Abstract: A thermosiphon cooler arrangement is provided for the cooling of electric and/or electronic components, including a module of an electric and/or electronic system. The module includes a guiding structure and an inlet for receiving a stream of cooling air, and an outlet for releasing cooling air thereafter in an operating state of the module. The guiding structure is provided for guiding the cooling air entering through the inlet and leaving the module through the outlet in an operating state of the module. The module includes a thermosiphon cooler with an evaporator and a condenser for transferring a majority of a heat load to the cooling air in an operating state of the module. The evaporator is tilted with respect to the condenser wherein the condenser is arranged such that a major portion of the cooling air flows through the condenser.

Abstract: The present disclosure relates to the cooling of electric and/or electronic components, in particular to an electric and/or electronic system with a cabinet, which includes a cabinet housing including a first aperture for receiving a stream of cooling air. The cabinet housing includes a second aperture for releasing the cooling air thereafter in an operating state of the cabinet. At least two modules, which each include a guiding structure with an inlet and an outlet, are provided in the cabinet. The at least two modules are arranged in the cabinet housing such that a branch of the major portion of cooling air flowing through the first aperture of the cabinet housing is enabled to flow into each module via the inlet guided by the guiding structure through the dedicated module to the outlet and thereafter through the second aperture out of the cabinet housing.

Abstract: A cooling apparatus for electric equipment includes a generator configured to receive a heat load from first electric components, a evaporator configured to receive a heat load from second electric components, a closed compartment enclosing the generator and evaporator, and a absorber transferring heat from heated fluid to the outside of the closed compartment. To obtain an efficient and reliable cooling apparatus, the cooling apparatus includes a first expansion device which reduces the pressure of the fluid, and forwards the fluid in a liquid state and with a lower pressure to the secondary cooling element, which transfers heat to the received fluid from the second electric components for evaporating the fluid.

Abstract: An apparatus is disclosed which includes a generator receiving a heat load from first electric components, an evaporator for receiving a heat load from second electric components, a tight enclosure, and an absorber-condenser arranged outside of the tight enclosure. For efficient cooling of the apparatus, one or more of the generator, evaporator and absorber-condenser is entirely or partly manufactured of aluminum. The inert and refrigerant can be selected such that R134a is used as the inert and butane as the refrigerant fluid, or R32 is used as the inert and cyclopropane is used as the refrigerant, and the absorber is selected to include an alkyl acetamide, a carbonate ester or a glycol ester.

Abstract: An electric apparatus is disclosed having at least two cooling elements and a first fan arrangement for cooling the at least two cooling elements with a first air flow. A second fan arrangement can cool the at least two cooling elements with a second air flow. The second fan arrangement passes a second air flow in a different flow direction as compared to the first air flow, and the first and second air flows are arranged to cool different parts of the at least two cooling elements.

Abstract: An exemplary heat exchanger includes evaporator channels and condenser channels, connecting parts for providing fluid paths between evaporator channels and the condenser channels, a first heat transfer element for transferring a heat load to a fluid in said evaporator channels, and a second heat transfer element for transferring a heat load from a fluid in the condenser channels. In order to achieve a heat exchanger that can be used in any position, the evaporator channels and said condenser channels can have capillary dimensions. The connecting part arranged at a first end of heat exchanger can include a first fluid distribution element for conducting fluid from a predetermined condenser channel into a corresponding predetermined evaporator channel, and the connecting part arranged at a second end of the heat exchanger can include a second fluid distribution element for conducting fluid from a predetermined evaporator channel into a corresponding predetermined condenser channel.

Abstract: A cooling module including a condenser, a power module including the cooling module and a method for cooling electric and/or electronic components are provided. The condenser of the cooling module includes at least one panel for cooling electric and/or electronic components. Two sheets of the panel are attached to one another by a process involving roll-bonding such that a conduit is formed between the two sheets. The conduit extends in a direction of a plane formed by the sheets. Cooling may be provided by evaporating coolant in the conduit at an evaporation section of the panel and by condensing the coolant at a condensing section of the panel. A heat load may be transferred from a heat source to a heat receiving unit. The heat receiving unit is adapted to transfer the heat load to the panel which transfers the heat load to an ambient environment by a thermal carrier.

Abstract: A cooling apparatus includes a generator for receiving a first heat load from first electric components, a evaporator for receiving a second heat load from second electric components, a closed compartment enclosing the generator and evaporator, and a third cooling element arranged outside of the closed compartment for receiving heated fluid from at least one of the generator and evaporator and for transferring heat from the heated fluid to outside of the closed compartment. To obtain an efficient and reliable cooling apparatus, a flow channel of the evaporator is configured to receive a fluid in a liquid state and a fluid in a gas state, where the fluid in the gas state reduces a partial pressure of the fluid in a liquid state and the temperature required for evaporating the fluid in the liquid state, such that the fluid in the liquid state is evaporated.

Abstract: A cooling apparatus for electric equipment includes a generator configured to receive a heat load from first electric components, a evaporator configured to receive a heat load from second electric components, a closed compartment enclosing the generator and evaporator, and a absorber transferring heat from heated fluid to the outside of the closed compartment. To obtain an efficient and reliable cooling apparatus, the cooling apparatus includes a first expansion device which reduces the pressure of the fluid, and forwards the fluid in a liquid state and with a lower pressure to the secondary cooling element, which transfers heat to the received fluid from the second electric components for evaporating the fluid.

Abstract: An evaporator for a cooling circuit is provided, for cooling at least one heat emitting device by evaporation of a cooling fluid. The evaporator includes a top collector, a bottom collector, and an evaporator body. The evaporator body includes at least one thermoconducting wall that is thermally connectable to the at least one heat emitting device, a plurality of evaporation channels, and a plurality of return channels.

Abstract: Exemplary embodiments are directed to a cooling apparatus for cooling a power electronic device, the apparatus including at least one panel that is adapted to be thermally connected to a heat source in order to receive heat from the heat source. The panel is also adapted to be thermally in contact with an air flow in order to transfer heat from the panel. The panel includes at least one hole between a first side of the panel and a second side of the panel. The hole is adapted to attenuate a vibrating air pressure generated by an acoustic noise source and carried by the air.

Abstract: A two-phase heat exchanger for cooling at least one electronic and/or electric component includes an evaporator and a condenser. The evaporator transfers heat from the electronic and/or electric component to a working fluid. The condenser includes a roll-bonded panel, which has a first channel which has a first connection port and a second connection port. The evaporator has a second channel and first connection openings and second connection openings. The first connection port of the first channel is connected to one first connection opening of the evaporator and the second connection port of the first channel is connected to one second connection opening of the evaporator and the working fluid is provided to convey heat by convection from the evaporator to the condenser by flowing from the second channel through the first connection opening or the second connection opening of the evaporator towards the first channel.

Abstract: A cooling module including a condenser, a power module including the cooling module and a method for cooling electric and/or electronic components are provided. The condenser of the cooling module includes at least one panel for cooling electric and/or electronic components. Two sheets of the panel are attached to one another by a process involving roll-bonding such that a conduit is formed between the two sheets. The conduit extends in a direction of a plane formed by the sheets. Cooling may be provided by evaporating coolant in the conduit at an evaporation section of the panel and by condensing the coolant at a condensing section of the panel. A heat load may be transferred from a heat source to a heat receiving unit. The heat receiving unit is adapted to transfer the heat load to the panel which transfers the heat load to an ambient environment by a thermal carrier.

Abstract: A power-electronic arrangement comprising semiconductor components (102, 103, 107), a heat exchanger (110), and an electrically conductive element (109) is presented. The heat exchanger comprises evaporator channels (111) and condenser channels (112) for working fluid. The electrically conductive element comprises a contact surface providing a thermal contact to outer surfaces of walls of the evaporator channels for transferring heat from the electrically conductive element to the evaporator channels. A main current terminal of each semiconductor component is bonded to the electrically conductive element which thus forms a part of a main current circuitry of a power system. As the main current terminal is directly bonded to the electrically conductive element cooled with the heat exchanger, the temperature gradients inside the semiconductor components can be kept moderate, and thus the temperatures inside the semiconductor components can be limited.

Abstract: Exemplary embodiments are directed to a cooling apparatus for cooling a power electronic device, the apparatus including at least one panel that is adapted to be thermally connected to a heat source in order to receive heat from the heat source. The panel is also adapted to be thermally in contact with an air flow in order to transfer heat from the panel. The panel includes at least one hole between a first side of the panel and a second side of the panel. The hole is adapted to attenuate a vibrating air pressure generated by an acoustic noise source and carried by the air.

Abstract: A cooling device for a circuit breaker which comprises a case having a front wall, a rear wall, an upper wall, a lower wall, two flanks, and a first series of side-by-side terminals and a second series of side-by-side terminals that protrude outside from the case for the connection of the circuit breaker with an electrical circuit. The cooling device includes at least one first body made of a thermal conducting material and which has a central portion suitable for being positioned transversally along and facing the first series of terminals so as to absorb heat generated at the first series of terminals, and a first end portion and a second end portion that protrude from the central portion and are configured so as to receive the heat absorbed by the central portion and to diffuse it outside the cooling device itself.

Abstract: An exemplary heat exchanger includes evaporator channels and condenser channels, connecting parts for providing fluid paths between evaporator channels and the condenser channels, a first heat transfer element for transferring a heat load to a fluid in said evaporator channels, and a second heat transfer element for transferring a heat load from a fluid in the condenser channels. In order to achieve a heat exchanger that can be used in any position, the evaporator channels and said condenser channels can have capillary dimensions. The connecting part arranged at a first end of heat exchanger can include a first fluid distribution element for conducting fluid from a predetermined condenser channel into a corresponding predetermined evaporator channel, and the connecting part arranged at a second end of the heat exchanger can include a second fluid distribution element for conducting fluid from a predetermined evaporator channel into a corresponding predetermined condenser channel.

Abstract: A power-electronic arrangement comprising semiconductor components (102, 103, 107), a heat exchanger (110), and an electrically conductive element (109) is presented. The heat exchanger comprises evaporator channels (111) and condenser channels (112) for working fluid. The electrically conductive element comprises a contact surface providing a thermal contact to outer surfaces of walls of the evaporator channels for transferring heat from the electrically conductive element to the evaporator channels. A main current terminal of each semiconductor component is bonded to the electrically conductive element which thus forms a part of a main current circuitry of a power system. As the main current terminal is directly bonded to the electrically conductive element cooled with the heat exchanger, the temperature gradients inside the semiconductor components can be kept moderate, and thus the temperatures inside the semiconductor components can be limited.

Abstract: An evaporator for a cooling circuit is provided, for cooling at least one heat emitting device by evaporation of a cooling fluid. The evaporator includes a top collector, a bottom collector, and an evaporator body. The evaporator body includes at least one thermoconducting wall that is thermally connectable to the at least one heat emitting device, a plurality of evaporation channels, and a plurality of return channels.

Abstract: A cooling device for a circuit breaker which comprises a case having a front wall, a rear wall, an upper wall, a lower wall, two flanks, and a first series of side-by-side terminals and a second series of side-by-side terminals that protrude outside from the case for the connection of the circuit breaker with an electrical circuit. The cooling device includes at least one first body made of a thermal conducting material and which has a central portion suitable for being positioned transversally along and facing the first series of terminals so as to absorb heat generated at the first series of terminals, and a first end portion and a second end portion that protrude from the central portion and are configured so as to receive the heat absorbed by the central portion and to diffuse it outside the cooling device itself.