Patents by Inventor Feng Yang

Feng Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230386867
    Abstract: A chemical dispensing system is capable of simultaneously supplying a semiconductor processing chemical for production and testing through the use of independent chemical supply lines, which reduces production downtime of an associated semiconductor process, increases throughput and capability of the semiconductor process, and/or the like. Moreover, the capability to simultaneously supply the semiconductor processing chemical for production and testing allows for an increased quantity of semiconductor processing chemical batches to be tested with minimal impact to production, which increases quality control over the semiconductor processing chemical. In addition, the independent chemical supply lines may be used to supply the semiconductor processing chemical to production while independently filtering semiconductor processing chemical directly from a storage drum through a filtration loop.
    Type: Application
    Filed: August 10, 2023
    Publication date: November 30, 2023
    Inventors: Ming-Chieh HSU, Yung-Long CHEN, Fang-Pin CHIANG, Feng-An YANG, Ching-Jung HSU, Chi-Tung LAI
  • Publication number: 20230383223
    Abstract: A bioculture meat device includes a culture medium conditioning tank (1), a cell proliferation tank (2), a muscle separating tank (3), a compression forming device (4), and a control system. The control system is divided into a culture medium regulation and control system (51) for controlling the culture medium conditioning tank (1), a cell proliferation control system (52) for controlling the cell proliferation tank (2), and a muscle collecting and shaping control system (53) for controlling the muscle separating tank (3) and the compression forming device (4). Different from traditional manual production, the device controls a culture environment through automatic equipment, realizes automatic integration from culturing to processing a finished product, improves the production capacity, and reduces the cost.
    Type: Application
    Filed: August 5, 2022
    Publication date: November 30, 2023
    Inventors: Shouwei Wang, Feng Yang, Yingying Li, Shilei Li, Wenting Liu, Yushuang Li
  • Publication number: 20230387051
    Abstract: A method includes forming a conductive pad over an interconnect structure of a wafer, forming a capping layer over the conductive pad, forming a dielectric layer covering the capping layer, and etching the dielectric layer to form an opening in the dielectric layer. The capping layer is exposed to the opening. A wet-cleaning process is then performed on the wafer. During the wet-cleaning process, a top surface of the capping layer is exposed to a chemical solution used for performing the wet-cleaning process. The method further includes depositing a conductive diffusion barrier extending into the opening, and depositing a conductive material over the conductive diffusion barrier.
    Type: Application
    Filed: August 8, 2023
    Publication date: November 30, 2023
    Inventors: Chen-Yu Tsai, Ku-Feng Yang, Wen-Chih Chiou
  • Publication number: 20230386976
    Abstract: A semiconductor device includes a through-substrate via extending from a frontside to a backside of a semiconductor substrate. The through-substrate via includes a concave or a convex portion adjacent to the backside of the semiconductor substrate. An isolation film is formed on the backside of the semiconductor substrate. A conductive layer includes a first portion formed on the concave or convex portion of the through substrate via and a second portion formed on the isolation film. A passivation layer partially covers the conductive layer.
    Type: Application
    Filed: August 10, 2023
    Publication date: November 30, 2023
    Inventors: Yung-Chi Lin, Hsin-Yu Chen, Ming-Tsu Chung, HsiaoYun Lo, Hong-Ye Shih, Chia-Yin Chen, Ku-Feng Yang, Tsang-Jiuh Wu, Wen-Chih Chiou
  • Patent number: 11823979
    Abstract: A semiconductor device includes a through-substrate via extending from a frontside to a backside of a semiconductor substrate. The through-substrate via includes a concave or a convex portion adjacent to the backside of the semiconductor substrate. An isolation film is formed on the backside of the semiconductor substrate. A conductive layer includes a first portion formed on the concave or convex portion of the through substrate via and a second portion formed on the isolation film. A passivation layer partially covers the conductive layer.
    Type: Grant
    Filed: July 2, 2021
    Date of Patent: November 21, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Yung-Chi Lin, Hsin-Yu Chen, Ming-Tsu Chung, HsiaoYun Lo, Hong-Ye Shih, Chia-Yin Chen, Ku-Feng Yang, Tsang-Jiuh Wu, Wen-Chih Chiou
  • Patent number: 11821980
    Abstract: The present invention relates a remote sensing system, or particularly a satellite-formation-based remote sensing system, wherein comprising: a master satellite provided with an SAR system as a payload thereof, a first concomitant satellite, and a second concomitant satellite, wherein the first concomitant satellite and the second concomitant satellite fly around the master satellite, and the master satellite is located on major axes of motion trajectories of the first concomitant satellite and the second concomitant satellite, so as to define a first spatial baseline and a second spatial baseline that have an identical cross-track baseline component. The present invention enables high-precision, wide-range, three-dimensional imaging based on the satellite-formation, while acquires spatiotemporal features of variation of a ground region according to the synchronization in terms of time, frequency, and space.
    Type: Grant
    Filed: November 29, 2019
    Date of Patent: November 21, 2023
    Assignee: SPACETY CO., LTD. (CHANGSHA)
    Inventors: Feng Yang, Weijia Ren, Zhigui Du, Xianfeng Chen
  • Publication number: 20230369285
    Abstract: A method of fabricating a semiconductor chip includes the following steps. A bonding material layer is formed on a first wafer substrate and is patterned to form a first bonding layer having a strength adjustment pattern. A semiconductor component layer and a first interconnect structure layer are formed on a second wafer substrate. The first interconnect structure layer is located. A second bonding layer is formed on the first interconnect structure layer. The second wafer substrate is bonded to the first wafer substrate by contacting the second bonding layer with the first bonding layer. A bonding interface of the second bonding layer and the first bonding layer is smaller than an area of the second bonding layer. A second interconnect structure layer is formed on the semiconductor component layer. A conductor terminal is formed on the second interconnect structure layer.
    Type: Application
    Filed: July 26, 2023
    Publication date: November 16, 2023
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hong-Wei Chan, Jiing-Feng Yang, Yung-Shih Cheng, Yao-Te Huang, Hui Lee
  • Patent number: 11817329
    Abstract: A chemical dispensing system is capable of simultaneously supplying a semiconductor processing chemical for production and testing through the use of independent chemical supply lines, which reduces production downtime of an associated semiconductor process, increases throughput and capability of the semiconductor process, and/or the like. Moreover, the capability to simultaneously supply the semiconductor processing chemical for production and testing allows for an increased quantity of semiconductor processing chemical batches to be tested with minimal impact to production, which increases quality control over the semiconductor processing chemical. In addition, the independent chemical supply lines may be used to supply the semiconductor processing chemical to production while independently filtering semiconductor processing chemical directly from a storage drum through a filtration loop.
    Type: Grant
    Filed: May 29, 2020
    Date of Patent: November 14, 2023
    Assignee: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: Ming-Chieh Hsu, Yung-Long Chen, Fang-Pin Chiang, Feng-An Yang, Ching-Jung Hsu, Chi-Tung Lai
  • Publication number: 20230358362
    Abstract: A gas storage reservoir, an energy storage device, and a control method and a mounting method for the gas storage reservoir. An inner foundation structure surrounds the outer side of a ground film; an outer foundation structure surrounds the outer side of the inner foundation structure; the edge of an inner film is fixed to the inner foundation structure; an inner cable net is arranged on the outer surface of the inner film; an accommodating cavity is defined between the inner film and the ground film, and the inner film comprises a metal layer; an outer film structure covers the outside of the inner film structure; the outer film structure comprises an outer film and an outer cable net; an interlayer cavity is defined between the outer film and the inner film; an air supply device is configured to inflate the interlayer cavity.
    Type: Application
    Filed: December 8, 2021
    Publication date: November 9, 2023
    Inventors: Qin WANG, Yonghui XIE, Yongliang GUO, Xiaoyong WANG, Feng YANG, Hui ZHANG, Zhixin TANG
  • Publication number: 20230356549
    Abstract: A sensor device includes a plurality of wires that are adapted to be disposed on an object, a control circuit that is electrically coupled to the wires, and a conductive member that is electrically coupled to the control circuit. Each of the wires has a detection section. The conductive member is operable to contact the detection sections of the wires. The detection sections are urged to move relative to the conductive member when the object is deformed, so that a quantity of the detection sections in contact with the conductive member varies with deformation of the object. When the conductive member is in contact with the detection section of any one of the wires, the conductive member and the one of the wires cooperatively form one closed circuit. The control circuit is adapted to transmit data of a quantity of the closed circuit to an external device.
    Type: Application
    Filed: May 2, 2023
    Publication date: November 9, 2023
    Applicants: Taiwan Green Point Enterprises Co., Ltd., Jabil Circuit (Singapore) Pte. Ltd.
    Inventors: Ching-Lung Mao, Chin-Feng Yang, Ming-Chung Chung, Huang-Keng Chen
  • Publication number: 20230362399
    Abstract: Methods, systems, and apparatus, including computer programs encoded on a computer storage medium, for jointly training an encoder that generates a watermark and a decoder that decodes a data item encoded within the watermark. The training comprises obtaining a plurality of training images and data items. For each training image, a first watermark is generated using an encoder and a subsequent second watermark is generated by tiling two or more first watermarks. The training image is watermarked using the second watermark to generate a first error value and distortions are added to the watermarked image. A distortion detector predicts the distortions based on which the distorted image is modified. The modified image is decoded by the decoder to generate a predicted data item and a second error value. The training parameters of the encoder and decoder are adjusted based on the first and the second error value.
    Type: Application
    Filed: January 11, 2022
    Publication date: November 9, 2023
    Inventors: Xiyang Luo, Feng Yang, Elnaz Barshan Tashnizi, Dake He, Ryan Matthew Haggarty, Michael Gene Goebel
  • Publication number: 20230350468
    Abstract: A rotation shaft assembly includes a connector, a first rotation shaft, a second rotation shaft, and a lock mechanism. The first rotation shaft is rotatably connected to the connector. The second rotation shaft is rotatably connected to the connector. The lock mechanism is arranged between the first rotation shaft and the second rotation shaft and is configured to switch a rotation of the first rotation shaft and a rotation of the second rotation shaft. In response to being at a first predetermined position, the rotation of the first rotation shaft is unlocked, and the rotation of the second rotation shaft is locked. In response to being at a second predetermined position, the rotation of the first rotation shaft is locked, and the rotation of the second rotation shaft is unlocked.
    Type: Application
    Filed: March 9, 2023
    Publication date: November 2, 2023
    Inventors: Feng YANG, Detao YOU
  • Patent number: 11804074
    Abstract: The present disclosure relates to a method for recognizing facial expressions based on adversarial elimination. First, a facial expression recognition network is built based on a deep convolutional neural network. On a natural facial expression data set, the facial expression recognition network is trained through a loss function to make facial expression features easier to distinguish. Then some key features of input images are actively eliminated by using an improved confrontation elimination method to generate a new data set to train new networks with different weight distributions and feature extraction capabilities, forcing the network to perform expression classification discrimination based on more features, which reduces the influence of interference factors such as occlusion on the network recognition accuracy rate, and improving the robustness of the facial expression recognition network.
    Type: Grant
    Filed: September 27, 2021
    Date of Patent: October 31, 2023
    Assignees: Chongqing University, University of Electronic Science and Technology of China, Dibi (Chongqing) Intelligent Technology Research Institute Co., Ltd., Star Institute of Intelligent Systems
    Inventors: Yongduan Song, Feng Yang, Rui Li, Yiwen Zhang, Haoyuan Zhong, Jian Zhang, Shengtao Pan, Siyu Li, Zhengtao Yu
  • Publication number: 20230343747
    Abstract: A semiconductor package including an improved isolation bonding film and methods of forming the same are disclosed. In an embodiment, a semiconductor device includes a first die bonded to a package substrate, the first die including vias extending through a substrate, the vias extending above a top surface of the substrate; a first dielectric film extending along a top surface of the package substrate, along the top surface of the substrate, and along sidewalls of the first die, the vias extending through the first dielectric film; a second die bonded to the first dielectric film and the vias; and an encapsulant over the package substrate, the first die, the first dielectric film, and the second die.
    Type: Application
    Filed: June 20, 2023
    Publication date: October 26, 2023
    Inventors: Ming-Tsu Chung, Ku-Feng Yang, Yung-Chi Lin, Wen-Chih Chiou, Chen-Hua Yu
  • Patent number: 11790564
    Abstract: Example embodiments allow for training of encoders (e.g., artificial neural networks (ANNs)) to facilitate dithering of images that have been subject to quantization in order to reduce the number of colors and/or size of the images. Such a trained encoder generates a dithering image from an input quantized image that can be combined, by addition or by some other process, with the quantized image to result in a dithered output image that exhibits reduced banding or is otherwise aesthetically improved relative to the un-dithered quantized image. The use of a trained encoder to facilitate dithering of quantized images allows the dithering to be performed in a known period of time using a known amount of memory, in contrast to alternative iterative dithering methods. Additionally, the trained encoder can be differentiable, allowing it to be part of a deep learning image processing pipeline or other machine learning pipeline.
    Type: Grant
    Filed: March 30, 2020
    Date of Patent: October 17, 2023
    Assignee: Google LLC
    Inventors: Innfarn Yoo, Xiyang Luo, Feng Yang
  • Publication number: 20230323500
    Abstract: A 780 MPa-grade ultra-high reaming steel having high surface quality and high performance stability, and a manufacturing method therefor. The ultra-high reaming steel comprises the following components in percentage by weight: 0.03-0.08% of C, Si?0.2%, 0.5-2.0% of Mn, P?0.02%, S?0.003%, 0.01-0.08% of Al, N?0.004%, 0.05-0.20% of Ti, 0.1-0.5% of Mo, Mg?0.005%, O?0.0030%, and the remainder being Fe and other inevitable impurities.
    Type: Application
    Filed: August 30, 2021
    Publication date: October 12, 2023
    Applicant: BAOSHAN IRON & STEEL CO., LTD.
    Inventors: Huanrong WANG, Feng YANG, Chen ZHANG, Ana YANG, Mingzhou BAI, Yaping NI, Ming WANG
  • Publication number: 20230322317
    Abstract: Disclosed are an electric bicycle parking pile and a parking lock structure thereof, including a mounting base, a movable rod and at least one lock rod extending outward along the width of the mounting base. The mounting base includes a first base plate and two first side plates extending upward from two opposite sides of the first base plate. The middle of each first side plate includes a chute extending along the height. A first reset spring on the outer surfaces of the first guide post and the second guide post can enlarge the adjustment range of the lock rod and the application range of the parking lock, and make the lock rod automatically return to the initial position. The lock lever includes a locking groove. There is a preset angle of inclination between the axis of the lock lever and the first base plate.
    Type: Application
    Filed: June 13, 2023
    Publication date: October 12, 2023
    Applicant: HUNAN XIBAODA INFORMATION TECHNOLOGY CO., LTD
    Inventors: Feng YANG, Xiaosong XUE
  • Publication number: 20230325959
    Abstract: Methods, systems, and apparatus, including computer programs encoded on a computer storage medium, for detecting and decoding a visually imperceptible or perceptible watermark. A watermark detection apparatus determines whether the particular image includes a visually imperceptible or perceptible watermark using detector a machine learning model. If the watermark detection apparatus detects a watermark, the particular image is routed to a watermark decoder. If the watermark detection apparatus cannot detect a watermark in the particular image, the particular image is filtered from further processing. The watermark decoder decodes the visually imperceptible or perceptible watermark detected in the particular image. After decoding, an item depicted in the particular image is validated based data extracted from the decoded visually imperceptible or perceptible watermark.
    Type: Application
    Filed: June 21, 2021
    Publication date: October 12, 2023
    Inventors: Dake He, Tianhao Zhang, Elnaz Barshan Tashnizi, Xiyang Luo, Huiwen Chang, Feng Yang, Ryan Matthew Haggarty
  • Publication number: 20230325961
    Abstract: Methods, systems, and apparatus, including computer programs encoded on a computer storage medium, for determining a visually imperceptible or a visually perceptible watermark and outputting a result based on the determination. A watermark decoder receives an input image. The watermark decoder applies a decoder machine learning model to decode a watermarks at different levels of zoom. The water mark decoder determines whether a watermark was decoded to obtain a decoded watermark. The watermark decoder outputs a result based on the determination whether the watermark was decoded through application of the decoder machine learning model to the input image that includes outputting a zoomed output decoded through application of the decoder machine learning model to the input image.
    Type: Application
    Filed: June 21, 2021
    Publication date: October 12, 2023
    Inventors: Dake He, Tianhao Zhang, Elnaz Barshan Tashnizi, Xiyang Luo, Huiwen Chang, Feng Yang, Ryan Matthew Haggarty
  • Publication number: 20230323502
    Abstract: A 980 MPa-grade full-bainite ultra-high hole expansion steel and a manufacturing method therefor. The hole expansion steel has the following chemical compositions in percentage by weight: 0.05-0.10% of C, Si?2.0%, 1.0-2.0% of Mn, P?0.02%, S?0.003%, 0.02-0.08% of Al, N?0.004%, 0.1-0.5% of Mo, 0.01-0.05% of Ti, O?0.0030%, the remainder being Fe, and other inevitable impurities. The ultra-high hole expansion steel in the present invention has yield strength ?800 MPa, tensile strength ?980 MPa, and a hole expansion rate up to 60% or more, and can be applied in the parts of chassis components such as a control arm and an auxiliary frame, which require high strength thinning and complex forming, of passenger vehicles.
    Type: Application
    Filed: August 30, 2021
    Publication date: October 12, 2023
    Applicant: BAOSHAN IRON & STEEL CO., LTD.
    Inventors: Huanrong WANG, Feng YANG, Chen ZHANG, Ana YANG, Yaping NI