavities to form a plurality of cap structures. The cap structures are hermetically sealed to a device wafer to form hermetic windows over devices and pads located on the device wafer.

Abstract: A cap wafer with patterned film formed thereon is etched through areas not covered by the patterned film to form a plurality of openings. Then, the cap wafer is bonded to a transparent wafer, and the cap wafer around the pattern film is segmented to form a plurality of cap structures. A device wafer with a plurality of devices and a plurality of contact pads electrically connected to the devices is subsequently provided. The cap structures and the device wafer are hermetically sealed to form a plurality of hermetic windows on the devices.

Abstract: A cutting method for wafer-level packaging capable of protecting the contact pad, in which several cavities and precutting lines are formed at the front surface of a cap wafer, and the depth of each precutting line is lesser than the thickness of the cap wafer, followed by the bonding of the cap wafer to the device wafer, which has several devices and several bonding pads disposed on the surface of the device wafer, followed by performing a wafer dicing process, along the precutting lines cutting through the cap wafer, and after removing a portion of the cap wafer that is not bonded to the device wafer, for exposing the bonding pads at the surface of the device wafer, and finally performing a dicing process for forming many packaged dies.

Abstract: A cap wafer with cavities is etched through areas not covered by a patterned photoresist to form a plurality of openings. The cap wafer is bonded to a transparent wafer at the surface having the cavities and is segmented around the cavities to form a plurality of cap structures. The cap structures are hermetically sealed to a device wafer to form hermetic windows over devices and pads located on the device wafer.

Abstract: A cap wafer with patterned film formed thereon is etched through areas not covered by the patterned film to form a plurality of openings. Then, the cap wafer is bonded to a transparent wafer, and the cap wafer around the pattern film is segmented to form a plurality of cap structures. A device wafer with a plurality of devices and a plurality of contact pads electrically connected to the devices is subsequently provided. The cap structures and the device wafer are hermetically sealed to form a plurality of hermetic windows on the devices.