Abstract: A linear LED system including a plurality of line light modules, each line light module comprising an extruded light module housing profile that extends along an axis and that has a profile wall defining an inner profile contour and an outer profile contour and of which a cross sectional view along a plane that is perpendicular to the axis is closed, wherein the profile wall in the cross sectional view defines a LED chamber. At least one LED-strip including a plurality of LEDs is accommodated in an associated LED chamber. The system further includes a plurality of interface modules, each interface module that connect the housing profiles and that an inner space in which at least one power supply module is accommodated so that the power supply module and any other electronic controller equipment is not, or at least to a lesser extend exposed to heat dissipated by the LEDs.

Abstract: A linear LED system including a plurality of line light modules, each line light module comprising an extruded light module housing profile that extends along an axis and that has a profile wall defining an inner profile contour and an outer profile contour and of which a cross sectional view along a plane that is perpendicular to the axis is closed, wherein the profile wall in the cross sectional view defines a LED chamber. At least one LED-strip including a plurality of LEDs is accommodated in an associated LED chamber. The system further includes a plurality of interface modules, each interface module that connect the housing profiles and that an inner space in which at least one power supply module is accommodated so that the power supply module and any other electronic controller equipment is not, or at least to a lesser extend exposed to heat dissipated by the LEDs.

Abstract: Assembly and method for depositing a thin film including: providing an expanding thermal plasma plume, including at least one chemical component to be deposited; designating a first and a second deposition zone within the plasma plume, such that the first and second deposition zones have a mutually different relative content of the chemical component; providing a substrate, and transporting said substrate through the plasma plume along a substrate transport path having a substrate transport path direction; and providing a mask that is at least partly disposed in the plasma plume and that shields a portion of the substrate transport path from being deposited on, wherein said shielded portion of the substrate transport path extends in the direction of the substrate transport path and bridges at least the first deposition zone, while it starts or terminates in the second deposition zone.

Abstract: A conveyor assembly suitable for use in a substrate processing system includes: at least one substrate carrier having a substrate-carrying surface configured to support at least one substrate; a processing track; a return track; a drive system configured to drive the substrate carrier along the processing track and the return track; and at least one swivel unit configured to pivot the substrate carrier around a substantially horizontal axis from a first orientation into a second orientation, and/or vice versa. Also provided is a method for conveying a substrate carrier including: providing a substrate carrier; positioning the substrate carrier in a first orientation; conveying the substrate carrier along a first track; and rotating the substrate carrier around a substantially horizontal axis into a second orientation.

Abstract: Method for manufacturing an organic light emitting device or a blank for forming therefrom an organic light emitting device as well as such a OLED or blank, the organic light emitting device having a light emitting area with two opposite first sides and two opposite second sides, the method comprising at least the following steps: providing a substrate; depositing and partly removing a layer of transparent conductive material on the substrate for forming parallel anode lines which extend between the first sides; depositing and partly removing at least one conductive layer for forming contacts which are connected anode lines; wherein a photoresist layer is deposited so that it fully extends over contacts adjacent the at least one second side except for at least one contact position per cathode line, via which an electric contact between a respective cathode line to be formed and a respective contact is established.

Abstract: A method for sterilizing contact lenses included in a moist environment in a closed package, wherein the package is heated, wherein the heating is carried out by introducing the package into a space which is at superatmospheric pressure or which is adjusted to superatmospheric pressure and which is heated with dry hot air. Further, the invention relates to an apparatus for carrying out such a method.

Abstract: Assembly and method for depositing a thin film including: providing an expanding thermal plasma plume, including at least one chemical component to be deposited; designating a first and a second deposition zone within the plasma plume, such that the first and second deposition zones have a mutually different relative content of the chemical component; providing a substrate, and transporting said substrate through the plasma plume along a substrate transport path having a substrate transport path direction; and providing a mask that is at least partly disposed in the plasma plume and that shields a portion of the substrate transport path from being deposited on, wherein said shielded portion of the substrate transport path extends in the direction of the substrate transport path and bridges at least the first deposition zone, while it starts or terminates in the second deposition zone.

Abstract: A cascade source provided with a cathode housing, a number of cascade plates insulated from each other and stacked on top of each other which together bound at least one plasma channel, and an anode plate provided with an outflow opening connecting to the plasma channel, wherein one cathode is provided per plasma channel, which cathode comprises an electrode which is adjustable relative to the cathode housing in the direction of the plasma channel, wherein the clamping provision is preferably of the collet chuck type. Also described is method for controlling the cascade source in use.

Abstract: An in-line process for making a thin film electronic device on a substrate is described comprising the steps of: a) depositing a structurable layer onto a substrate; b) depositing a patternable material onto the structurable layer in a first pattern; and c) etching the structurable layer in areas uncovered by the patternable material. The steps are carried out without intermediate exposure of the substrate to ambient air.

Abstract: A conveyor assembly suitable for use in a substrate processing system includes: at least one substrate carrier having a substrate-carrying surface configured to support at least one substrate; a processing track; a return track; a drive system configured to drive the substrate carrier along the processing track and the return track; and at least one swivel unit configured to pivot the substrate carrier around a substantially horizontal axis from a first orientation into a second orientation, and/or vice versa. Also provided is a method for conveying a substrate carrier including: providing a substrate carrier; positioning the substrate carrier in a first orientation; conveying the substrate carrier along a first track; and rotating the substrate carrier around a substantially horizontal axis into a second orientation.

Abstract: Method for manufacturing an organic light emitting device or a blank for forming therefrom an organic light emitting device as well as such a OLED or blank, the organic light emitting device having a light emitting area with two opposite first sides and two opposite second sides, the method comprising at least the following steps: providing a substrate; depositing and partly removing a layer of transparent conductive material on the substrate for forming parallel anode lines which extend between the first sides; depositing and partly removing at least one conductive layer for forming contacts which are connected anode lines; wherein a photoresist layer is deposited so that it fully extends over contacts adjacent the at least one second side except for at least one contact position per cathode line, via which an electric contact between a respective cathode line to be formed and a respective contact is established.

Abstract: A method for sterilizing contact lenses included in a moist environment in a closed package, wherein the package is heated, wherein the heating is carried out by introducing the package into a space which is at superatmospheric pressure or which is adjusted to superatmospheric pressure and which is heated with dry hot air. Further, the invention relates to an apparatus for carrying out such a method.

Abstract: The invention relates to a method for deposition of material by laser evaporation wherein the employed laser is a continuous or semi-continuous laser. Using such a laser, it is possible to evaporate the target material in a controlled manner from a local pool of liquid or fluidized target material at the target surface. The invention also provides a system for executing said method.

Abstract: A method and apparatus wherein a substrate is provided with a preformatted structure, with structural elements arranged in a matrix, wherein the matrix extends in an X-direction and Y-direction, wherein a processing head is provided, wherein a camera is provided which is connected with the processing head and which comprises at least one series of sensors arranged along a main line, wherein the camera scans the substrate and thereby provides at least one one-dimensional camera signal, wherein, for real-time determining at least the X-position and the Y-position of the structure with respect to the camera, the said main line includes an angle with the X-direction and with the Y-direction, wherein the angle is chosen such that the camera signal contains spatially separated X-position information and Y-position information and that the X-position information and the Y-position information can be separated from the sensor signal with the aid of signal processing.

Abstract: A method for treating a surface of at least one substrate, wherein the at least one substrate is placed in a process chamber, wherein the pressure in the process chamber is relatively low, wherein a plasma is generated by at least one plasma source, wherein, during the treatment, at least one plasma source (3) and/or at least one optionally provided treatment fluid supply source is moved relative to the substrate surface. The invention further provides an apparatus for treating a surface of at least one substrate, wherein the apparatus is provided with a process chamber and at least one plasma source, wherein the at least one plasma source (3) and/or at least one optionally provided treatment fluid supply source is movably arranged.

Abstract: A method and apparatus wherein a substrate is provided with a preformatted structure, with structural elements arranged in a matrix, wherein the matrix extends in an X-direction and Y-direction, wherein a processing head is provided, wherein a camera is provided which is connected with the processing head and which comprises at least one series of sensors arranged along a main line, wherein the camera scans the substrate and thereby provides at least one one-dimensional camera signal, wherein, for real-time determining at least the X-position and the Y-position of the structure with respect to the camera, the said main line includes an angle with the X-direction and with the Y-direction, wherein the angle is chosen such that the camera signal contains spatially separated X-position information and Y-position information and that the X-position information and the Y-position information can be separated from the sensor signal with the aid of signal processing.

Abstract: Method for manufacturing a light emitting device, the light emitting device having a light emitting area, the method comprising at least the following steps: —providing a substrate; —providing at least one first electrode on the substrate; —forming first contacts which are connected to the at least one first electrode; —forming second contacts which are arranged for contacting at least one second electrode; —forming a conductive interconnection between the first and the second contacts before the at least one second electrode is formed; —after having applied the conductive layer for forming the at least one second electrode on the substrate removing the conductive interconnection between the first and second contacts.

Abstract: An embodiment of the present invention relates to an in-line process for making a thin film electronic device on a substrate. The process includes depositing a structurable layer onto a substrate and depositing photoresist material onto the structurable layer in a first pattern. The process also includes developing the photoresist material, etching the structurable layer in areas uncovered by the photoresist material and removing the remaining photoresist material. The process may be performed without intermediate exposure of the substrate to ambient air.

Abstract: Apparatus for performing at least one processing operation on a substrate, the apparatus being provided with at least one process chamber and a vacuum lock for the purposes of placing the substrate from the surroundings into a process chamber without the reduced pressure in the respective process chamber being lost, the vacuum lock comprising a vacuum chamber which is bounded by a number of walls and to which a vacuum pump is connected, while in one of the walls at least one supply opening is provided, and for the purpose of the or each process chamber in one of the walls a process chamber opening belonging to a respective process chamber is provided, the at least one supply opening being externally closable with an outer cover and being closable from the vacuum chamber with an inner cover. Further disclosed is an assembly of such an apparatus with a transport device for supplying substrates to a supply opening of the vacuum lock and removing same.

Abstract: A method for the passivation of a semiconductor substrate, wherein a SiNx:H layer is deposited on the surface of the substrate (1) by means of a PECVD process comprising the following steps: the substrate (1) is placed in a processing chamber (5) which has specific internal processing chamber dimensions; the pressure in the processing chamber is maintained at a relatively low value; the substrate (1) is maintained at a specific treatment temperature; a plasma (P) is generated by at least one plasma cascade source (3) mounted on the processing chamber (5) at a specific distance (L) from the substrate surface; at least a part of the plasma (P) generated by each source (3) is brought into contact with the substrate surface; and flows of silane and ammonia are supplied to said part of the plasma (P).