Abstract: The aim the disclosed process is to ensure maximum precision both at the level of the manufacturing of an electronic assembly from a chip with small dimensions as well as the level of the placement of such an assembly on an insulating substrate. This aim is achieved by a placement process on a support, called substrate, of at least one electronic assembly consisting of a chip including at least one electric contact on one of its faces, said contact being connected to a segment of conductive track, and said placement being carried out by means of a placement device holding and positioning said assembly on the substrate, comprising the following steps: formation of a segment of conductive track having a predetermined outline, transfer of the track segment onto the placement device, seizing of the chip with the placement device carrying the track segment in such a way that said track segment is placed on at least one contact of the chip.

Abstract: The electronic card (2) includes an electronic unit (6), an electric energy source (10), a switch (12) that can be actuated by a user of the electronic card and an application introduced into said electronic unit. It further includes means for detecting actuation of said switch, which determine whether said actuation corresponds to a pulse whose duration is comprised within a certain predetermined time range or to a series of pulses defining a digital signal with a time profile wherein at least one given parameter has a value comprised within a certain predetermined time range, said application being actuated or the actuation thereof validated when said detection means have detected said pulse or said series of pulses. In particular, the switch is associated with a push-button or an elastically deformable zone (14) of the electronic card.

Abstract: The invention concerns an electronic card including means for transmitting a signal to a user of said electronic card, an electronic unit, an electric energy source, a switch that can be actuated by a user of the electronic card and an application introduced into said electronic unit. The card further includes means for detecting actuation of said switch, arranged so as to determine whether said actuation ends within a first time interval from the start of actuation (t0), the end of said first time interval occurring after transmission (t1) of a signal perceptible to the card user, or for determining whether said switch actuation ends within a second time interval (T2max) from the start of transmission (t1) of said user perceptible signal, said application being actuated or the actuation thereof validated when said detection means have detected the end (t2) of said switch actuation within said first interval or said second time interval.

Abstract: The aim the disclosed process is to ensure maximum precision both at the level of the manufacturing of an electronic assembly from a chip with small dimensions as well as the level of the placement of such an assembly on an insulating substrate. This aim is achieved by a placement process on a support, called substrate, of at least one electronic assembly consisting of a chip including at least one electric contact on one of its faces, said contact being connected to a segment of conductive track, and said placement being carried out by means of a placement device holding and positioning said assembly on the substrate, comprising the following steps: formation of a segment of conductive track having a predetermined outline, transfer of the track segment onto the placement device, seizing of the chip with the placement device carrying the track segment in such a way that said track segment is placed on at least one contact of the chip.

Abstract: The invention relates to a method for manufacturing boards that comprises depositing a liquid resin (22) on and/or under a plurality of electronic units for forming a plate defining a plurality of boards or board bodies. In order to do so, and in order to reduce as much as possible the residual air bubbles in the manufactured plate, the method comprises depositing the resin in the form of resin beads (26) initially having between them grooves (28) defining air discharge channels. The resin in uniformly spread using a pressing roller for one end of the plate to a second opposite end of the plate.

Abstract: A method for manufacturing an electronic device and a device manufactured according to this method including an assembly of at least two insulating sheets, at least one electronic element, a first insulating sheet including at least one window in which the electronic element is at least partially lodged. One face of the electronic element flushes with the external surface of said first insulating sheet. The device may further include an internal module located between the two insulating sheets, a layer of filling material, an adhesive protection film extending over a region covering at least the outline of the window, said protection film being situated between the first insulating sheet and the layer of filling material covering the protection film and the internal module, conductive connection areas electrically linked to the internal module through an opening of the protection film and positioned on an internal face opposite to the external face of the electronic element.

Abstract: A manufacturing method and an electronic module manufactured according to the method including an assembly with two insulating sheets and an electronic element. A first insulating sheet constituting one of the faces of the module including at least one window in which the electronic element is housed, one face of said element levelling the surface of said first sheet and appearing on the exterior face of the module. The second insulating sheet constitutes the other face of the module. The module includes an adhesive film which extends over a region covering at least the outline of the window of the element and is situated in a region situated between the first sheet and the second sheet. The module can also include at least one electronic circuit placed between the two insulating sheets and connected to the element on the conductive connection areas located on the interior face of the element.

Abstract: The invention relates to a card (38) including a digital display (10) arranged in a node (4) defining the central portion of the card. It further comprises a plastic layer (40) the major portion (42) of which is opaque, and a transparent display portion (44). A pattern (14) is printed on the upper face of the plastic layer (40), in particular by an offset printing technique. The plastic layer (40) is covered with a transparent film (12) attached thereto by a thin glue layer (34) defining an adhesion interface. The electronic display (10) is fully integrated in the card (38) and the printed pattern (14) exhibits a good contrast on the opaque portion of said plastic layer. Furthermore, a good adhesion is obtained between all the layers of the card.

Abstract: The assembly (22) involved in the fabrication of electronic cards comprises a plate (14) exhibiting a plurality of apertures (16) in which are respectively housed a plurality of electronic modules (2). These electronic modules are assembled to the plate 14 by fixing means, in particular by fixing bridges leaving a slot (26) over the major part of the surround of the electronic module. For example the fixing means are formed by projecting parts (18) at the periphery of the apertures (16), these projecting parts exhibiting a smaller thickness than the thickness of the plate (14) and serving as supports for the electronic modules, in particular for a substrate (12) of these modules. Fixing is performed for example by welding or adhesive bonding. The invention also relates to an intermediate product formed by such an assembly and a filing material that fills at least the major part of the remaining space in the apertures (16).

Abstract: Method of manufacturing at least one card each including an electronic module (2), this method providing a frame (14) or a plate (18) having at least one aperture (16) provided for receiving said electronic module.

Abstract: The invention relates to a method for fabricating electronic cards, that comprises the following steps: A) forming a plurality of card bodies in the form of a thick sheet (36) in which is respectively imbedded a plurality of electronic units or modules (28); B) printing a plurality of first patterns (14) on a first face (21) of said thick sheet in a printing station in which ink is applied on the first face for making said first patterns; C) applying a first at least partially transparent coating (38) on each printed first pattern, that adheres to said card body. In an advanced embodiment, the method also comprises printing a plurality of second patterns (40) on the inner surface of a film (38) forming said first coating. Preferably, the printing of the first patterns is carried out in an offset type station for printing high definition patterns, essentially of the security type. The second patterns define personal data.

Abstract: The aim of this invention is to provide a thin flexible card or electronic label, wherein are mounted electronic components with a reliable electric connection between their contacts and card conductors. The card or electronic label is produced by assembling at least one thin, flexible substrate (7), a conductive layer (4), an adhesive layer (1), and at least one electronic component (11). The substrate (7) includes at least one window (8) wherein is housed the electronic component (11), the adhesive layer (1) maintains the conductive layer (8) on the substrate, the conductive layer (4) extends partially into the window's surface (8) so as to form at least one electric contact (4?) whereon the electronic component (11) is connected. The substrate (7) has a thickness preferably selected on the basis of the greatest height of the electronic component (11) to be mounted.

Abstract: This invention proposes a manufacturing process for a transponder in the form of a card or a label able to resist to flexions or twisting without interrupting the connections of the electronic components. The process of assembling at least one electronic component including sensibly flat conductive areas that are connected to conductive tracks placed on the surface of a generally flat substrate comprises the steps of placing the substrate on a work surface, the face including conductive tracks being oriented upwards, placing the electronic component into a cavity of the substrate situated in a zone including the conductive tracks, the conductive areas of the component coming into contact with the corresponding tracks of the substrate and applying a layer of insulating material which extends at once on the electronic component and at least on a substrate zone surrounding said component.

Abstract: The aim the disclosed process is to ensure maximum precision both at the level of the manufacturing of an electronic assembly from a chip with small dimensions as well as the level of the placement of such an assembly on an insulating substrate. This aim is achieved by a placement process on a support, called substrate, of at least one electronic assembly consisting of a chip including at least one electric contact on one of its faces, said contact being connected to a segment of conductive track, and said placement being carried out by means of a placement device holding and positioning said assembly on the substrate, comprising the following steps: formation of a segment of conductive track having a predetermined outline, transfer of the track segment onto the placement device, seizing of the chip with the placement device carrying the track segment in such a way that said track segment is placed on at least one contact of the chip.

Abstract: The aim of this invention is to propose a portable information carrier equipped with a transponder capable of being activated and deactivated during the use of said information carrier without having recourse to a specific device for actuation.

Abstract: The aim of this invention is to obtain a very cheap electronic circuit used for example in a card or a label while maintaining high reliability. It particularly concerns the connection of one or several electronic components on the conductive tracks by means of conductive bridges that traverse the substrate. The electronic circuit according to the invention includes at least one electronic component (6), a substrate (5), on a first face of this substrate an adhesive layer and a conductive layer including a plurality of tracks (4) are applied. The electronic component (6) comprises at least two connection areas (7). One of these connection areas (7) is electrically linked to the conductive layer by a conductive bridge formed by a conductive segment (1) delimited in the conductive layer only. Said segment (1), free from any adhesive substance, traverses the substrate (5) through a passage (2, 3) and links the connection area (7).

Abstract: This invention concerns a manufacturing method for an electronic module and a module manufactured according to this method that includes an assembly with two insulating sheets (2, 9) and an electronic element (3). A first insulating sheet (2) constituting one of the faces of the module including at least one window (4) in which the electronic element (3) is housed, one face of said element (3) levelling the surface of said first sheet (2) and appearing on the exterior face of the module. The second insulating sheet (9) constitutes the other face of the module. The module is characterized in that it includes an adhesive film (5) which extends over a region covering at least the outline of the window (4) of the element (3) and is situated in a region situated between the first sheet (2) and the second sheet (9).

Abstract: One characteristic of electronic labels is that they can be read and written on without electrical contact through the communication coil (1). The reading heading is then positioned at some distance and communicates with the label through electromagnetic waves. When these labels are placed on metallic objects, reading becomes difficult even impossible because of the dispersion of the waves in the object. To overcome this drawback, the invention proposes the adding of an electromagnetic conductive element (3, 3?) to the coil (1) in order to insulate it (1) and enhance the reception quality.

Abstract: Electronic labels consist of an electronic chip (4) and an antenna (3) assembled on a flexible support (2). The electronic chip (4) needs a rigid zone in order to not be damaged. This is why it is generally covered with a resin that makes this rigid region bigger. In order to reduce this zone the resin that covers the chip is suppressed and replaced with a protection (5) ensured by a rigid element added to the flexible support (2).

Abstract: The aim of this invention is to propose a portable information carrier equipped with a transponder capable of being activated and deactivated during the use of said information carrier without having recourse to a specific device for actuation.