Abstract: “Click-assembly” methods of assembling a sensor for sensing biologically-active molecules by measuring impedance changes, are disclosed, comprising supporting a bio-sensor on a carrier, the bio-sensor comprising an electronic component having at least one micro-electrode and at least one electrical contact, functionalizing the bio-sensor by physically or chemically coupling a bio-receptor molecule to each of the at least one micro-electrode, and subsequently assembling the bio-sensor with a micro-fluidic unit by means of a clamp which clamps the bio-sensor with the micro-fluidic unit, such that in use a fluid introduced into the micro-fluidic unit is able to contact the bio-receptor and is isolated from the electrical contact. The clamp may be a spring, and the method may avoid a requirement for sealing by chemical or thermal means and thereby avoid damaging the bio-receptor. Sensors which can be assembled according to such methods are also disclosed.

Abstract: An electrochemical sensor device (100) for analysing a sample, the device (100) comprising an electronic chip (101) comprising a sensor portion (102) being sensitive for particles of the sample, a carrier element (103, 104) bonded to the electronic chip (101) to define a fluidic path together with the electronic chip (101), and a counter electrode (105) provided in a surface portion of the carrier element (103, 104).

Abstract: The invention provides a method of fabricating an extremely short-length dual-gate FET, using conventional semi-conductor processing techniques, with extremely small and reproducible fins with a pitch and a width that are both smaller than can be obtained with photolithographic techniques. On a protrusion (2) on a substrate (1), a first layer (3) and a second layer (4) are formed, after which the top surface of the protrusion (2) is exposed. A portion of the first layer (3) is selectively removed relative to the protrusion (2) and the second layer (4), thereby creating a fin (6) and a trench (5). Also a method is presented to form a plurality of fins (6) and trenches (5). The dual-gate FET is created by forming a gate electrode (7) in the trench(es) (5) and a source and drain region. Further a method is presented to fabricate an extremely short-length asymmetric dual-gate FET with two gate electrodes that can be biased separately.

Abstract: A data processing device has a memory with writeable and erasable locations, such as a flash memory. The memory locations are store WOM codewords (Write Once Memory codewords in which successive generations of data can be encoded by setting bits from zero to one only). A data encoder encodes a received data value in a new codeword from the WOM code, as a function of the received data value and a previous codeword stored in the currently selected location. When the WOM codeword is exhausted the data encoder selects a new currently selected location from a logical series of locations and stores the new codeword in the new currently selected location. When all locations are exhausted a reset circuit resets a content of the locations in the logical series. On reading the currently selected location is read and decoded.

Abstract: The invention provides a method of fabricating an extremely short-length dual-gate FET, using conventional semi-conductor processing techniques, with extremely small and reproducible fins with a pitch and a width that are both smaller than can be obtained with photolithographic techniques. On a protrusion (2) on a substrate (1), a first layer (3) and a second layer (4) are formed, after which the top surface of the protrusion (2) is exposed. A portion of the first layer (3) is selectively removed relative to the protrusion (2) and the second layer (4), thereby creating a fin (6) and a trench (5). Also a method is presented to form a plurality of fins (6) and trenches (5). The dual-gate FET is created by forming a gate electrode (7) in the trench(es) (5) and a source and drain region. Further a method is presented to fabricate an extremely short-length asymmetric dual-gate FET with two gate electrodes that can be biased separately.

Abstract: The electric device (100) according to the invention has a resistor comprising a layer (7, 107) of a phase change material which is changeable between a first phase with a first electrical resistivity and a second phase with a second electrical resistivity different from the first electrical resistivity. The phase change material is a fast growth material. The electric device (100) further comprises a switching signal generator (400) for switching the resistor between at least three different electrical resistance values by changing a corresponding portion of the layer (7, 107) of the phase change material from the first phase to the second phase.

Abstract: A method for fabricating an electronic device or circuit, respectively, comprises providing a flexible substrate (1), defining onto the flexible substrate (1) electric components (2, 3, 3?, 3?, 3??, 7, 11, 12) and interconnects (8), introducing out breaks (4, 4?, 4?, 4a-4s) in the flexible substrate (1) between the electric components and/or interconnects, and forming the flexible substrate (1) into a deformed configuration by deforming, particularly folding, parts of the flexible substrate as determined by the breaks (4, 4?, 4?, 4a-4s).

Abstract: The electric device (1, 100) has a body (2, 102) having a resistor (7, 107) comprising a phase change material being changeable between a first phase and a second phase. The resistor (7, 107) has a first electrical resistance when the phase change material is in the first phase and a second electrical resistance, different from the first electrical resistance, when the phase change material is in the second phase. The body (2, 102) further has a heating element (6, 106) being able to conduct a current for enabling a transition from the first phase to the second phase. The heating element (6, 106) is arranged in parallel with the resistor (7, 107).

Abstract: Fabrication of a memory cell, the cell including a first floating gate stack (A), a second floating gate stack (B) and an intermediate access gate (AG), the floating gate stacks (A, B) including a first gate oxide (4), a floating gate (FG), a control gate (CG; CGl, CGu), an interpoly dielectric layer (8), a capping layer (6) and side-wall spacers (10), the cell further including source and drain contacts (22), wherein the fabrication includes: defining the floating gate stacks in the same processing steps to have equal heights; depositing over the floating gate stacks a poly-Si layer (12) with a larger thickness than the floating gate stacks' height; planarizing the poly-Si layer (12); defining the intermediate access gate (AG) in the planarized poly-Si layer (14) by means of an access gate masking step over the poly-Si layer between the floating gate stacks and a poly-Si etching step.

Abstract: A device contains a memory that stores a WOM codeword that encodes successive generations of data values. When the codeword must be updated to represent a new data value, the device determines which updates of the dataword can be realized by feasible single bit updates to the WOM (Write Once Memory) codeword. If no feasible single bit update is possible, feasible two-bit updates are considered. Under control of the new data values a connection circuit routes feasibility signals for various updates, that signal the single-bit feasibility of the updates. Routing brings together pairs of feasibility signals for updates that together produce a WOM codeword that encodes the new data value. A pair is selected in which both feasibility signals indicate feasibility and the codeword is updated according to the updates involved in the pair.

Abstract: The electric device (100) has a body (102) having a resistor (107) comprising a phase change material being changeable between a first phase and a second phase. The resistor (107) has a first electrical resistance when the phase change material is in the first phase, and a second electrical resistance, different from the first electrical resistance, when the phase change material is in the second phase. The phase change material constitutes a conductive path between a first contact area and a second contact area. A cross-section of the conductive path is smaller than the first contact area and the second contact area. The body (102) may further have a heating element 106 being able to conduct a current for enabling a transition from the first phase to the second phase. The heating element (106) is preferably arranged in parallel with the resistor (107).

Abstract: Method of manufacturing a semiconductor device comprising a semiconductor body (1) which is provided at a surface (2) with a non-volatile memory comprising a memory cell with a gate structure (4) with an access gate (19) and a gate structure (3) with a control gate (5) and a charge storage region situated between the control gate (5) and the semiconductor body (1), such as a floating gate (6). In this method on the surface (2) of the semiconductor body (1) a first one of said gate structures is formed with side walls (10) extending substantially perpendicular to the surface, a conductive layer is deposited (13) on and next to said first gate-structure, the conductive layer is subjected to a planarizing treatment until the first gate structure is exposed and the so planarized conductive layer is patterned so as to form at least a part of the other gate structure adjoining the first gate structure.

Abstract: The present invention relates to electronic memories, more particularly to an improved method and apparatus to read the content of compact 2-transistor flash memory cells. A method of reading a 2-transistor flash memory cell 1 is provided. The memory cell 1 comprises a storage transistor 2 with a storage gate 6 and a selecting transistor 3 with a select gate 7. The method comprises leaving the storage gate 6 floating while the select gate 7 is switched from a first voltage to a second voltage, whereby the first voltage is lower than the second voltage. A device according to the present invention comprises a switching circuit for leaving the storage gate 6 floating while the select gate 7 is switched from the first voltage to the second voltage, the first voltage being lower than the second voltage.

Abstract: A method of manufacturing a semiconductor device comprising a non-volatile memory with memory cells (Mij) including a select transistor (T1) with a select gate (1) and including a memory transistor (T2) with a floating gate (2) and a control gate (3). In a semiconductor body (10), active semiconductor regions are formed which are mutually insulated by field oxide regions (12). Next, the surface (11) is provided with a gate oxide layer (14) and a first layer of a conductive material wherein the select gate (1) is etched. Subsequently, the walls of the select gate extending perpendicularly to the surface are provided with an isolating material (17). The gate oxide next to the select gate is replaced by a layer of tunnel oxide (18). Next, a second layer of a conductive material (21), an interlayer dielectric (25) and a third layer of a conductive material (26) are deposited. The control gate (3) extending above and next to the select gate is formed in the third layer.

Abstract: A semiconductor device includes a semiconductor body (1) which is provided at a surface (2) with a non-volatile memory cell comprising a source (3) and a drain (4), and an access gate (14) which is electrically insulated from a gate structure (8) comprising a control gate (9), the gate structure (8) being electrically insulated from the semiconductor body (1) by a gate dielectric (11, 25). The gate dielectric (11, 25) is provided with a charge-storage region wherein data in the form of electric charge can be stored. The access gate (14) has a substantially flat surface portion (17) extending substantially parallel to the surface (2) of the semiconductor body (1) and has the shape of a block which is disposed against the gate structure (8) without overlapping the gate structure.

Abstract: Method of manufacturing a semiconductor device comprising a semiconductor body (1) which is provided at a surface (2) with a non-volatile memory comprising a memory cell with a gate structure (4) with an access gate (19) and a gate structure (3) with a control gate (5) and a charge storage region situated between the control gate (5) and the semiconductor body (1), such as a floating gate (6). In this method on the surface (2) of the semiconductor body (1) a first one of said gate structures is formed with side walls (10) extending substantially perpendicular to the surface, a conductive layer is deposited (13) on and next to said first gate-structure, the conductive layer is subjected to a planarizing treatment until the first gate structure is exposed and the so planarized conductive layer is patterned so as to form at least a part of the other gate structure adjoining the first gate structure.

Abstract: A method of manufacturing a semiconductor device comprising a non-volatile memory with memory cells (Mij) including a select transistor (T1) with a select gate (1) and including a memory transistor (T2) with a floating gate (2) and a control gate (3). In a semiconductor body (10), active semiconductor regions are formed which are mutually insulated by field oxide regions (12). Next, the surface (11) is provided with a gate oxide layer (14) and a first layer of a conductive material wherein the select gate (1) is etched. Subsequently, the walls of the select gate extending perpendicularly to the surface are provided with an isolating material (17). The gate oxide next to the select gate is replaced by a layer of tunnel oxide (18). Next, a second layer of a conductive material (21), an interlayer dielectric (25) and a third layer of a conductive material (26) are deposited. The control gate (3) extending above and next to the select gate is formed in the third layer.

Abstract: A device contains a memory that stores a WOM codeword that encodes successive generations of data values. When the codeword must be updated to represent a new data value, the device determines which updates of the dataword can be realized by feasible single bit updates to the WOM codeword. If no feasible single bit update is possible, feasible two-bit updates are considered. Under control of the new data values a connection circuit routes feasibility signals for various updates, that signal the single-bit feasibility of the updates. Routing brings together pairs of feasibility signals for updates that together produce a WOM codeword that encodes the new data value. A pair is selected in which both feasibility signals indicate feasibility and the codeword is updated according to the updates involved in the pair. Preferably, the routing is realized with a connection circuit that comprises a number of layers of subcircuits, each routing the feasibility signals dependent on a respective bit of the new dataword.

Abstract: A device contains a memory that stores a WOM codeword that encodes successive generations of data values. When the codeword must be updated to represent a new data value, the device determines which updates of the dataword can be realized by feasible single bit updates to the WOM codeword. If no feasible single bit update is possible, feasible two-bit updates are considered. Under control of the new data values a connection circuit routes feasibility signals for various updates, that signal the single-bit feasibility of the updates. Routing brings together pairs of feasibility signals for updates that together produce a WOM codeword that encodes the new data value. A pair is selected in which both feasibility signals indicate feasibility and the codeword is updated according to the updates involved in the pair. Preferably, the routing is realized with a connection circuit that comprises a number of layers of subcircuits, each routing the feasibility signals dependent on a respective bit of the new dataword.

Abstract: A semiconductor device comprises a semiconductor body (1) which is provided at a surface (2) with a non-volatile memory cell comprising a source (3) and a drain (4), and an access gate (14) which is electrically insulated from a gate structure (8) comprising a control gate (9), the gate structure (8) being electrically insulated from the semiconductor body (1) by a gate dielectric (11,25). The gate dielectric (11,25) is provided with a charge-storage region wherein data in the form of electric charge can be stored. The access gate (14) has a substantially flat surface portion (17) extending substantially parallel to the surface (2) of the semiconductor body (1) and has the shape of a block which is disposed against the gate structure (8) without overlapping the gate structure (8).