Abstract: The invention relates to MEMS devices. In one embodiment, a micro-electromechanical system (MEMS) device comprises a resonator element having a circumference, an anchor region, and a plurality of beam elements coupling the anchor region and the resonator element. Further embodiments comprise additional devices, systems and methods.

Abstract: The invention relates to MEMS resonators. In one embodiment, an integrated resonator and sensor device comprises a micro-electromechanical system (MEMS) resonator, and an anchor portion coupled to the MEMS resonator and configured to allow resonance of the MEMS resonator in a first plane of motion and movement of the MEMS resonator in a second plane of motion. In other embodiments, additional apparatuses, devices, systems and methods are disclosed.

Abstract: The invention relates to MEMS devices. In one embodiment, a micro-electromechanical system (MEMS) device comprises a resonator element comprising a semiconducting material, and at least one trench formed in the resonator element and filled with a material comprising oxide. Further embodiments comprise additional devices, systems and methods.

Abstract: A wafer-level packaged integrated circuit includes a semiconductor substrate including a first silicon layer. A micro-electromechanical system (MEMS) device is integrated into the first silicon layer. A thin-film deposited sealing member is deposited over the first silicon layer and is configured to seal a cavity in the first silicon layer. At least one additional layer is formed over the sealing member. At least one under bump metallization (UBM) is formed over the at least one additional layer.

Abstract: Micro-electromechanical system (MEMS) devices and methods of manufacture thereof are disclosed. In one embodiment, a MEMS device includes a first semiconductive material and at least one trench disposed in the first semiconductive material, the at least one trench having a sidewall. An insulating material layer is disposed over an upper portion of the sidewall of the at least one trench in the first semiconductive material and over a portion of a top surface of the first semiconductive material proximate the sidewall. A second semiconductive material or a conductive material is disposed within the at least one trench and at least over the insulating material layer disposed over the portion of the top surface of the first semiconductive material proximate the sidewall.

Abstract: Micro-electromechanical system (MEMS) devices and methods of manufacture thereof are disclosed. In one embodiment, a MEMS device includes a first semiconductive material and at least one trench disposed in the first semiconductive material, the at least one trench having a sidewall. An insulating material layer is disposed over an upper portion of the sidewall of the at least one trench in the first semiconductive material and over a portion of a top surface of the first semiconductive material proximate the sidewall. A second semiconductive material or a conductive material is disposed within the at least one trench and at least over the insulating material layer disposed over the portion of the top surface of the first semiconductive material proximate the sidewall.

Abstract: System and method for a microelectromechanical system (MEMS) is disclosed. A preferred embodiment comprises a first anchor region, a vibrating MEMS structure fixed to the first anchor region, a first electrode adjacent the vibrating MEMS structure, a second electrode adjacent the vibrating MEMS structure wherein the vibrating MEMS structure is arranged between the first and the second electrode.

Abstract: The invention relates to MEMS devices. In one embodiment, a micro-electromechanical system (MEMS) device comprises a resonator element having a circumference, an anchor region, and a plurality of beam elements coupling the anchor region and the resonator element. Further embodiments comprise additional devices, systems and methods.

Abstract: The invention relates to MEMS resonators. In one embodiment, an integrated resonator and sensor device includes a micro-electromechanical system (MEMS) resonator, and an anchor portion coupled to the MEMS resonator and configured to allow resonance of the MEMS resonator in a first plane of motion and movement of the MEMS resonator in a second plane of motion. In other embodiments, additional apparatuses, devices, systems and methods are disclosed.

Abstract: A wafer-level packaged integrated circuit includes a semiconductor substrate including a first silicon layer. A micro-electromechanical system (MEMS) device is integrated into the first silicon layer. A thin-film deposited sealing member is deposited over the first silicon layer and is configured to seal a cavity in the first silicon layer. At least one additional layer is formed over the sealing member. At least one under bump metallization (UBM) is formed over the at least one additional layer.

Abstract: Embodiments of the invention are related to MEMS devices and methods. In one embodiment, a MEMS device includes a resonator element comprising a magnetic portion having a fixed magnetization, and at least one sensor element comprising a magnetoresistive portion, wherein a magnetization and a resistivity of the magnetoresistive portion vary according to a proximity of the magnetic portion.

Abstract: The invention relates to MEMS devices. In one embodiment, a micro-electromechanical system (MEMS) device comprises a resonator element comprising a semiconducting material, and at least one trench formed in the resonator element and filled with a material comprising oxide. Further embodiments comprise additional devices, systems and methods.

Abstract: Micro-electromechanical system (MEMS) substrates, devices, and methods of manufacture thereof are disclosed. In one embodiment, a MEMS device includes a workpiece having an isolation ring in a top portion thereof, and a moveable element disposed within the isolation ring.

Abstract: The invention relates to MEMS resonators. In one embodiment, an integrated resonator and sensor device comprises a micro-electromechanical system (MEMS) resonator, and an anchor portion coupled to the MEMS resonator and configured to allow resonance of the MEMS resonator in a first plane of motion and movement of the MEMS resonator in a second plane of motion. In other embodiments, additional apparatuses, devices, systems and methods are disclosed.

Abstract: A modulator includes a micro-electromechanical resonator device configured to receive an input signal and generate two output signals in response thereto, wherein the two signals having a predetermined phase relationship therebetween. The modulator further includes a switching system configured to selectively pass one of the two signals to an output of the modulator in an alternating fashion in response to phase modulation data.

Abstract: Micro-electromechanical system (MEMS) devices and methods of manufacture thereof are disclosed. In one embodiment, a MEMS device includes a first semiconductive material and at least one trench disposed in the first semiconductive material, the at least one trench having a sidewall. An insulating material layer is disposed over an upper portion of the sidewall of the at least one trench in the first semiconductive material and over a portion of a top surface of the first semiconductive material proximate the sidewall. A second semiconductive material or a conductive material is disposed within the at least one trench and at least over the insulating material layer disposed over the portion of the top surface of the first semiconductive material proximate the sidewall.