Abstract: The present disclosure discloses a photographic expansion accessory and a photographic auxiliary apparatus. The photographic expansion accessory includes a camera base plate, which includes a plate body and a wrench. The plate body is defined with a battery avoiding port extending along a thickness direction of the plate body. The wrench is rotatably connected to the plate body, and the wrench defines a part of a side wall of the battery avoiding port.

Abstract: The present invention relates to the technical field of arable land improvement effect evaluation, and specifically discloses a method and system for evaluating modification effect of moderately to severely salinized farmland land. The method comprises receiving an arable land range input by an administrator, randomly selecting evaluation points within the arable land range, and determining the evaluation level of the evaluation points; obtaining evaluation data containing point tags and time tags based on evaluation equipment installed at the evaluation points, and constructing an evaluation data matrix containing the point tags; receiving an evaluation instruction input by the administrator, extracting row data from the evaluation data matrix based on the input time of the evaluation instruction, analyzing the extracted row data, and outputting an evaluation result; and synchronously training an evaluation model based on the evaluation result.

Abstract: This application discloses a camera module and an electronic device, and the disclosed camera module includes a housing, a first lens, a second lens, a photosensitive chip, and a first reflector all arranged in the housing, and the first reflector is able to be switched between a first position and a second position.

Abstract: A power electronics system for an electric motor includes a first inverter package having a first housing defining a first enclosure and MOSFET pairs disposed within the first enclosure, wherein an output of each MOSFET of each MOSFET pair are coupled together and operable to be electrically coupled to a first end of a winding of the electric motor. The power electronics system further includes a second inverter package having a second housing defining a second enclosure and three IGBT pairs disposed within the second enclosure, wherein an output of each IGBT of each IGBT pair are coupled together and operable to be electrically coupled to a second end of the winding of the electric motor, and the IGBT pairs are cooled by immersion within the dielectric cooling fluid. A state selector circuit is operable to selectively electrically couple the second ends of the windings of the electric motor together.

Abstract: The present disclosure provides a video processing method and apparatus, an electronic device, and a medium, and the method includes: acquiring a to-be-erased region including a to-be-erased object in each target video frame of a to-be-processed video; acquiring, for a single target video frame, acquiring, from another target video frame other than the target video frame, a target region that corresponds to a to-be-erased region of the target video frame and does not include the to-be-erased object; filling pixels of the target region into the to-be-erased region of the target video frame, to erase the to-be-erased region of the target video frame; and in response to an unerased region existing in the to-be-erased region of the target video frame, predicting pixels of the unerased region according to the target video frame, and filling the unerased region according to the predicted pixels to erase the unerased region.

Abstract: Various examples, systems, and methods are disclosed relating to a slicing pipeline. A first computing system can process, by a processing component of a system-on-chip (SoC), at least one first frame into a plurality of first slices based at least on a first slice parameter. The first computing system further can update at least one performance metric based at least on timing data corresponding with the processing of the plurality of first slices. The first computing system further can determine a second slice parameter based at least on the at least one performance metric. The first computing system further can apply, in real-time, the second slice parameter to the processing component to cause subsequence processing of at least one second frame into a plurality of second slices based at least on the second slice parameter.

Abstract: Disclosed are a heterocyclic compound, and an intermediate thereof, a preparation method therefor and the use thereof. Namely, provided are a heterocyclic compound as shown in formula I-a, and a tautomer and a pharmaceutically acceptable salt thereof, wherein the compound has a good water solubility and pharmacokinetic properties.

Abstract: A multi-air-gap magnetoresistance current sensor for alternating current-direct current and a current measurement method are provided, and the multi-air-gap magnetoresistance current sensor for alternating current-direct current includes: a magnetoelectric conversion unit, configured to obtain a magnetic field signal of a target current-carrying wire with to-be-measured current, convert the magnetic field signal into an electric signal, and output the electric signal to a signal processing unit, the magnetoelectric conversion unit adopts a multi-air-gap multi-band closed-loop iron core type structure; a signal processing unit, configured to amplify the electric signal and output the electric signal to a feedback compensation unit; and the feedback compensation unit, configured to adjust a feedback current according to the amplified voltage signal to enable the new magnetoresistance elements to operate at zero magnetic flux, measure a feedback current value, and obtain and output a value of to-be-measured curr

Abstract: A gallium nitride-based device comprises a substrate layer, a gallium nitride layer, and a barrier layer, wherein the barrier layer is provided with a gate P-type gallium nitride layer and a first gate metal layer, two sides of the gate P-type gallium nitride layer are provided with a source ohmic metal layer and a drain ohmic metal layer respectively, a source field plate metal layer and a drain field plate metal layer are connected to the source ohmic metal layer and the drain ohmic metal layer respectively, hole injection structures are disposed between the gate P-type gallium nitride layer and the drain ohmic metal layer, each hole injection structure comprises a rectangular P-type gallium nitride layer, a second gate metal layer, and an ohmic metal pillar, and the ohmic metal pillar is connected to the drain field plate metal layer.

Abstract: Systems and methods for reducing image signal processor (ISP) latency in video acquisition and processing pipelines. In at least one embodiment, processing circuitry is provided in a video acquisition and processing pipeline to perform intelligent slicing of video frames for reducing ISP latency. In at least one embodiment, the intelligent slicing determines slice pixel height based on camera information and an ISP clock rate.

Abstract: A method, computer program product, and receiver assembly. The receiver assembly may be created, wherein creating the receiver assembly may include placing a printed circuit board (PCB) coil pad of a PCB inside a cavity of a non-metal enclosure. Creating the receiver assembly may include placing a mesh frame on top of the PCB coil pad. Creating the receiver assembly may include placing one or more ferrite plates on top of the PCB coil pad based upon, at least in part, a configuration of the mesh frame. Creating the receiver assembly may include placing an insert on top of the one or more ferrite plates. Creating the receiver assembly may include placing a rectifier on top of the insert, wherein the rectifier may be connected to the PCB coil pad inside the cavity of the non-metal enclosure.

Abstract: A resistive random access memory (RRAM) memory cell structure includes a transistor formed on a semiconductor substrate and includes a source region, a drain region and a gate, a lower electrode disposed over the semiconductor substrate and electrically connected to the drain region, a source line electrically connected to the source region, a word line electrically connected to the gate, first and second blocks of resistive switching dielectric material electrically connected to the lower electrode, a first upper electrode electrically connected to the first block of resistive switching dielectric material, a second upper electrode electrically connected to the second block of resistive switching dielectric material, and first and second bit lines electrically connected to the first and second upper electrodes respectively. The first bit line and the second bit line are electrically isolated from each other except for the first and second blocks of resistive switching dielectric material.

Abstract: Embodiments are directed to an electronic-cell assembly, including a metal layer and a single-layer graphite layer. The metal layer encases the single-layer graphite layer. The single-layer graphite layer comprises a center graphite piece having a bow-tie shape and two side graphite pieces having a trapezoid shape contacted with the center graphite piece. The single-layer graphite layer has a height along a first axis and a width along a second axis. The first axis is perpendicular to the second axis. The height is greater than the width.

Abstract: Devices and methods for thermal management are provided. The device comprises one or more thermally conducting regions, and each thermal conducting region includes a composite material containing thermally conductive fillers that are capable of being oriented in a direction by applying an external force. The method includes steps of forming each thermal conducting region and thereby forming a thermal management device with designed anisotropic thermal conductivity.

Abstract: A method for manufacturing an integrated power electronics (IPEs) embedded printed circuit board (PCB) assembly may include providing a dielectric panel having a first plurality of openings configured to receive power devices and a second plurality of openings configured to receive thermal slugs. The method may include inserting power devices into the first plurality of openings and thermal slugs into the second plurality of openings. The method may include securing a multi-layer printed circuit board (PCB) structure to the dielectric panel having the inserted power devices and thermal slugs. The method may include securing a cold plate panel to the dielectric panel opposite the multi-later PCB structure to form an integrated power electronics fabrication panel.

Abstract: The present disclosure provides a quick-release assembly, a connection structure, a photography accessory, and a quick-release kit. The quick-release assembly includes: a mounting base, a top end thereof being defined with a fixing slot, a bottom end thereof being defined with an accommodation slot, a limiting groove being defined in a bottom wall, an opening at one end of the limiting groove being communicated with the accommodation slot, and an opening at the other end of the limiting groove being communicated with the fixing slot; a sliding member slidably accommodated in the accommodation slot; and a resisting member received in the limiting groove. After assembly, one end of the resisting member abuts against the sliding member, and the other end of the resisting member extends out of a bottom wall surface of the fixing slot.

Abstract: Embodiments herein are direct to a method for fabricating a substrate with graphite embedded for customized heat spreading that includes bonding a plurality of graphite members having a planar orientation into a single-layer plate arrangement, the plurality of graphite members are arranged such that one of the plurality of graphite members has a high thermal conductivity in a lateral direction and a low thermal conductivity in a longitudinal direction and at least two of the plurality of graphite members each have a high thermal conductivity in the longitudinal direction and a low thermal conductivity in the lateral direction, bonding the single layer plate arrangement into a recess, and positioning a cover member in a closed state to enclose the single layer plate arrangement.