Abstract: A gallium nitride-based device comprises a substrate layer, a gallium nitride layer, and a barrier layer, wherein the barrier layer is provided with a gate P-type gallium nitride layer and a first gate metal layer, two sides of the gate P-type gallium nitride layer are provided with a source ohmic metal layer and a drain ohmic metal layer respectively, a source field plate metal layer and a drain field plate metal layer are connected to the source ohmic metal layer and the drain ohmic metal layer respectively, hole injection structures are disposed between the gate P-type gallium nitride layer and the drain ohmic metal layer, each hole injection structure comprises a rectangular P-type gallium nitride layer, a second gate metal layer, and an ohmic metal pillar, and the ohmic metal pillar is connected to the drain field plate metal layer.

Abstract: Systems and methods for reducing image signal processor (ISP) latency in video acquisition and processing pipelines. In at least one embodiment, processing circuitry is provided in a video acquisition and processing pipeline to perform intelligent slicing of video frames for reducing ISP latency. In at least one embodiment, the intelligent slicing determines slice pixel height based on camera information and an ISP clock rate.

Abstract: A method, computer program product, and receiver assembly. The receiver assembly may be created, wherein creating the receiver assembly may include placing a printed circuit board (PCB) coil pad of a PCB inside a cavity of a non-metal enclosure. Creating the receiver assembly may include placing a mesh frame on top of the PCB coil pad. Creating the receiver assembly may include placing one or more ferrite plates on top of the PCB coil pad based upon, at least in part, a configuration of the mesh frame. Creating the receiver assembly may include placing an insert on top of the one or more ferrite plates. Creating the receiver assembly may include placing a rectifier on top of the insert, wherein the rectifier may be connected to the PCB coil pad inside the cavity of the non-metal enclosure.

Abstract: A resistive random access memory (RRAM) memory cell structure includes a transistor formed on a semiconductor substrate and includes a source region, a drain region and a gate, a lower electrode disposed over the semiconductor substrate and electrically connected to the drain region, a source line electrically connected to the source region, a word line electrically connected to the gate, first and second blocks of resistive switching dielectric material electrically connected to the lower electrode, a first upper electrode electrically connected to the first block of resistive switching dielectric material, a second upper electrode electrically connected to the second block of resistive switching dielectric material, and first and second bit lines electrically connected to the first and second upper electrodes respectively. The first bit line and the second bit line are electrically isolated from each other except for the first and second blocks of resistive switching dielectric material.

Abstract: Embodiments are directed to an electronic-cell assembly, including a metal layer and a single-layer graphite layer. The metal layer encases the single-layer graphite layer. The single-layer graphite layer comprises a center graphite piece having a bow-tie shape and two side graphite pieces having a trapezoid shape contacted with the center graphite piece. The single-layer graphite layer has a height along a first axis and a width along a second axis. The first axis is perpendicular to the second axis. The height is greater than the width.

Abstract: Devices and methods for thermal management are provided. The device comprises one or more thermally conducting regions, and each thermal conducting region includes a composite material containing thermally conductive fillers that are capable of being oriented in a direction by applying an external force. The method includes steps of forming each thermal conducting region and thereby forming a thermal management device with designed anisotropic thermal conductivity.

Abstract: A method for manufacturing an integrated power electronics (IPEs) embedded printed circuit board (PCB) assembly may include providing a dielectric panel having a first plurality of openings configured to receive power devices and a second plurality of openings configured to receive thermal slugs. The method may include inserting power devices into the first plurality of openings and thermal slugs into the second plurality of openings. The method may include securing a multi-layer printed circuit board (PCB) structure to the dielectric panel having the inserted power devices and thermal slugs. The method may include securing a cold plate panel to the dielectric panel opposite the multi-later PCB structure to form an integrated power electronics fabrication panel.

Abstract: The present disclosure provides a quick-release assembly, a connection structure, a photography accessory, and a quick-release kit. The quick-release assembly includes: a mounting base, a top end thereof being defined with a fixing slot, a bottom end thereof being defined with an accommodation slot, a limiting groove being defined in a bottom wall, an opening at one end of the limiting groove being communicated with the accommodation slot, and an opening at the other end of the limiting groove being communicated with the fixing slot; a sliding member slidably accommodated in the accommodation slot; and a resisting member received in the limiting groove. After assembly, one end of the resisting member abuts against the sliding member, and the other end of the resisting member extends out of a bottom wall surface of the fixing slot.

Abstract: Embodiments herein are direct to a method for fabricating a substrate with graphite embedded for customized heat spreading that includes bonding a plurality of graphite members having a planar orientation into a single-layer plate arrangement, the plurality of graphite members are arranged such that one of the plurality of graphite members has a high thermal conductivity in a lateral direction and a low thermal conductivity in a longitudinal direction and at least two of the plurality of graphite members each have a high thermal conductivity in the longitudinal direction and a low thermal conductivity in the lateral direction, bonding the single layer plate arrangement into a recess, and positioning a cover member in a closed state to enclose the single layer plate arrangement.

Abstract: A system for continuous testing of array device includes a first host computer and a probe station. The first host computer sends a scanning path to the probe station to control the probe station to perform scanning test on an array device to be tested; a tray of the probe station moves along path points set by the scanning path; after reaching a specified position, the tray moves upwards to connect a probe to an electrode of the array device to be tested; an electronic test apparatus tests the array device to be tested according to test instruction from a second host computer, and the foregoing process is repeated until all electrodes of the array device to be tested are tested.

Abstract: Embodiments herein are directed to a cooling system that includes a heat-generating device and a cooler loop assembly. The cooler loop assembly includes a capillary loop thermally coupled to the heat-generating device, a pump loop, and a secondary loop. The pump loop is fluidly coupled to the capillary loop. A pump is configured to move a cooling fluid through the pump loop and the capillary loop to cool the heat-generating device. A vaporized cooling fluid generated by the cooling of the heat-generating device is vented. The secondary loop has a liquid jet ejector pump. The secondary loop is fluidly coupled to the capillary loop such that the vaporized cooling fluid vented by the capillary loop is received by the liquid jet ejector pump. The vaporized cooling fluid is combined with the cooling fluid within the liquid jet ejector pump to circulate the cooling fluid through the secondary loop.

Abstract: Various arrangements described herein relate to an improved package design for power electronics. In one embodiment, a die package is disclosed. The die package includes a substrate. The substrate including a top-side copper trace, including a cutout. The substrate further includes a bottom-side copper trace. The substrate also includes a ceramic layer sandwiched between the top-side copper trace and the bottom-side copper trace. The die package includes a die mounted within the cutout to the top-side copper trace.

Abstract: A printed circuit board includes a cold plate, a diamond-based core layer bonded to the cold plate, and a at least one circuit board layer with a predefined conductive pattern bonded to the diamond-based core layer. The diamond-based core layer includes a diamond substrate with a cave, a bare die disposed in and bonded to the cave, and conductive through vias extend through the at least one circuit board layer and are in direct contact with the bare die.

Abstract: A vibration energy harvest device includes two or more slidably coupled stages, each stage comprising a base end and an extended end, at least one stage comprising a piezoelectric unit comprising two electrode layers and a piezoelectric layer sandwiched by the two electrode layers, and wherein the stages are configured to slide against one or more neighbor stages to switch between an extended mode and a stacked mode.

Abstract: The present disclosure relates to a multimedia resource processing method and apparatus, a device, and a medium. The method includes: acquiring a multimedia editing draft to be composited, where the multimedia editing draft includes an initial multimedia resource and editing information; performing segmentation processing on the multimedia editing draft to obtain a plurality of draft segments; for the plurality of draft segments, performing composite processing on the different draft segments using different processors to obtain target multimedia resource segments corresponding to the plurality of draft segments; and compositing the plurality of target multimedia resource segments to obtain a target multimedia resource corresponding to the multimedia editing draft, where the target multimedia resource is a multimedia resource obtained after an editing operation indicated by the editing information is performed on the initial multimedia resource.

Abstract: A method for high volume manufacture of highly integrated power electronics embedded printed circuit board (PCB)-cold plate assemblies includes bonding a power device fabrication panel to a multi-layer PCB, drilling via passageways in the multi-layer PCB, and electroplating a conductive metal into the vias before bonding the power device fabrication panel to a plurality of cold plates and forming an IPEs embedded PCB-cold plate fabrication panel. The method also includes cutting the IPEs embedded PCB-cold plate fabrication panel into a plurality of highly IPEs embedded PCB-cold plate assemblies.

Abstract: Numerous examples are disclosed of systems and methods for operating one or more arrays of resistive random access memory (RRAM) cells. In one example, a system comprises an array of resistive random access memory (RRAM) units arranged in rows and columns; and a sense amplifier for determining a differential value stored in a first RRAM unit and a second RRAM unit in the array, wherein the first RRAM unit comprises a first select transistor coupled to a first set of one or more RRAM cells and the second RRAM unit comprises a second select transistor coupled to a second set of one or more RRAM cells.

Abstract: This application relates to the technical field of seats, particularly to a chair with armrests. The stool board is rotatably connected to an armrest frame on at least one side. The armrest frame comprises connecting parts arranged side by side and a middle part arranged between the connecting parts. Each connecting part is movably provided with a corresponding base, which is arranged on the stool board. The base comprises support pieces arranged side by side on the stool board and connecting pieces arranged side by side on the inner side of the support pieces. The end of the connecting part is rotatably connected between two of the connecting pieces in a positionable manner.

Abstract: Numerous examples are disclosed of systems and methods for operating one or more arrays of resistive random access memory (RRAM) cells. In one example, a read bias generator comprises a bias transistor, a feedback loop, a replica resistor, and a reference unit. Optionally, the read bias generator is coupled to an array of RRAM units.