Patents by Inventor Franco De Flaviis
Franco De Flaviis has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11901635Abstract: An apparatus includes a plurality of antenna modules and a printed circuit board (PCB) having a plurality of holes embedded with a heat sink. Each antenna module includes an antenna substrate, a plurality of three-dimensional (3-D) antenna cells mounted on a first surface of the antenna substrate, and a plurality of packaged circuitry mounted on a second surface of the antenna substrate. The plurality of packaged circuitry are electrically connected with the plurality of 3-D antenna cells. Each of the plurality of antenna modules is mounted on a plurality of portions of the heat sink such that a corresponding packaged circuitry of the plurality of packaged circuitry is in a direct contact with the plurality of portions of the heat sink embedded within the plurality of holes.Type: GrantFiled: August 30, 2022Date of Patent: February 13, 2024Assignee: MOVANDI CORPORATIONInventors: Seunghwan Yoon, Franco De Flaviis, Alfred Grau Besoli, Kartik Sridharan, Ahmadreza Rofougaran, Michael Boers, Sam Gharavi, Donghyup Shin, Farid Shirinfar, Stephen Wu, Maryam Rofougaran
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Patent number: 11855356Abstract: An apparatus includes a plurality of antenna modules and a printed circuit board (PCB) having a plurality of holes embedded with a heat sink. Each antenna module includes an antenna substrate, a plurality of three-dimensional (3-D) antenna cells mounted on a first surface of the antenna substrate, and a plurality of packaged circuitry mounted on a second surface of the antenna substrate. The plurality of packaged circuitry are electrically connected with the plurality of 3-D antenna cells. Each of the plurality of antenna modules is mounted on a plurality of portions of the heat sink such that a corresponding packaged circuitry of the plurality of packaged circuitry is in a direct contact with the plurality of portions of the heat sink embedded within the plurality of holes.Type: GrantFiled: August 30, 2022Date of Patent: December 26, 2023Assignee: MOVANDI CORPORATIONInventors: Seunghwan Yoon, Franco De Flaviis, Alfred Grau Besoli, Kartik Sridharan, Ahmadreza Rofougaran, Michael Boers, Sam Gharavi, Donghyup Shin, Farid Shirinfar, Stephen Wu, Maryam Rofougaran
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Publication number: 20230006362Abstract: An antenna module that includes an antenna substrate, a plurality of three-dimensional (3-D) antenna cells on a first surface of the antenna substrate, a plurality of packaged circuitry on a second surface of the antenna substrate, and a plurality of supporting balls mounted on the second surface of the antenna substrate. The plurality of packaged circuitry includes a plurality of radio-frequency (RF) chips on the second surface of the antenna substrate. Each of the plurality of 3-D antenna cells comprises a raised antenna patch with a plurality of projections and a plurality of supporting legs, where at least a relief cut is provided between one of the plurality of projections and one of the plurality of supporting legs.Type: ApplicationFiled: September 13, 2022Publication date: January 5, 2023Inventors: Seunghwan Yoon, Zhihui Wang, Franco De Flaviis, Alfred Grau Besoli, Kartik Sridharan, Ahmadreza Rofougaran, Michael Boers, Sam Gharavi, Donghyup Shin, Farid Shirinfar, Stephen Wu, Maryam Rofougaran
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Publication number: 20220416442Abstract: An apparatus includes a plurality of antenna modules and a printed circuit board (PCB) having a plurality of holes embedded with a heat sink. Each antenna module includes an antenna substrate, a plurality of three-dimensional (3-D) antenna cells mounted on a first surface of the antenna substrate, and a plurality of packaged circuitry mounted on a second surface of the antenna substrate. The plurality of packaged circuitry are electrically connected with the plurality of 3-D antenna cells. Each of the plurality of antenna modules is mounted on a plurality of portions of the heat sink such that a corresponding packaged circuitry of the plurality of packaged circuitry is in a direct contact with the plurality of portions of the heat sink embedded within the plurality of holes.Type: ApplicationFiled: August 30, 2022Publication date: December 29, 2022Inventors: Seunghwan Yoon, Franco De Flaviis, Alfred Grau Besoli, Kartik Sridharan, Ahmadreza Rofougaran, Michael Boers, Sam Gharavi, Donghyup Shin, Farid Shirinfar, Stephen Wu, Maryam Rofougaran
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Patent number: 11509067Abstract: An apparatus comprising at least a plurality of antenna modules mounted on a printed circuit board (PCB) is disclosed. The PCB includes a plurality of holes embedded with a heat sink. Each antenna module comprises an antenna substrate. Each antenna module further comprises a plurality of three-dimensional (3-D) antenna cells that are mounted on a first surface of the antenna substrate. Each antenna module further comprises a plurality of packaged circuitry that are mounted on a second surface of the antenna substrate. The plurality of packaged circuitry are electrically connected with the plurality of 3-D antenna cells. Furthermore, each antenna module is mounted on the plurality of holes via a corresponding packaged circuitry of the plurality of packaged circuitry.Type: GrantFiled: October 1, 2020Date of Patent: November 22, 2022Assignee: Movandi CorporationInventors: Seunghwan Yoon, Zhihui Wang, Franco De Flaviis, Alfred Grau Besoli, Kartik Sridharan, Ahmadreza Rofougaran, Michael Boers, Sam Gharavi, Donghyup Shin, Farid Shirinfar, Stephen Wu, Maryam Rofougaran
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Patent number: 11509066Abstract: Provided is an apparatus including a plurality of antenna modules and a printed circuit board (PCB) having a plurality of holes embedded with a heat sink. Each antenna module includes an antenna substrate, a plurality of three-dimensional (3-D) antenna cells mounted on a first surface of the antenna substrate, and a plurality of packaged circuitry mounted on a second surface of the antenna substrate. The plurality of packaged circuitry are electrically connected with the plurality of 3-D antenna cells. Each antenna module is mounted on the plurality of holes via a corresponding packaged circuitry of the plurality of packaged circuitry.Type: GrantFiled: August 27, 2020Date of Patent: November 22, 2022Assignee: SILICON VALLEY BANKInventors: Seunghwan Yoon, Franco De Flaviis, Alfred Grau Besoli, Kartik Sridharan, Ahmadreza Rofougaran, Michael Boers, Sam Gharavi, Donghyup Shin, Farid Shirinfar, Stephen Wu, Maryam Rofougaran
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Patent number: 11476590Abstract: An apparatus comprising at least a plurality of antenna modules mounted on a printed circuit board (PCB) is disclosed. The PCB includes a plurality of holes embedded with a heat sink. Each antenna module comprises an antenna substrate. Each antenna module further comprises a plurality of three-dimensional (3-D) antenna cells that are mounted on a first surface of the antenna substrate. Each antenna module further comprises a plurality of packaged circuitry that are mounted on a second surface of the antenna substrate. The plurality of packaged circuitry are electrically connected with the plurality of 3-D antenna cells. Furthermore, each antenna module is mounted on the plurality of holes via a corresponding packaged circuitry of the plurality of packaged circuitry.Type: GrantFiled: October 1, 2020Date of Patent: October 18, 2022Assignee: Movandi CorporationInventors: Seunghwan Yoon, Zhihui Wang, Franco De Flaviis, Alfred Grau Besoli, Kartik Sridharan, Ahmadreza Rofougaran, Michael Boers, Sam Gharavi, Donghyup Shin, Farid Shirinfar, Stephen Wu, Maryam Rofougaran
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Patent number: 11469521Abstract: Provided is an apparatus including a plurality of antenna modules and a printed circuit board (PCB) having a plurality of holes embedded with a heat sink. Each antenna module includes an antenna substrate, a plurality of three-dimensional (3-D) antenna cells mounted on a first surface of the antenna substrate, and a plurality of packaged circuitry mounted on a second surface of the antenna substrate. The plurality of packaged circuitry are electrically connected with the plurality of 3-D antenna cells. Each antenna module is mounted on the plurality of holes via a corresponding packaged circuitry of the plurality of packaged circuitry.Type: GrantFiled: August 27, 2020Date of Patent: October 11, 2022Assignee: SILICON VALLEY BANKInventors: Seunghwan Yoon, Franco De Flaviis, Alfred Grau Besoli, Kartik Sridharan, Ahmadreza Rofougaran, Michael Boers, Sam Gharavi, Donghyup Shin, Farid Shirinfar, Stephen Wu, Maryam Rofougaran
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Publication number: 20210080533Abstract: Single antenna direction finding is performed by physically moving a device to different device positions. As the device is physically moved, signal processing hardware within the device is used to make a plurality of signal response measurements of a signal detected by a single antenna of the device. The signal emanates from an object. The plurality of signal response measurements are made by sampling signal response at a plurality of sample times. A means for 3-dimensional positioning makes a plurality of inertial measurements at the plurality of sample times. The plurality of signal response measurements and the plurality of inertial measurements are used to produce a virtual response array vector. The virtual response array vector is used to calculate a direction of arrival from the object to the device.Type: ApplicationFiled: November 25, 2020Publication date: March 18, 2021Inventors: Franco De Flaviis, Saman Kabiri, Evangelos Kornaros
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Patent number: 10916861Abstract: An apparatus comprising at least a plurality of antenna modules mounted on a printed circuit board (PCB) is disclosed. The PCB includes a plurality of holes embedded with a heat sink. Each antenna module comprises an antenna substrate. Each antenna module further comprises a plurality of three-dimensional (3-D) antenna cells that are mounted on a first surface of the antenna substrate. Each antenna module further comprises a plurality of packaged circuitry that are mounted on a second surface of the antenna substrate. The plurality of packaged circuitry are electrically connected with the plurality of 3-D antenna cells. Furthermore, each antenna module is mounted on the plurality of holes via a corresponding packaged circuitry of the plurality of packaged circuitry.Type: GrantFiled: May 30, 2017Date of Patent: February 9, 2021Assignee: MOVANDI CORPORATIONInventors: Seunghwan Yoon, Zhihui Wang, Franco De Flaviis, Alfred Grau Besoli, Kartik Sridharan, Ahmadreza Rofougaran, Michael Boers, Sam Gharavi, Donghyup Shin, Farid Shirinfar, Stephen Wu, Maryam Rofougaran
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Publication number: 20210028555Abstract: An apparatus comprising at least a plurality of antenna modules mounted on a printed circuit board (PCB) is disclosed. The PCB includes a plurality of holes embedded with a heat sink. Each antenna module comprises an antenna substrate. Each antenna module further comprises a plurality of three-dimensional (3-D) antenna cells that are mounted on a first surface of the antenna substrate. Each antenna module further comprises a plurality of packaged circuitry that are mounted on a second surface of the antenna substrate. The plurality of packaged circuitry are electrically connected with the plurality of 3-D antenna cells. Furthermore, each antenna module is mounted on the plurality of holes via a corresponding packaged circuitry of the plurality of packaged circuitry.Type: ApplicationFiled: October 1, 2020Publication date: January 28, 2021Inventors: Seunghwan Yoon, Zhihui Wang, Franco De Flaviis, Alfred Grau Besoli, Kartik Sridharan, Ahmadreza Rofougaran, Michael Boers, Sam Gharavi, Donghyup Shin, Farid Shirinfar, Stephen Wu, Maryam Rofougaran
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Patent number: 10879622Abstract: An apparatus comprising at least a plurality of antenna modules mounted on a printed circuit board (PCB) is disclosed. The PCB includes a plurality of holes embedded with a heat sink. Each antenna module comprises an antenna substrate. Each antenna module further comprises a plurality of three-dimensional (3-D) antenna cells that are mounted on a first surface of the antenna substrate. Each antenna module further comprises a plurality of packaged circuitry that are mounted on a second surface of the antenna substrate. The plurality of packaged circuitry are electrically connected with the plurality of 3-D antenna cells. Furthermore, each antenna module is mounted on the plurality of holes via a corresponding packaged circuitry of the plurality of packaged circuitry.Type: GrantFiled: May 30, 2017Date of Patent: December 29, 2020Assignee: MOVANDI CORPORATIONInventors: Seunghwan Yoon, Zhihui Wang, Franco De Flaviis, Alfred Grau Besoli, Kartik Sridharan, Ahmadreza Rofougaran, Michael Boers, Sam Gharavi, Donghyup Shin, Farid Shirinfar, Stephen Wu, Maryam Rofougaran
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Publication number: 20200395682Abstract: Provided is an apparatus including a plurality of antenna modules and a printed circuit board (PCB) having a plurality of holes embedded with a heat sink. Each antenna module includes an antenna substrate, a plurality of three-dimensional (3-D) antenna cells mounted on a first surface of the antenna substrate, and a plurality of packaged circuitry mounted on a second surface of the antenna substrate. The plurality of packaged circuitry are electrically connected with the plurality of 3-D antenna cells. Each antenna module is mounted on the plurality of holes via a corresponding packaged circuitry of the plurality of packaged circuitry.Type: ApplicationFiled: August 27, 2020Publication date: December 17, 2020Inventors: Seunghwan Yoon, Franco De Flaviis, Alfred Grau Besoli, Kartik Sridharan, Ahmadreza Rofougaran, Michael Boers, Sam Gharavi, Donghyup Shin, Farid Shirinfar, Stephen Wu, Maryam Rofougaran
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Patent number: 10797404Abstract: An apparatus comprising at least a plurality of antenna modules mounted on a printed circuit board (PCB) is disclosed. The PCB includes a plurality of holes embedded with a heat sink. Each antenna module comprises an antenna substrate. Each antenna module further comprises a plurality of three-dimensional (3-D) antenna cells that are mounted on a first surface of the antenna substrate. Each antenna module further comprises a plurality of packaged circuitry that are mounted on a second surface of the antenna substrate. The plurality of packaged circuitry are electrically connected with the plurality of 3-D antenna cells. Furthermore, each antenna module is mounted on the plurality of holes via a corresponding packaged circuitry of the plurality of packaged circuitry.Type: GrantFiled: May 30, 2017Date of Patent: October 6, 2020Assignee: MOVANDI CORPORATIONInventors: Seunghwan Yoon, Zhihui Wang, Franco De Flaviis, Alfred Grau Besoli, Kartik Sridharan, Ahmadreza Rofougaran, Michael Boers, Sam Gharavi, Donghyup Shin, Farid Shirinfar, Stephen Wu, Maryam Rofougaran
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Patent number: 10374274Abstract: A multifunctional electromagnetic structure is presently disclosed. Said structure is a true electromagnetic bandgap (“EBG”) material, with both surface and leaky waves suppressed from the whole structure along all lateral directions. It is also an antenna element, configured to radiate to the broadside direction. The structure has two metallization layers of concentric rings between a square-shaped radiating top metal layer and a bottom ground plane. The lower concentric ring is connected to the ground plane through a plurality of vias, while the patch of the top metal layer is fed with a probe. The EBG unit cells may be used as antenna elements in a phased array environment, where they eliminate scan blindness from the array structure along all scan directions.Type: GrantFiled: October 17, 2017Date of Patent: August 6, 2019Assignee: The Regents of the University of CaliforniaInventors: Enver Adas, Franco De Flaviis, Nicolaos G. Alexopoulos
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Publication number: 20180351262Abstract: An apparatus comprising at least a plurality of antenna modules mounted on a printed circuit board (PCB) is disclosed. The PCB includes a plurality of holes embedded with a heat sink. Each antenna module comprises an antenna substrate. Each antenna module further comprises a plurality of three-dimensional (3-D) antenna cells that are mounted on a first surface of the antenna substrate. Each antenna module further comprises a plurality of packaged circuitry that are mounted on a second surface of the antenna substrate. The plurality of packaged circuitry are electrically connected with the plurality of 3-D antenna cells. Furthermore, each antenna module is mounted on the plurality of holes via a corresponding packaged circuitry of the plurality of packaged circuitry.Type: ApplicationFiled: May 30, 2017Publication date: December 6, 2018Inventors: Seunghwan Yoon, Zhihui Wang, Franco De Flaviis, Alfred Grau Besoli, Kartik Sridharan, Ahmadreza Rofougaran, Michael Boers, Sam Gharavi, Donghyup Shin, Farid Shirinfar, Stephen Wu, Maryam Rofougaran
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Patent number: 10062965Abstract: A phased array antenna panel includes an array of antenna cells. Optionally, the phased array antenna panel includes a frame with multiple shielding fences housing the array of antenna cells. Each antenna cell includes a raised antenna patch with air dielectric. In one example, the raised antenna patch may include four projections having outwardly increasing widths, and four supporting legs, each of the four supporting legs situated between a pair of adjacent projections. A first differential feed port may be coupled to first and second supporting legs of the raised antenna patch through first and second transformers, and a second differential feed port may be coupled to third and fourth supporting legs of the raised antenna patch through third and fourth transformers. A return loss in a frequency range of between 27.5 GHz and 29.5 GHz of each antenna cell is less than about ?10 dB.Type: GrantFiled: April 14, 2017Date of Patent: August 28, 2018Assignee: Movandi CorporationInventors: Franco De Flaviis, Seunghwan Yoon
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Publication number: 20180108989Abstract: A phased array antenna panel includes an array of antenna cells. Optionally, the phased array antenna panel includes a frame with multiple shielding fences housing the array of antenna cells. Each antenna cell includes a raised antenna patch with air dielectric. In one example, the raised antenna patch may include four projections having outwardly increasing widths, and four supporting legs, each of the four supporting legs situated between a pair of adjacent projections. A first differential feed port may be coupled to first and second supporting legs of the raised antenna patch through first and second transformers, and a second differential feed port may be coupled to third and fourth supporting legs of the raised antenna patch through third and fourth transformers. A return loss in a frequency range of between 27.5 GHz and 29.5 GHz of each antenna cell is less than about ?10 dB.Type: ApplicationFiled: April 14, 2017Publication date: April 19, 2018Inventors: Franco De Flaviis, Seunghwan Yoon
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Publication number: 20180108964Abstract: A multifunctional electromagnetic structure is presently disclosed. Said structure is a true electromagnetic bandgap (“EBG”) material, with both surface and leaky waves suppressed from the whole structure along all lateral directions. It is also an antenna element, configured to radiate to the broadside direction. The structure has two metallization layers of concentric rings between a square-shaped radiating top metal layer and a bottom ground plane. The lower concentric ring is connected to the ground plane through a plurality of vias, while the patch of the top metal layer is fed with a probe. The EBG unit cells may be used as antenna elements in a phased array environment, where they eliminate scan blindness from the array structure along all scan directions.Type: ApplicationFiled: October 17, 2017Publication date: April 19, 2018Inventors: Enver Adas, Franco De Flaviis, Nicolaos G. Alexopoulos
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Patent number: 9379785Abstract: A near field RFID system includes an RFID reader and an RFID tag. The RFID reader includes a transmit path and a receive path, wherein the transmit path includes: an encoding section coupled to convert data into encoded data; a digital to analog conversion module coupled to convert the encoded data into an analog encoded signal; a power amplifier coupled to amplify the analog encoded signal; and a plurality of coils coupled to generate a plurality of electromagnetic fields from the analog encoded signal. The RFID tag that includes: a coil coupled to generate a current and a recovered signal from at least one of the plurality of electromagnetic fields; a power recovery circuit coupled to generate a voltage from the current; and a data processing section coupled to process the recovered signal, wherein the data processing section is powered via the voltage.Type: GrantFiled: January 3, 2011Date of Patent: June 28, 2016Assignee: BROADCOM CORPORATIONInventors: Amin Shameli, Aminghasem Safarian, Ahmadreza (Reza) Rofougaran, Maryam Rofougaran, Franco De Flaviis