Abstract: Power electronics systems including power electronics device assemblies having cold plates are described. A cold plate includes an S-cell having a body with a graphite or graphite-composite material. The body defines a power device recess. The S-cell is disposed within a cavity of the cold plate. The cold plate further includes a bond material bonding the S-cell to a base wall of the cavity.

Abstract: Cold plate assemblies, power electronics assemblies including the same, and power electronics systems including the same are disclosed. A cold plate includes an S-cell disposed within a cavity of the cold plate and at least one reactive multilayer system interposed between the S-cell and a base wall of the cavity.

Abstract: Disclosed herein are apparatus and methods for a power electronics assembly that includes a printed circuit board (PCB) and an electrical insulation portion. The PCB includes a plurality of embedded power devices and a substrate layer having a plurality of metal inverse opal (MIO) portions. The electrically insulating portion is positioned between each of the MIO portions. The plurality of MIO portions is thermally coupled to the plurality of embedded power devices.

Abstract: Power electronics assemblies having embedded power electronics devices are disclosed. In one embodiment, a power electronics assembly includes a circuit board assembly that includes a substrate that is electrically insulating and a power electronics device assembly embedded in the substrate. The power electronics device assembly includes an S-cell that includes an inner graphite layer, a metal layer encasing the inner graphite layer, and a first surface of the metal layer comprising a recess provided within the first surface. The power electronics device assembly further includes a power electronics device disposed within the recess of the first surface.

Abstract: Power electronics device assemblies, circuit board assemblies, and power electronics assemblies are disclosed. In one embodiment, a power electronics device assembly includes an S-cell including a first metal layer, a first graphite layer bonded to the first metal layer, an electrically insulating layer bonded to the first graphite layer, a second graphite layer bonded to the electrically insulating layer and a second metal layer bonded to the second graphite layer, the second metal layer comprising a surface and a recess provided within the surface. The power electronics device assembly further includes a power electronics device disposed within the recess of the surface.

Abstract: Disclosed herein are apparatus and methods for a power electronics assembly includes a cold plate assembly and one or more power device assemblies. The cold plate assembly includes a manifold including a heat sink cavity in a first surface and a heat sink. The heat sink includes one or more substrate cavities and the heat sink is positioned in the heat sink cavity. The one or more power device assemblies are positioned within the one or more substrate cavities. Each power device assembly of the one or more power assemblies includes a direct bonded metal (DBM) substrate including a first metal layer directly bonded to an insulator layer and a power device. The DBM substrate includes a power device cavity. The power device is positioned in the power device cavity and the power device is electronically coupled to the first metal layer.

Abstract: Disclosed herein are an apparatus and method fluid flow measurements which include a pressure transducer and a flexible tube. The pressure transducer is tuned to measure flow speeds having a Reynolds number less than 100 and include an inlet. The flexible tube has a first end fluidly coupled to the inlet and a second end positioned adjacent to and in fluid communication with a plurality of fluid outlets of a microchannel flow structure. Each of the plurality of fluid outlets has a cross section defining an outlet area. The second end has a cross section defining a flexible tube area that is larger than the outlet area.

Abstract: Provided is a device for processing an antistress cone of a main insulation layer of a cable. The device includes a support, a clamping unit, a cutting unit and an infeed unit. The clamping unit is mounted on the support and configured to clamp a cable. The cutting unit is slidably disposed on the support, capable of cutting the cable in the radial direction of the cable, and capable of performing feeding in the radial direction of the cable to adjust the cutting depth. The infeed unit is connected to and capable of driving the cutting unit and configured to drive the cutting unit to slide in the axial direction of the cable so that the cutting unit performs feeding and cutting in the axial direction of the cable.

Abstract: The present disclosure provides a microchannel liquid-liquid mixing device, comprising a microchannel component and a shell, wherein the microchannel component is fixed inside the shell, wherein an inlet is provided at one end of the shell for feeding at least two reaction liquid phases, and an outlet is provided at the other end for discharging a mixed material; said microchannel component comprises multiple stacked sheets and oleophilic fiber filaments and hydrophilic fiber filaments filled in the crevices between adjacent sheets, wherein the fiber filaments form several microchannels between them, and the fiber filaments are clamped and fixed by the sheets. The microchannel liquid-liquid mixing device is used for at least two reaction liquid phases to form a mixed material, and the at least two reaction liquid phases are cut by fiber filaments and mixed in the microchannel mixing device to form a mixed material.

Abstract: Provided is an insulating coating device for an electric wire, including a pressing pipe. The pressing pipe includes two first pressing parts which are configured to divide the pressing pipe into two parts along a longitudinal cross section of the pressing pipe, an inner wall of the pressing pipe is provided with an air bag, and the air bag is provided with an air pipe joint which penetrates to an outside of the pressing pipe. In the insulating coating device for the electric wire, a self-curing insulating material is coated on joints of the electric wires, the air bag is used to squeeze the self-curing insulating material such that the self-curing insulating material is shaped and compacted, so that cavities generated in a coating process is reduced, and the self-curing insulating material is uniformly attached to the joints of the electric wires.

Abstract: Power electronics device assemblies, circuit board assemblies, and power electronics assemblies are disclosed. In one embodiment, a power electronics device assembly includes an S-cell including a first metal layer, a first graphite layer bonded to the first metal layer, an electrically insulating layer bonded to the first graphite layer, a second graphite layer bonded to the electrically insulating layer and a second metal layer bonded to the second graphite layer, the second metal layer comprising a surface and a recess provided within the surface. The power electronics device assembly further includes a power electronics device disposed within the recess of the surface.

Abstract: In an embodiment method, an envelope voltage of a resonant capacitor of a wireless power receiver in a wireless charging system may be detected at an output node. One or more parameters of the wireless power receiver may be adjusted in order keep the envelope voltage within a pre-determined voltage range. The one or more parameters includes a capacitance across a receiving coil and the resonant capacitor, or a current of a sub-circuit connected between the output node and a ground. An amplitude shift keying (ASK) carrier signal may be detected at a wireless power transmitter of the wireless charging system and attenuated. A demodulated ASK signal may be generated from the attenuated ASK carrier signal based on peak values of the attenuated ASK carrier signal and a zero-crossing signal generated from the attenuated ASK carrier signal.

Abstract: A wireless inductive charging apparatus includes first and second coil boards arranged in parallel, each coil board having a substrate and a first metallic trace forming a first inductive winding disposed on a first surface of the substrate. The apparatus includes an electrically-insulating and thermally-conductive insert board arranged between and adjacent to the first and second coil boards, the insert board including microchannels to provide cooling to the coil boards. The first coil board, the insert board and second coil board are arranged in a stacked formation to generate electric power when exposed to a changing magnetic field. Each coil board can also include a second metallic trace forming a second inductive winding disposed on a second surface of the substrate, the second surface on an opposite side of the substrate relative to the first surface. Additional coil boards and insert boards can be added to the stacked arrangement.

Abstract: A rectifier apparatus for a wireless inductive charging system includes a first PCB having a metal layer, a dielectric layer provided on a surface of the metal layer, and a circuit layer provided on an opposite surface of the dielectric layer relative to the metal layer, the circuit layer including copper traces and circuit components, the circuit components including a capacitor array. The apparatus includes a second PCB having a non-metallic substrate and a plurality of inductors formed in the non-metallic substrate, each inductor comprised of a magnetic core and metallic windings, where the plurality of inductors are electrically coupled forming an inductor array. The circuit layer of the first PCB and the inductor array of the second PCB are electrically coupled to form a rectifier circuit to provide DC power. The circuit layer and the inductor array can be electrically coupled via aligned contact pads on each PCB.

Abstract: A double-sided cold plate includes a manifold comprising openings extending from a first surface of the manifold through the manifold to a second surface of the manifold forming recesses within the manifold and an inlet channel and an outlet channel fluidly coupled to the recesses within the manifold, a plurality of first heat sinks coupled to the first surface of the manifold enclosing the openings on the first surface, and a plurality of second heat sinks positioned adjacent each other along a length of the manifold and coupled to the second surface of the manifold, enclosing the openings on the second surface, a width of the plurality of second heat sinks is greater than a width of the manifold thereby forming an overhanging portion on each lengthwise side of the manifold, the overhanging portion configured to mechanically support a plurality of electrical components positioned around a perimeter of the manifold.

Abstract: A driver board assembly includes a printed circuit board (PCB) substrate, one or more power devices embedded within the PCB substrate, and a plurality of conductive layers arranged within the PCB substrate. The plurality of conductive layers are configured to electrically couple the one or more power devices to a current source and thermally couple the one or more power devices to one or more cooling assemblies mounted to at least one of a first surface of the PCB substrate and a second surface of the PCB substrate opposite the first surface of the PCB substrate.

Abstract: Disclosed are an inter-core data processing method and system, a system on chip, and an electronic device. The method includes: a first core sends, by means of a command transmission module, to a second core a first command indicating that the first core is ready to perform a data processing operation corresponding to a target address; the second core acquires a mutex corresponding to the target address in response to the first command and returns a second command to the first core by means of the command transmission module; and the first core performs the data processing operation corresponding to the target address by means of a bus module in response to the second command.

Abstract: Disclosed herein are power electronics assemblies which include a printed circuit board (PCB) having a plurality of conductive layers and a cold plate contacting the PCB. The cold plate includes a manifold constructed from an electrically insulating material and including a first cavity and a second cavity. The cold plate further includes a first heat sink positioned in the first cavity and thermally coupled to the plurality of conductive layers. The cold plate further includes a second heat sink positioned in the second cavity and thermally coupled to the plurality of conductive layers.

Abstract: A configurable, double sided, manifold micro-channel cold plate includes a one or more manifold micro-channel cold plate cells. Each cold plate cell includes a manifold body, a manifold insert, a plurality of heat sinks, and a plurality of longitudinal openings configured for fluidic communication with the fluid channels. The manifold body has fluid channels to permit flow of a fluid coolant. The manifold insert has a plurality of manifold insert fluid channels, and is configured for receipt in the one of the modular body recesses. The heat sinks are configured for receipt in the modular body recesses, and include an impingement surface configured for fluidic communication with the manifold insert fluid channels, and a heat transfer surface for thermal communication with one or more heat generating devices.

Abstract: Embedded cooling systems and methods of forming the same are disclosed. An embedded cooling system includes a PCB having a first major surface opposite a second major surface and power device stacks embedded within the PCB between the first major surface and the second major surface. Each power device stack includes a first substrate and a second substrate, and an electrical insulation layer disposed between the first substrate and the second substrate. The embedded cooling system further includes a power device coupled to the first substrate of each power device stack and heat pipes having a first end and a second end spaced a distance apart from the first end. The first end is embedded within the PCB substrate and the second end extends outside of the PCB substrate. The second substrate of the one or more power device stacks is coupled to the one or more heat pipes.