Patents by Inventor Feng Zhou

Feng Zhou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20260162718
    Abstract: Numerous examples are disclosed of systems and methods for operating one or more arrays of resistive random access memory (RRAM) cells. In one example, a read bias generator comprises a bias transistor, a feedback loop, a replica resistor, and a reference unit. Optionally, the read bias generator is coupled to an array of RRAM units.
    Type: Application
    Filed: February 10, 2026
    Publication date: June 11, 2026
    Inventors: Hieu Van Tran, Hoa Vu, Thuan Vu, Kha Nguyen, Anh Ly, Feng Zhou, Hien Pham
  • Publication number: 20260164549
    Abstract: A printed circuit board includes a cold plate and a diamond-based core layer bonded to the cold plate. The diamond-based core layer includes a diamond substrate with a conductive doped cave and a bare die disposed in and bonded to the conductive doped cave. Also, a circuit board layer with a conductive pattern is bonded to the diamond-based core layer and conductive through vias extend through the circuit board layer and are in direct contact with the bare die and the conductive doped cave.
    Type: Application
    Filed: December 11, 2024
    Publication date: June 11, 2026
    Inventors: Yohei Iwahashi, Feng Zhou, Tianzhu Fan, Shailesh N. Joshi, Ercan Mehmet Dede
  • Publication number: 20260164565
    Abstract: A method for fabricating a conductive through via includes mixing metal formate with a solvent and forming a metal formate—solvent solution, adjusting a concentration of the metal formate—solvent solution and forming a refined metal formate—solvent solution, and mixing the refined metal formate—solvent solution with metal particles and forming a metal particle—metal formate slurry. The method also includes filling a via in a substrate with the metal particle—metal formate slurry and low temperature sintering the metal particle—metal formate slurry and forming a large diameter conductive through via in the substrate.
    Type: Application
    Filed: December 10, 2024
    Publication date: June 11, 2026
    Inventors: Feng Zhou, Tianzhu Fan, Shailesh N. Joshi, Yanghe Liu, Ercan Mehmet Dede
  • Publication number: 20260133709
    Abstract: This application relates to the field of cloud computing technologies and provides a cloud disk service change recommendation method and apparatus. An example method is applied to a cloud management platform configured to manage infrastructure that provides a cloud service. The infrastructure includes a storage pool including storage space of a plurality of cloud servers. The storage pool is virtually divided into a plurality of cloud disks. The method includes obtaining running data of a first cloud disk in the plurality of cloud disks. The running data of the first cloud disk includes a flow control parameter and capacity usage. The method further includes determining a change policy for the first cloud disk based on the running data of the first cloud disk and providing a recommendation interface for a tenant of the first cloud disk. The recommendation interface includes the change policy.
    Type: Application
    Filed: January 6, 2026
    Publication date: May 14, 2026
    Applicant: Huawei Cloud Computing Technologies Co., Ltd.
    Inventors: Wentao Tang, Jianhua Zhou, Yongqiang Zeng, Xuefeng Yan, Feng Zhou
  • Patent number: 12625417
    Abstract: A mounting and dismounting assembly is provided, which includes a first fixing member including a base plate with one end provided with an inserting post with a first clamping part and the other end provided with a first connecting part; and a second fixing member including a bottom shell and at least one slider located in the bottom shell. An end of the bottom shell facing the base plate is provided with a first inserting hole for accommodating the inserting post, and an end of the bottom shell away from the base plate is provided with a second connecting part. The slider is located at a peripheral side of the inserting post and slidably connected with the bottom shell. A second clamping part clamped with the first clamping part, and an elastic piece connected with an inner side wall of the bottom shell are provided.
    Type: Grant
    Filed: January 25, 2024
    Date of Patent: May 12, 2026
    Assignee: SHENZHEN LEQI INNOVATION CO., LTD.
    Inventors: Feng Zhou, Keman Yan
  • Patent number: 12626971
    Abstract: A coolant manifold assembly is provided. The coolant manifold assembly may include a manifold body having a coolant delivering channel delivering coolant to a charging module fluidly communicating with the coolant delivering channel, and a coolant receiving channel receiving the coolant from the charging module fluidly communicating with the coolant receiving channel. The coolant manifold further include a bus bar disposed on the manifold body, the bus bar transmits power received from the charging module to a battery.
    Type: Grant
    Filed: June 2, 2022
    Date of Patent: May 12, 2026
    Assignees: Toyota Motor Engineering & Manufacturing North America, Inc., Toyota Jidosha Kabushiki Kaisha
    Inventors: Yanghe Liu, Feng Zhou, Hiroshi Ukegawa
  • Patent number: 12624041
    Abstract: Disclosed is a heterocyclic compound as represented by formula (I), a tautomer thereof, or a pharmaceutically acceptable salt thereof. The compound has better inhibitory activity on TRPC5, has good metabolic stability in liver micro-particles, and has good clinical pharmacokinetic properties.
    Type: Grant
    Filed: June 23, 2021
    Date of Patent: May 12, 2026
    Assignee: WUHAN LL SCIENCE AND TECHNOLOGY DEVELOPMENT CO., LTD.
    Inventors: Jinping Li, Xiaodan Guo, Feng Zhou, Jun Lou, Li Liu, Xiaoya Chen, Yihan Zhang, Yongkai Chen, Chaodong Wang
  • Publication number: 20260123447
    Abstract: A method for manufacturing an asymmetric chip-embedded printed circuit board (PCB) includes bonding a bare die to a heat spreader and bonding the heat spreader to a cold plate. The method further includes forming an electrically conductive layer on a glass substrate, etching a conductive pattern on the glass substrate, forming through conductive vias in the glass substrate, and bonding a first surface of the glass substrate to the cold plate. The method further includes bonding a plurality of additional glass substrates with conductive patterns to a second side of the glass substrate and forming through conductive vias in the plurality of additional glass substrates such that an asymmetric glass-based chip-embedded printed circuit board is formed.
    Type: Application
    Filed: October 30, 2024
    Publication date: April 30, 2026
    Inventors: Tianzhu Fan, Feng Zhou, Shailesh N. Joshi, Yohei Iwahashi, Ercan Mehmet Dede
  • Patent number: 12615747
    Abstract: Embodiments are directed to an electronic-cell assembly. The electronic-cell assembly includes an heat spreader and a power electronics device. The heat spreader includes a metal layer and a single-layer graphite layer. The metal layer encases the single-layer graphite layer and defines a power device recess in an outer surface of the metal layer. The single-layer graphite layer includes three or more adjacent graphite pieces having high thermal conductivity along a thickness direction. The power electronics device is disposed within the power device recess of the outer surface of the heat spreader. At least one of the graphite pieces has low thermal conductivity along a first axis and the high thermal conductivity along a second axis. The first axis and the second axis are perpendicular to the thickness direction. At least one of the graphite pieces has the high thermal conductivity along the first axis and the low thermal conductivity along the second axis.
    Type: Grant
    Filed: January 5, 2024
    Date of Patent: April 28, 2026
    Assignee: Toyota Motor Engineering & Manufacturing North America, Inc.
    Inventors: Tianzhu Fan, Feng Zhou
  • Publication number: 20260114299
    Abstract: A semiconductor device includes an interface between first and second chiplets that comprises data lines and a redundant data line. The first and second chiplets include input/output modules each electrically coupled to one of the data lines. Each input/output module of the first chiplet is configured to send data over its corresponding data line to the corresponding input/output module of the second chiplet. In the case of a faulty data line, the corresponding one input/output module can reroute its data to a second input/output module for transmission over its data line, and the second input/output module can reroute its data to a third input/output module for transmission over its data line, and so on, until the last input/output module can reroute its data to the redundant data line for transmission over the redundant data line.
    Type: Application
    Filed: January 15, 2025
    Publication date: April 23, 2026
    Inventors: Derkant Cheng, TING-HAO CHANG, FENG ZHOU, LORENZO BEDARIDA, SIMONE BARTOLI, SHIJUN QI, FRANCIS LIU, CHAO-YU LIU
  • Publication number: 20260104298
    Abstract: An ear temperature detection device, which comprises a first heating element and a second heating element. Under the control of a control unit, the first heating element is configured to heat a front end of an infrared detection module, and the second heating element is configured to heat a rear end of the infrared detection module. By heating both the front and rear ends, the overall temperature of the infrared detection module in the direction of infrared incidence (i.e., the front-to-rear direction of the infrared detection module) is made more uniform, reducing or eliminating the temperature gradient issue within the infrared detection module, thereby improving the measurement accuracy of the infrared detection module.
    Type: Application
    Filed: October 9, 2025
    Publication date: April 16, 2026
    Inventors: Zhuodong LI, Feng ZHOU
  • Patent number: 12603425
    Abstract: Embodiments of the present disclosure relate to a coupler, antenna module and electronic device. The coupler comprises a first substrate layer and a second substrate layer located below the first substrate layer. The coupler also comprises a first coupling line located on an upper surface of the first substrate layer and a second coupling line located on a lower surface of the second substrate layer. The coupler further comprises a first ground layer located between a lower surface of the first substrate layer and an upper surface of the second substrate layer, a plurality of hole groups being formed in the first ground layer and being geometrically designed such that an electromagnetic field of the first coupling line is coupled to the second coupling line through the plurality of hole groups. In this way, PCB space and size may be saved, RF performance may be improved, and PCB cost may be reduced.
    Type: Grant
    Filed: October 25, 2021
    Date of Patent: April 14, 2026
    Assignee: NOKIA SOLUTIONS AND NETWORKS OY
    Inventors: Yuanhao Wang, Hao Wang, Li Miao, Cheng Li, Feng Zhou
  • Publication number: 20260088754
    Abstract: A system and method for phase-change cooling and thermal management includes electrically coupling an evaporation apparatus to an external circuit, wherein the evaporation apparatus includes a top planar layer including a top electrode, a bottom planar layer including a bottom electrode, and an evaporation layer between the top planar layer and the bottom planar layer, thermally coupling the evaporation apparatus to a heat source, and monitoring, using the external circuit, an operation status of the evaporation apparatus. The evaporation layer includes a carbon structure. The carbon structure is electrically coupled to the top electrode and the bottom electrode. Water is vaporized at a surface of the carbon structure.
    Type: Application
    Filed: September 26, 2024
    Publication date: March 26, 2026
    Applicants: Toyota Motor Engineering & Manufacturing North America, Inc., Toyota Jidosha Kabushiki Kaisha
    Inventors: Tianzhu Fan, Shailesh Joshi, Feng Zhou, Yohei Iwahashi, Ercan M. Dede
  • Patent number: 12585175
    Abstract: The present disclosure discloses a camera base plate, which includes a plate body and a wrench. The plate body is defined with a battery avoiding port corresponding to an opening of a battery compartment of a camera. The battery avoiding port extends along a thickness direction of the plate body. The wrench is rotatably connected to the plate body through a damping assembly, and the wrench defines a part of a side wall of the battery avoiding port. In the present disclosure, the wrench can rotate to be gradually opened so as to define a gap in the battery avoiding port. After the plate at the opening of the camera's battery compartment is fully opened, a portion of the plate extends into the gap, thereby the plate can be opened completely, such that the battery can be removed or placed without detaching the camera from the camera base plate.
    Type: Grant
    Filed: November 17, 2023
    Date of Patent: March 24, 2026
    Assignee: SHENZHEN LEQI INNOVATION CO., LTD.
    Inventors: Feng Zhou, Liuyin Wang
  • Publication number: 20260081473
    Abstract: In an embodiment, a wireless power transmitter of a wireless charging system may detect an amplitude shift keying (ASK) carrier signal sent by a wireless power receiver of the wireless charging system, attenuate the ASK carrier signal, and clamp the attenuated ASK carrier signal to a predetermined signal strength range. The wireless power transmitter may detect peak values of the clamped signal, and generate a zero-crossing signal representing zero-crossing points of the clamped signal. The wireless power transmitter may sample the peak values of the clamped signal at timing instants determined by the zero-crossing signal to produce a demodulated ASK envelope signal of the ASK carrier signal.
    Type: Application
    Filed: November 20, 2025
    Publication date: March 19, 2026
    Inventors: Rui Liu, Lijie Zhao, Feng Zhou
  • Patent number: 12581960
    Abstract: A method for manufacturing a power device fabrication panel includes aligning a first alignment mark in a lead frame of a power device substrate array with a second alignment mark in a bonding fixture. The power device substrate array includes a plurality of power device pockets, the bonding fixture includes a plurality of power device openings, and the power device openings are in assembly alignment with the power device pockets when the first alignment mark is aligned with the second alignment mark. And with the bonding fixture power device openings in assembly alignment with the power device pockets of the power device substrate array, a plurality of power devices are moved at least partially through the aligned power device openings and into the power device pockets where they are bonded.
    Type: Grant
    Filed: March 29, 2023
    Date of Patent: March 17, 2026
    Assignee: Toyota Motor Engineering & Manufacturing North America, Inc.
    Inventors: Feng Zhou, Tianzhu Fan, Jae Seung Lee
  • Publication number: 20260072941
    Abstract: A data synchronization method implemented by a terminal device includes a first application and a second application. The first application does not have data access permission of a wearable device, and the second application has the data access permission of the wearable device. When a user performs a data synchronization operation on the first application, the first application may start the second application. After the second application starts, the second application may send a data synchronization request to a firmware program of the wearable device, to request the firmware program of the wearable device to synchronize data of the wearable device to the second application. Then, the second application synchronizes, to the first application, the data synchronized by the firmware program of the wearable device.
    Type: Application
    Filed: November 12, 2025
    Publication date: March 12, 2026
    Applicant: Huawei Technologies Co., Ltd.
    Inventors: Qiaosen Wang, Feng Zhou, Yexin Bai
  • Patent number: 12570652
    Abstract: Disclosed are a pyrrolidine compound as represented by formula (I) or a pharmaceutically acceptable salt thereof, a pharmaceutical composition containing same, and the use of the pharmaceutical composition as a selective estrogen receptor degrader (SERD) in the prevention or treatment of estrogen receptor-related diseases.
    Type: Grant
    Filed: May 14, 2021
    Date of Patent: March 10, 2026
    Assignees: SIMCERE PHARMACEUTICAL CO., LTD., JIANGSU SIMCERE PHARMACEUTICAL CO., LTD.
    Inventors: Peng Gu, Lei Liu, Guobao Zhang, Feng Zhou, Renhong Tang, Jinsheng Ren
  • Patent number: D1123662
    Type: Grant
    Filed: December 23, 2024
    Date of Patent: April 28, 2026
    Assignee: NANJING PRIME SEMICONDUCTOR CO., LTD.
    Inventors: Panjun Lei, Zhipeng Zhan, Feng Zhou
  • Patent number: D1126620
    Type: Grant
    Filed: December 9, 2022
    Date of Patent: May 19, 2026
    Assignee: Changzhou Yooksmart Innovation Co., Ltd.
    Inventors: Feng Zhou, Hongfei Nie