Patents by Inventor Florian Kurz
Florian Kurz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20200335341Abstract: A method for bonding a first substrate with a second substrate at respective contact faces of the substrates with the following steps: holding the first substrate to a first sample holder surface of a first sample holder with a holding force FH1 and holding the second substrate to a second sample holder surface of a second sample holder with a holding force FH2; contacting the contact faces at a bond initiation point and heating at least the second sample holder surface to a heating temperature TH; bonding of the first substrate with the second substrate along a bonding wave running from the bond initiation point to the side edges of the substrates, wherein the heating temperature TH is reduced at the second sample holder surface during the bonding.Type: ApplicationFiled: July 8, 2020Publication date: October 22, 2020Applicant: EV Group E. Thallner GmbHInventors: Florian Kurz, Thomas Wagenleitner, Thomas Plach, Jurgen Markus Suss
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Patent number: 10748770Abstract: A method for bonding a first substrate with a second substrate at respective contact faces of the substrates with the following steps: holding the first substrate to a first sample holder surface of a first sample holder with a holding force FH1 and holding the second substrate to a second sample holder surface of a second sample holder with a holding force FH2; contacting the contact faces at a bond initiation point and heating at least the second sample holder surface to a heating temperature TH; bonding of the first substrate with the second substrate along a bonding wave running from the bond initiation point to the side edges of the substrates, wherein the heating temperature TH is reduced at the second sample holder surface during the bonding.Type: GrantFiled: March 17, 2020Date of Patent: August 18, 2020Assignee: EV Group E. Thallner GmbHInventors: Florian Kurz, Thomas Wagenleitner, Thomas Plach, Jurgen Markus Suss
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Publication number: 20200219726Abstract: A method for bonding a first substrate with a second substrate at respective contact faces of the substrates with the following steps: holding the first substrate to a first sample holder surface of a first sample holder with a holding force FH1 and holding the second substrate to a second sample holder surface of a second sample holder with a holding force FH2; contacting the contact faces at a bond initiation point and heating at least the second sample holder surface to a heating temperature TH; bonding of the first substrate with the second substrate along a bonding wave running from the bond initiation point to the side edges of the substrates, wherein the heating temperature TH is reduced at the second sample holder surface during the bonding.Type: ApplicationFiled: March 17, 2020Publication date: July 9, 2020Applicant: EV Group E. Thallner GmbHInventors: Florian Kurz, Thomas Wagenleitner, Thomas Plach, Jurgen Markus Suss
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Patent number: 10636662Abstract: A method for bonding a first substrate with a second substrate at respective contact faces of the substrates with the following steps: holding the first substrate to a first sample holder surface of a first sample holder with a holding force FH1 and holding the second substrate to a second sample holder surface of a second sample holder with a holding force FH2; contacting the contact faces at a bond initiation point and heating at least the second sample holder surface to a heating temperature TH; bonding of the first substrate with the second substrate along a bonding wave running from the bond initiation point to the side edges of the substrates, wherein the heating temperature TH is reduced at the second sample holder surface during the bonding.Type: GrantFiled: October 29, 2019Date of Patent: April 28, 2020Assignee: EV Group E. Thallner GmbHInventors: Florian Kurz, Thomas Wagenleitner, Thomas Plach, Jurgen Markus Suss
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Publication number: 20200066529Abstract: A method for bonding a first substrate with a second substrate at respective contact faces of the substrates with the following steps: holding the first substrate to a first sample holder surface of a first sample holder with a holding force FH1 and holding the second substrate to a second sample holder surface of a second sample holder with a holding force FH2; contacting the contact faces at a bond initiation point and heating at least the second sample holder surface to a heating temperature TH; bonding of the first substrate with the second substrate along a bonding wave running from the bond initiation point to the side edges of the substrates, wherein the heating temperature TH is reduced at the second sample holder surface during the bonding.Type: ApplicationFiled: October 29, 2019Publication date: February 27, 2020Applicant: EV Group E. Thallner GmbHInventors: Florian Kurz, Thomas Wagenleitner, Thomas Plach, Jurgen Markus Suss
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Patent number: 10504730Abstract: A method for bonding a first substrate with a second substrate at respective contact faces of the substrates with the following steps: holding the first substrate to a first sample holder surface of a first sample holder with a holding force FH1 and holding the second substrate to a second sample holder surface of a second sample holder with a holding force FH2; contacting the contact faces at a bond initiation point and heating at least the second sample holder surface to a heating temperature TH; bonding of the first substrate with the second substrate along a bonding wave running from the bond initiation point to the side edges of the substrates, wherein the heating temperature TH is reduced at the second sample holder surface during the bonding.Type: GrantFiled: September 6, 2018Date of Patent: December 10, 2019Assignee: EV Group E. Thallner GmbHInventors: Florian Kurz, Thomas Wagenleitner, Thomas Plach, Jurgen Markus Suss
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Publication number: 20190228995Abstract: A device, a system and a method for bonding two substrates. A first substrate holder has a recess and an elevation.Type: ApplicationFiled: September 29, 2016Publication date: July 25, 2019Applicant: EV Group E. Thallner GmbHInventors: Markus Wimplinger, Florian Kurz, Viorel Dragoi
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Publication number: 20190217595Abstract: A method for bonding a contact surface of a first substrate to a contact surface of a second substrate comprising of the steps of: positioning the first substrate on a first receiving surface of a first receiving apparatus and positioning the second substrate on a second receiving surface of a second receiving apparatus; establishing contact of the contact surfaces at a bond initiation site; and bonding the first substrate to the second substrate along a bonding wave which is travelling from the bond initiation site to the side edges of the substrates, wherein the first substrate and/or the second substrate is/are deformed for alignment of the contact surfaces.Type: ApplicationFiled: March 20, 2019Publication date: July 18, 2019Applicant: EV Group E. Thallner GmbHInventors: Thomas Wagenleitner, Markus Wimplinger, Friedrich Paul Lindner, Thomas Plach, Florian Kurz
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Publication number: 20190217594Abstract: A method for bonding a contact surface of a first substrate to a contact surface of a second substrate comprising of the steps of: positioning the first substrate on a first receiving surface of a first receiving apparatus and positioning the second substrate on a second receiving surface of a second receiving apparatus; establishing contact of the contact surfaces at a bond initiation site; and bonding the first substrate to the second substrate along a bonding wave which is travelling from the bond initiation site to the side edges of the substrates, wherein the first substrate and/or the second substrate is/are deformed for alignment of the contact surfaces.Type: ApplicationFiled: March 20, 2019Publication date: July 18, 2019Applicant: EV Group E. Thallner GmbHInventors: Thomas Wagenleitner, Markus Wimplinger, Friedrich Paul Lindner, Thomas Plach, Florian Kurz
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Publication number: 20190210349Abstract: A method for bonding a contact surface of a first substrate to a contact surface of a second substrate comprising of the steps of: positioning the first substrate on a first receiving surface of a first receiving apparatus and positioning the second substrate on a second receiving surface of a second receiving apparatus; establishing contact of the contact surfaces at a bond initiation site; and bonding the first substrate to the second substrate along a bonding wave which is travelling from the bond initiation site to the side edges of the substrates, wherein the first substrate and/or the second substrate is/are deformed for alignment of the contact surfaces.Type: ApplicationFiled: March 19, 2019Publication date: July 11, 2019Applicant: EV Group E. Thallner GmbHInventors: Thomas Wagenleitner, Markus Wimplinger, Friedrich Paul Lindner, Thomas Plach, Florian Kurz
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Publication number: 20190210350Abstract: A method for bonding a contact surface of a first substrate to a contact surface of a second substrate comprising of the steps of: positioning the first substrate on a first receiving surface of a first receiving apparatus and positioning the second substrate on a second receiving surface of a second receiving apparatus; establishing contact of the contact surfaces at a bond initiation site; and bonding the first substrate to the second substrate along a bonding wave which is travelling from the bond initiation site to the side edges of the substrates, wherein the first substrate and/or the second substrate is/are deformed for alignment of the contact surfaces.Type: ApplicationFiled: March 19, 2019Publication date: July 11, 2019Applicant: EV Group E. Thallner GmbHInventors: Thomas Wagenleitner, Markus Wimplinger, Friedrich Paul Lindner, Thomas Plach, Florian Kurz
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Publication number: 20190210348Abstract: A method for bonding a contact surface of a first substrate to a contact surface of a second substrate comprising of the steps of: positioning the first substrate on a first receiving surface of a first receiving apparatus and positioning the second substrate on a second receiving surface of a second receiving apparatus; establishing contact of the contact surfaces at a bond initiation site; and bonding the first substrate to the second substrate along a bonding wave which is travelling from the bond initiation site to the side edges of the substrates, wherein the first substrate and/or the second substrate is/are deformed for alignment of the contact surfaces.Type: ApplicationFiled: March 18, 2019Publication date: July 11, 2019Applicant: EV Group E. Thallner GmbHInventors: Thomas Wagenleitner, Markus Wimplinger, Friedrich Paul Lindner, Thomas Plach, Florian Kurz
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Patent number: 10279575Abstract: A method for bonding a contact surface of a first substrate to a contact surface of a second substrate comprising of the steps of: positioning the first substrate on a first receiving surface of a first receiving apparatus and positioning the second substrate on a second receiving surface of a second receiving apparatus; establishing contact of the contact surfaces at a bond initiation site; and bonding the first substrate to the second substrate along a bonding wave which is travelling from the bond initiation site to the side edges of the substrates, wherein the first substrate and/or the second substrate is/are deformed for alignment of the contact surfaces.Type: GrantFiled: May 29, 2013Date of Patent: May 7, 2019Assignee: EV GROUP E. THALLNER GMBHInventors: Thomas Wagenleitner, Markus Wimplinger, Friedrich Paul Lindner, Thomas Plach, Florian Kurz
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Publication number: 20190019677Abstract: A method for bonding a first substrate with a second substrate at respective contact faces of the substrates with the following steps: holding the first substrate to a first sample holder surface of a first sample holder with a holding force FH1 and holding the second substrate to a second sample holder surface of a second sample holder with a holding force FH2; contacting the contact faces at a bond initiation point and heating at least the second sample holder surface to a heating temperature TH; bonding of the first substrate with the second substrate along a bonding wave running from the bond initiation point to the side edges of the substrates, wherein the heating temperature TH is reduced at the second sample holder surface during the bonding.Type: ApplicationFiled: September 6, 2018Publication date: January 17, 2019Applicant: EV Group E. Thallner GmbHInventors: Florian Kurz, Thomas Wagenleitner, Thomas Plach, Jurgen Markus Suss
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Patent number: 10109487Abstract: A method for bonding a first substrate with a second substrate at respective contact faces of the substrates with the following steps: holding the first substrate to a first sample holder surface of a first sample holder with a holding force FH1 and holding the second substrate to a second sample holder surface of a second sample holder with a holding force FH2; contacting the contact faces at a bond initiation point and heating at least the second sample holder surface to a heating temperature TH; bonding of the first substrate with the second substrate along a bonding wave running from the bond initiation point to the side edges of the substrates, wherein the heating temperature TH is reduced at the second sample holder surface during the bonding.Type: GrantFiled: February 16, 2016Date of Patent: October 23, 2018Assignee: EV Group E. Thallner GmbHInventors: Florian Kurz, Thomas Wagenleitner, Thomas Plach, Jurgen Markus Suss
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Publication number: 20180076037Abstract: A method for bonding a first substrate with a second substrate at respective contact faces of the substrates with the following steps: holding the first substrate to a first sample holder surface of a first sample holder with a holding force FH1 and holding the second substrate to a second sample holder surface of a second sample holder with a holding force FH2; contacting the contact faces at a bond initiation point and heating at least the second sample holder surface to a heating temperature TH; bonding of the first substrate with the second substrate along a bonding wave running from the bond initiation point to the side edges of the substrates, wherein the heating temperature TH is reduced at the second sample holder surface during the bonding.Type: ApplicationFiled: February 16, 2016Publication date: March 15, 2018Applicant: EV Group E. Thallner GmbHInventors: Florian Kurz, Thomas Wagenleitner, Thomas Plach, Jurgen Markus Suss
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Patent number: 9682690Abstract: In a method for actuating a hydraulic braking system, a hydraulic fluid is temporarily stored in a storage chamber when the antilocking system is activated. An additional hydraulic buffer volume of the storage chamber increases as the vehicle speed decreases.Type: GrantFiled: April 15, 2015Date of Patent: June 20, 2017Assignee: ROBERT BOSCH GMBHInventors: Florian Kurz, Thomas Schmidt
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Patent number: 9586566Abstract: In a method for actuating a hydraulic braking system, a hydraulic fluid is temporarily stored in a storage chamber when the antilocking system is activated and recirculated back into the brake circuit with the aid of a recirculation pump. The target pump speed of the recirculation pump depends on the degree of filling of the storage chamber with hydraulic fluid and in addition on the control frequency of the antilocking system.Type: GrantFiled: April 15, 2015Date of Patent: March 7, 2017Assignee: ROBERT BOSCH GMBHInventors: Florian Kurz, Michael Bunk, Thomas Schmidt
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Publication number: 20150298667Abstract: In a method for actuating a hydraulic braking system, a hydraulic fluid is temporarily stored in a storage chamber when the antilocking system is activated. An additional hydraulic buffer volume of the storage chamber increases as the vehicle speed decreases.Type: ApplicationFiled: April 15, 2015Publication date: October 22, 2015Inventors: Florian KURZ, Thomas Schmidt
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Publication number: 20150298668Abstract: In a method for actuating a hydraulic braking system, a hydraulic fluid is temporarily stored in a storage chamber when the antilocking system is activated and recirculated back into the brake circuit with the aid of a recirculation pump. The target pump speed of the recirculation pump depends on the degree of filling of the storage chamber with hydraulic fluid and in addition on the control frequency of the antilocking system.Type: ApplicationFiled: April 15, 2015Publication date: October 22, 2015Inventors: Florian Kurz, Michael Bunk, Thomas Schmidt