Abstract: Various arrangements described herein relate to an improved package design for power electronics. In one embodiment, a die package is disclosed. The die package includes a substrate. The substrate including a top-side copper trace, including a cutout. The substrate further includes a bottom-side copper trace. The substrate also includes a ceramic layer sandwiched between the top-side copper trace and the bottom-side copper trace. The die package includes a die mounted within the cutout to the top-side copper trace.

Abstract: A printed circuit board includes a cold plate, a diamond-based core layer bonded to the cold plate, and a at least one circuit board layer with a predefined conductive pattern bonded to the diamond-based core layer. The diamond-based core layer includes a diamond substrate with a cave, a bare die disposed in and bonded to the cave, and conductive through vias extend through the at least one circuit board layer and are in direct contact with the bare die.

Abstract: A vibration energy harvest device includes two or more slidably coupled stages, each stage comprising a base end and an extended end, at least one stage comprising a piezoelectric unit comprising two electrode layers and a piezoelectric layer sandwiched by the two electrode layers, and wherein the stages are configured to slide against one or more neighbor stages to switch between an extended mode and a stacked mode.

Abstract: The present disclosure relates to a multimedia resource processing method and apparatus, a device, and a medium. The method includes: acquiring a multimedia editing draft to be composited, where the multimedia editing draft includes an initial multimedia resource and editing information; performing segmentation processing on the multimedia editing draft to obtain a plurality of draft segments; for the plurality of draft segments, performing composite processing on the different draft segments using different processors to obtain target multimedia resource segments corresponding to the plurality of draft segments; and compositing the plurality of target multimedia resource segments to obtain a target multimedia resource corresponding to the multimedia editing draft, where the target multimedia resource is a multimedia resource obtained after an editing operation indicated by the editing information is performed on the initial multimedia resource.

Abstract: A method for high volume manufacture of highly integrated power electronics embedded printed circuit board (PCB)-cold plate assemblies includes bonding a power device fabrication panel to a multi-layer PCB, drilling via passageways in the multi-layer PCB, and electroplating a conductive metal into the vias before bonding the power device fabrication panel to a plurality of cold plates and forming an IPEs embedded PCB-cold plate fabrication panel. The method also includes cutting the IPEs embedded PCB-cold plate fabrication panel into a plurality of highly IPEs embedded PCB-cold plate assemblies.

Abstract: Numerous examples are disclosed of systems and methods for operating one or more arrays of resistive random access memory (RRAM) cells. In one example, a system comprises an array of resistive random access memory (RRAM) units arranged in rows and columns; and a sense amplifier for determining a differential value stored in a first RRAM unit and a second RRAM unit in the array, wherein the first RRAM unit comprises a first select transistor coupled to a first set of one or more RRAM cells and the second RRAM unit comprises a second select transistor coupled to a second set of one or more RRAM cells.

Abstract: This application relates to the technical field of seats, particularly to a chair with armrests. The stool board is rotatably connected to an armrest frame on at least one side. The armrest frame comprises connecting parts arranged side by side and a middle part arranged between the connecting parts. Each connecting part is movably provided with a corresponding base, which is arranged on the stool board. The base comprises support pieces arranged side by side on the stool board and connecting pieces arranged side by side on the inner side of the support pieces. The end of the connecting part is rotatably connected between two of the connecting pieces in a positionable manner.

Abstract: Numerous examples are disclosed of systems and methods for operating one or more arrays of resistive random access memory (RRAM) cells. In one example, a read bias generator comprises a bias transistor, a feedback loop, a replica resistor, and a reference unit. Optionally, the read bias generator is coupled to an array of RRAM units.

Abstract: A printed circuit board includes a cold plate and a diamond-based core layer bonded to the cold plate. The diamond-based core layer includes a diamond substrate with a conductive doped cave and a bare die disposed in and bonded to the conductive doped cave. Also, a circuit board layer with a conductive pattern is bonded to the diamond-based core layer and conductive through vias extend through the circuit board layer and are in direct contact with the bare die and the conductive doped cave.

Abstract: A method for fabricating a conductive through via includes mixing metal formate with a solvent and forming a metal formate—solvent solution, adjusting a concentration of the metal formate—solvent solution and forming a refined metal formate—solvent solution, and mixing the refined metal formate—solvent solution with metal particles and forming a metal particle—metal formate slurry. The method also includes filling a via in a substrate with the metal particle—metal formate slurry and low temperature sintering the metal particle—metal formate slurry and forming a large diameter conductive through via in the substrate.

Abstract: This application relates to the field of cloud computing technologies and provides a cloud disk service change recommendation method and apparatus. An example method is applied to a cloud management platform configured to manage infrastructure that provides a cloud service. The infrastructure includes a storage pool including storage space of a plurality of cloud servers. The storage pool is virtually divided into a plurality of cloud disks. The method includes obtaining running data of a first cloud disk in the plurality of cloud disks. The running data of the first cloud disk includes a flow control parameter and capacity usage. The method further includes determining a change policy for the first cloud disk based on the running data of the first cloud disk and providing a recommendation interface for a tenant of the first cloud disk. The recommendation interface includes the change policy.

Abstract: A mounting and dismounting assembly is provided, which includes a first fixing member including a base plate with one end provided with an inserting post with a first clamping part and the other end provided with a first connecting part; and a second fixing member including a bottom shell and at least one slider located in the bottom shell. An end of the bottom shell facing the base plate is provided with a first inserting hole for accommodating the inserting post, and an end of the bottom shell away from the base plate is provided with a second connecting part. The slider is located at a peripheral side of the inserting post and slidably connected with the bottom shell. A second clamping part clamped with the first clamping part, and an elastic piece connected with an inner side wall of the bottom shell are provided.

Abstract: A coolant manifold assembly is provided. The coolant manifold assembly may include a manifold body having a coolant delivering channel delivering coolant to a charging module fluidly communicating with the coolant delivering channel, and a coolant receiving channel receiving the coolant from the charging module fluidly communicating with the coolant receiving channel. The coolant manifold further include a bus bar disposed on the manifold body, the bus bar transmits power received from the charging module to a battery.

Abstract: Disclosed is a heterocyclic compound as represented by formula (I), a tautomer thereof, or a pharmaceutically acceptable salt thereof. The compound has better inhibitory activity on TRPC5, has good metabolic stability in liver micro-particles, and has good clinical pharmacokinetic properties.

Abstract: A method for manufacturing an asymmetric chip-embedded printed circuit board (PCB) includes bonding a bare die to a heat spreader and bonding the heat spreader to a cold plate. The method further includes forming an electrically conductive layer on a glass substrate, etching a conductive pattern on the glass substrate, forming through conductive vias in the glass substrate, and bonding a first surface of the glass substrate to the cold plate. The method further includes bonding a plurality of additional glass substrates with conductive patterns to a second side of the glass substrate and forming through conductive vias in the plurality of additional glass substrates such that an asymmetric glass-based chip-embedded printed circuit board is formed.

Abstract: Embodiments are directed to an electronic-cell assembly. The electronic-cell assembly includes an heat spreader and a power electronics device. The heat spreader includes a metal layer and a single-layer graphite layer. The metal layer encases the single-layer graphite layer and defines a power device recess in an outer surface of the metal layer. The single-layer graphite layer includes three or more adjacent graphite pieces having high thermal conductivity along a thickness direction. The power electronics device is disposed within the power device recess of the outer surface of the heat spreader. At least one of the graphite pieces has low thermal conductivity along a first axis and the high thermal conductivity along a second axis. The first axis and the second axis are perpendicular to the thickness direction. At least one of the graphite pieces has the high thermal conductivity along the first axis and the low thermal conductivity along the second axis.

Abstract: A semiconductor device includes an interface between first and second chiplets that comprises data lines and a redundant data line. The first and second chiplets include input/output modules each electrically coupled to one of the data lines. Each input/output module of the first chiplet is configured to send data over its corresponding data line to the corresponding input/output module of the second chiplet. In the case of a faulty data line, the corresponding one input/output module can reroute its data to a second input/output module for transmission over its data line, and the second input/output module can reroute its data to a third input/output module for transmission over its data line, and so on, until the last input/output module can reroute its data to the redundant data line for transmission over the redundant data line.