Patents by Inventor Florian Kurz
Florian Kurz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11862487Abstract: A device, a system and a method for bonding two substrates. A first substrate holder has a recess and an elevation.Type: GrantFiled: December 19, 2022Date of Patent: January 2, 2024Assignee: EV Group E. Thallner GmbHInventors: Markus Wimplinger, Florian Kurz, Viorel Dragoi
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Publication number: 20230294390Abstract: A method for bonding a contact surface of a first substrate to a contact surface of a second substrate comprising of the steps of: positioning the first substrate on a first receiving surface of a first receiving apparatus and positioning the second substrate on a second receiving surface of a second receiving apparatus; establishing contact of the contact surfaces at a bond initiation site; and bonding the first substrate to the second substrate along a bonding wave which is travelling from the bond initiation site to the side edges of the substrates, wherein the first substrate and/or the second substrate is/are deformed for alignment of the contact surfaces.Type: ApplicationFiled: May 24, 2023Publication date: September 21, 2023Applicant: EV Group E. Thallner GmbHInventors: Thomas Wagenleitner, Markus Wimplinger, Friedrich Paul Lindner, Thomas Plach, Florian Kurz
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Patent number: 11697281Abstract: A method for bonding a contact surface of a first substrate to a contact surface of a second substrate comprising of the steps of: positioning the first substrate on a first receiving surface of a first receiving apparatus and positioning the second substrate on a second receiving surface of a second receiving apparatus; establishing contact of the contact surfaces at a bond initiation site; and bonding the first substrate to the second substrate along a bonding wave which is travelling from the bond initiation site to the side edges of the substrates, wherein the first substrate and/or the second substrate is/are deformed for alignment of the contact surfaces.Type: GrantFiled: June 8, 2021Date of Patent: July 11, 2023Assignee: EV Group E. Thallner GmbHInventors: Thomas Wagenleitner, Markus Wimplinger, Friedrich Paul Lindner, Thomas Plach, Florian Kurz
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Publication number: 20230117625Abstract: A device, a system and a method for bonding two substrates. A first substrate holder has a recess and an elevation.Type: ApplicationFiled: December 19, 2022Publication date: April 20, 2023Applicant: EV Group E. Thallner GmbHInventors: Markus Wimplinger, Florian Kurz, Viorel Dragoi
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Patent number: 11562912Abstract: A device, a system and a method for bonding two substrates. A first substrate holder has a recess and an elevation.Type: GrantFiled: January 13, 2022Date of Patent: January 24, 2023Assignee: EV Group E. Thallner GmbHInventors: Markus Wimplinger, Florian Kurz, Viorel Dragoi
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Patent number: 11527410Abstract: A method for bonding a first substrate with a second substrate at respective contact faces of the substrates with the following steps: holding the first substrate to a first sample holder surface of a first sample holder with a holding force FH1 and holding the second substrate to a second sample holder surface of a second sample holder with a holding force FH2; contacting the contact faces at a bond initiation point and heating at least the second sample holder surface to a heating temperature TH; bonding of the first substrate with the second substrate along a bonding wave running from the bond initiation point to the side edges of the substrates, wherein the heating temperature TH is reduced at the second sample holder surface during the bonding.Type: GrantFiled: January 4, 2022Date of Patent: December 13, 2022Assignee: EV Group E. Thallner GmbHInventors: Florian Kurz, Thomas Wagenleitner, Thomas Plach, Jurgen Markus Suss
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Publication number: 20220139735Abstract: A device, a system and a method for bonding two substrates. A first substrate holder has a recess and an elevation.Type: ApplicationFiled: January 13, 2022Publication date: May 5, 2022Applicant: EV Group E. Thallner GmbHInventors: Markus Wimplinger, Florian Kurz, Viorel Dragoi
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Publication number: 20220130674Abstract: A method for bonding a first substrate with a second substrate at respective contact faces of the substrates with the following steps: holding the first substrate to a first sample holder surface of a first sample holder with a holding force FH1 and holding the second substrate to a second sample holder surface of a second sample holder with a holding force FH2; contacting the contact faces at a bond initiation point and heating at least the second sample holder surface to a heating temperature TH; bonding of the first substrate with the second substrate along a bonding wave running from the bond initiation point to the side edges of the substrates, wherein the heating temperature TH is reduced at the second sample holder surface during the bonding.Type: ApplicationFiled: January 4, 2022Publication date: April 28, 2022Applicant: EV Group E. Thallner GmbHInventors: Florian Kurz, Thomas Wagenleitner, Thomas Plach, Jurgen Markus Suss
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Patent number: 11276589Abstract: A device, a system and a method for bonding two substrates. A first substrate holder has a recess and an elevation.Type: GrantFiled: February 22, 2021Date of Patent: March 15, 2022Assignee: EV Group E. Thallner GmbHInventors: Markus Wimplinger, Florian Kurz, Viorel Dragoi
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Patent number: 11251045Abstract: A method for bonding a first substrate with a second substrate at respective contact faces of the substrates with the following steps: holding the first substrate to a first sample holder surface of a first sample holder with a holding force FH1 and holding the second substrate to a second sample holder surface of a second sample holder with a holding force FH2; contacting the contact faces at a bond initiation point and heating at least the second sample holder surface to a heating temperature TH; bonding of the first substrate with the second substrate along a bonding wave running from the bond initiation point to the side edges of the substrates, wherein the heating temperature TH is reduced at the second sample holder surface during the bonding.Type: GrantFiled: November 4, 2020Date of Patent: February 15, 2022Assignee: EV Group E. Thallner GmbHInventors: Florian Kurz, Thomas Wagenleitner, Thomas Plach, Jurgen Markus Suss
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Publication number: 20210291504Abstract: A method for bonding a contact surface of a first substrate to a contact surface of a second substrate comprising of the steps of: positioning the first substrate on a first receiving surface of a first receiving apparatus and positioning the second substrate on a second receiving surface of a second receiving apparatus; establishing contact of the contact surfaces at a bond initiation site; and bonding the first substrate to the second substrate along a bonding wave which is travelling from the bond initiation site to the side edges of the substrates, wherein the first substrate and/or the second substrate is/are deformed for alignment of the contact surfaces.Type: ApplicationFiled: June 8, 2021Publication date: September 23, 2021Applicant: EV Group E. Thallner GmbHInventors: Thomas Wagenleitner, Markus Wimplinger, Friedrich Paul Lindner, Thomas Plach, Florian Kurz
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Patent number: 11059280Abstract: A method for bonding a contact surface of a first substrate to a contact surface of a second substrate comprising of the steps of: positioning the first substrate on a first receiving surface of a first receiving apparatus and positioning the second substrate on a second receiving surface of a second receiving apparatus; establishing contact of the contact surfaces at a bond initiation site; and bonding the first substrate to the second substrate along a bonding wave which is travelling from the bond initiation site to the side edges of the substrates, wherein the first substrate and/or the second substrate is/are deformed for alignment of the contact surfaces.Type: GrantFiled: March 18, 2019Date of Patent: July 13, 2021Assignee: EV Group E. Thallner GmbHInventors: Thomas Wagenleitner, Markus Wimplinger, Friedrich Paul Lindner, Thomas Plach, Florian Kurz
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Publication number: 20210183665Abstract: A device, a system and a method for bonding two substrates. A first substrate holder has a recess and an elevation.Type: ApplicationFiled: February 22, 2021Publication date: June 17, 2021Applicant: EV Group E. Thallner GmbHInventors: Markus Wimplinger, Florian Kurz, Viorel Dragoi
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Patent number: 11020953Abstract: A method for bonding a contact surface of a first substrate to a contact surface of a second substrate comprising of the steps of: positioning the first substrate on a first receiving surface of a first receiving apparatus and positioning the second substrate on a second receiving surface of a second receiving apparatus; establishing contact of the contact surfaces at a bond initiation site; and bonding the first substrate to the second substrate along a bonding wave which is travelling from the bond initiation site to the side edges of the substrates, wherein the first substrate and/or the second substrate is/are deformed for alignment of the contact surfaces.Type: GrantFiled: March 20, 2019Date of Patent: June 1, 2021Assignee: EV Group E. Thallner GmbHInventors: Thomas Wagenleitner, Markus Wimplinger, Friedrich Paul Lindner, Thomas Plach, Florian Kurz
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Patent number: 11020951Abstract: A method for bonding a contact surface of a first substrate to a contact surface of a second substrate comprising of the steps of: positioning the first substrate on a first receiving surface of a first receiving apparatus and positioning the second substrate on a second receiving surface of a second receiving apparatus; establishing contact of the contact surfaces at a bond initiation site; and bonding the first substrate to the second substrate along a bonding wave which is travelling from the bond initiation site to the side edges of the substrates, wherein the first substrate and/or the second substrate is/are deformed for alignment of the contact surfaces.Type: GrantFiled: March 19, 2019Date of Patent: June 1, 2021Assignee: EV Group E. Thallner GmbHInventors: Thomas Wagenleitner, Markus Wimplinger, Friedrich Paul Lindner, Thomas Plach, Florian Kurz
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Patent number: 11020952Abstract: A method for bonding a contact surface of a first substrate to a contact surface of a second substrate comprising of the steps of: positioning the first substrate on a first receiving surface of a first receiving apparatus and positioning the second substrate on a second receiving surface of a second receiving apparatus; establishing contact of the contact surfaces at a bond initiation site; and bonding the first substrate to the second substrate along a bonding wave which is travelling from the bond initiation site to the side edges of the substrates, wherein the first substrate and/or the second substrate is/are deformed for alignment of the contact surfaces.Type: GrantFiled: March 20, 2019Date of Patent: June 1, 2021Assignee: EV Group E. Thallner GmbHInventors: Thomas Wagenleitner, Markus Wimplinger, Friedrich Paul Lindner, Thomas Plach, Florian Kurz
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Patent number: 11020950Abstract: A method for bonding a contact surface of a first substrate to a contact surface of a second substrate comprising of the steps of: positioning the first substrate on a first receiving surface of a first receiving apparatus and positioning the second substrate on a second receiving surface of a second receiving apparatus; establishing contact of the contact surfaces at a bond initiation site; and bonding the first substrate to the second substrate along a bonding wave which is travelling from the bond initiation site to the side edges of the substrates, wherein the first substrate and/or the second substrate is/are deformed for alignment of the contact surfaces.Type: GrantFiled: March 19, 2019Date of Patent: June 1, 2021Assignee: EV Group E. Thallner GmbHInventors: Thomas Wagenleitner, Markus Wimplinger, Friedrich Paul Lindner, Thomas Plach, Florian Kurz
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Patent number: 10964562Abstract: A device, a system and a method for bonding two substrates. A first substrate holder has a recess and an elevation.Type: GrantFiled: September 29, 2016Date of Patent: March 30, 2021Assignee: EV Group E. Thallner GmbHInventors: Markus Wimplinger, Florian Kurz, Viorel Dragoi
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Publication number: 20210074544Abstract: A method for bonding a first substrate with a second substrate at respective contact faces of the substrates with the following steps: holding the first substrate to a first sample holder surface of a first sample holder with a holding force FH1 and holding the second substrate to a second sample holder surface of a second sample holder with a holding force FH2; contacting the contact faces at a bond initiation point and heating at least the second sample holder surface to a heating temperature TH; bonding of the first substrate with the second substrate along a bonding wave running from the bond initiation point to the side edges of the substrates, wherein the heating temperature TH is reduced at the second sample holder surface during the bonding.Type: ApplicationFiled: November 4, 2020Publication date: March 11, 2021Applicant: EV Group E. Thallner GmbHInventors: Florian Kurz, Thomas Wagenleitner, Thomas Plach, Jurgen Markus Suss
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Patent number: 10861699Abstract: A method for bonding a first substrate with a second substrate at respective contact faces of the substrates with the following steps: holding the first substrate to a first sample holder surface of a first sample holder with a holding force FH1 and holding the second substrate to a second sample holder surface of a second sample holder with a holding force FH2; contacting the contact faces at a bond initiation point and heating at least the second sample holder surface to a heating temperature TH; bonding of the first substrate with the second substrate along a bonding wave running from the bond initiation point to the side edges of the substrates, wherein the heating temperature TH is reduced at the second sample holder surface during the bonding.Type: GrantFiled: July 8, 2020Date of Patent: December 8, 2020Assignee: EV Group E. Thallner GmbHInventors: Florian Kurz, Thomas Wagenleitner, Thomas Plach, Jurgen Markus Suss