Abstract: A method of configuring a controller for communication with at least one instrument module includes electrically connecting an interface of the at least one instrument module to an interface of the controller, receiving with the controller an identification signal from the interface of the at least one instrument module through a portion of the interface of the controller, and executing with the controller a configuration program that corresponds to the identification signal to enable communication between the at least one instrument module and the controller.

Abstract: A method of configuring a controller for communication with at least one instrument module includes electrically connecting an interface of the at least one instrument module to an interface of the controller, receiving with the controller an identification signal from the interface of the at least one instrument module through a portion of the interface of the controller, and executing with the controller a configuration program that corresponds to the identification signal to enable communication between the at least one instrument module and the controller.

Abstract: Disclosed is a printhead for a printer that includes a plurality of ejection chip units. Each ejection chip unit of the plurality of ejection chip units is configured to eject at least one fluid. The printhead further includes a plurality of supporting units. Each supporting unit of the plurality of supporting units is fluidly coupled with a corresponding ejection chip unit. The each supporting unit includes a plurality of trenches adapted to receive an adhesive to facilitate attachment of the each supporting unit with the corresponding ejection chip unit. Furthermore, the printhead includes a base unit fluidly coupled with the each supporting unit of the plurality of supporting units. The base unit is adapted to provide the at least one fluid to the each ejection chip unit through a corresponding to supporting unit. Further disclosed is a method for assembling the printhead.

Abstract: A micro-fluid ejection device structure and method therefor having improved low energy design. The devices include a semiconductor substrate and an insulating layer deposited on the semiconductor substrate. A plurality of heater resistors are formed on the insulating layer from a resistive layer selected from the group consisting of TaAl, Ta2N, TaAl(O,N), TaAlSi, Ti(N,O), WSi(O,N), TaAlN, and TaAl/TaAlN. A sacrificial layer selected from an oxidizable metal and having a thickness ranging from about 500 to about 5000 Angstroms is deposited on the plurality of heater resistors. Electrodes are formed on the sacrificial layer from a first metal conductive layer to provide anode and cathode connections to the plurality of heater resistors. The sacrificial layer is oxidized in a plasma oxidation process to provide a fluid contact layer on the plurality of heater resistors.

Abstract: Disclosed is a fluid ejection device that includes a nozzle plate. The nozzle plate includes a plurality of nozzles. Further, the fluid ejection device includes a flow feature layer. The flow feature layer includes a plurality of flow features. The fluid ejection device further includes an ejection unit. The ejection unit includes a first layer. The first layer includes a plurality of fluid vias. Further, the ejection unit includes a second layer. The second layer includes a plurality of fluid channels. Further, the second layer is attached to the first layer through a first intermediate silicon oxide layer. The ejection unit also includes a third layer. The third layer includes a plurality of ports. The third layer is also attached to the second layer through a second intermediate silicon oxide layer. Further disclosed are an ejection unit for a fluid ejection device and a method for fabricating the fluid ejection device.

Abstract: Disclosed is a printhead for a printer that includes a plurality of ejection chip units. Each ejection chip unit of the plurality of ejection chip units is configured to eject at least one fluid. The printhead further includes a plurality of supporting units. Each supporting unit of the plurality of supporting units is fluidly coupled with a corresponding ejection chip unit. The each supporting unit includes a plurality of trenches adapted to receive an adhesive to facilitate attachment of the each supporting unit with the corresponding ejection chip unit. Furthermore, the printhead includes a base unit fluidly coupled with the each supporting unit of the plurality of supporting units. The base unit is adapted to provide the at least one fluid to the each ejection chip unit through a corresponding to supporting unit. Further disclosed is a method for assembling the printhead.

Abstract: A micro-fluid ejection head has multiple ejection chips joined adjacently to create a lengthy array across a media to-be-imaged. The chips have fluid firing elements arranged along multiple fluid vias to seamlessly stitch together fluid ejections from different chips. Each of the chips has a shape defining a trapezoid. Adjacent chips are inverted from one to the next across the array. The geometry shortens a distance between same color fluid vias on adjacent chips. The fluid vias may parallel the two parallel sides of the trapezoid or only one non-parallel side. They may all have differing lengths. Same colored vias on adjacent chips may combine together to be equal to the length of fluid vias for other colors. Commonly configured modules define still other embodiments as do frames to seat the modules to define arrays of variable length. Singulating chips from larger wafers provide still further embodiments.

Abstract: A soft landing control system for a screeding device is operable to automatically lower a vibrating member relative to a grade setting device after the grade setting device is lowered to the desired grade. The control may be operable to delay lowering the vibrating member relative to the grade setting device at least until the control receives an input indicative of at least a portion of the screed head assembly being moved to a position generally over a newly placed concrete area.

Abstract: An inkjet printhead having a housing having a top face and a bottom face, an ink ejection device and a contact circuit. The contact circuit is affixed to the housing in a substantially horizontal orientation and is in communication with the ink ejection device. The contact circuit is configured to connect the ink ejection device to an external device.

Abstract: A reaction bonded ceramic body that has 50% to 60%, by weight, boron carbide, and 20% to 30%, by weight, silicon carbide. The reaction bonded ceramic body has least a portion of the boron carbide reacted with silicon to become siliconized boron carbide. Also, a method of making a reaction bonded ceramic material. The method may include the steps of forming a green body from a mixture of boron carbide, carbon, and an organic binder, and contacting the green body with a liquid infiltrant comprising silicon. The infiltrant has a temperature of about 1625° C. to about 1700° C. Furthermore, a method of making a reaction bonded boron carbide ceramic body. The method includes the steps of forming a green body from a mixture of boron carbide, carbon, and an organic binder. The weight ratio of boron carbide to carbon in the green body may be about 5:5 to 1 or more.

Abstract: Micro-fluid ejection devices, methods for making a micro-fluid ejection device, and methods for reducing a size of a substrate for a micro-fluid ejection head. One such micro-fluid ejection device has a polymeric layer adjacent a substrate and at least one conductive layer embedded in the polymeric layer. The polymeric layer comprises at least two layers of polymeric material.

Abstract: A micro-fluid ejection device structure and method therefor having improved low energy design. The devices include a semiconductor substrate and an insulating layer deposited on the semiconductor substrate. A plurality of heater resistors are formed on the insulating layer from a resistive layer selected from the group consisting of TaAl, Ta2N, TaAl(O,N), TaAlSi, Ti(N,O), WSi(O,N), TaAlN, and TaAl/TaAlN. A sacrificial layer selected from an oxidizable metal and having a thickness ranging from about 500 to about 5000 Angstroms is deposited on the plurality of heater resistors. Electrodes are formed on the sacrificial layer from a first metal conductive layer to provide anode and cathode connections to the plurality of heater resistors. The sacrificial layer is oxidized in a plasma oxidation process to provide a fluid contact layer on the plurality of heater resistors.

Abstract: A screeding machine including at least one of (a) a boom speed cruise control for automatically controlling the travel speed of the screed head assembly, (b) an auto-stabilizer control that automatically adjusts the stabilizer actuators of the screeding machine to a preselected degree of extension, (c) a control for automatically controlling the lowering of the screed head assembly toward and to the concrete surface and automatically activating the auger and vibrator at a beginning of each screeding pass and automatically deactivating the auger and vibrator in response to the screed head assembly being raised away from the concrete surface at the end of a screed pass, and (d) an auto-screed mode that allows the operator to select maximum values for at least one of a boom extension speed, a boom retraction speed, a boom rotation speed and a screed head rotation speed.

Abstract: A soft landing control system for a screeding device is operable to automatically lower a vibrating member relative to a grade setting device after the grade setting device is lowered to the desired grade. The control may be operable to delay lowering the vibrating member relative to the grade setting device at least until the control receives an input indicative of at least a portion of the screed head assembly being moved to a position generally over a newly placed concrete area.

Abstract: A micro-fluid ejection device structure and method therefor having improved low energy design. The devices includes a semiconductor substrate and an insulating layer deposited on the semiconductor substrate. A plurality of heater resistors are formed on the insulating layer from a resistive layer selected from the group consisting of TaAl, Ta2N, TaAl(O,N), TaAlSi, Ti(N,O), WSi(O,N), TaAlN, and TaAl/TaAlN. A sacrificial layer selected from an oxidizable metal and having a thickness ranging from about 500 to about 5000 Angstroms is deposited on the plurality of heater resistors. Electrodes are formed on the sacrificial layer from a first metal conductive layer to provide anode and cathode connections to the plurality of heater resistors. The sacrificial layer is oxidized in a plasma oxidation process to provide a fluid contact layer on the plurality of heater resistors.

Abstract: A soft landing control system for a screeding device is operable to automatically lower a vibrating member relative to a grade setting device after the grade setting device is lowered to the desired grade. The control may be operable to delay lowering the vibrating member relative to the grade setting device at least until the control receives an input indicative of at least a portion of the screed head assembly being moved to a position generally over a newly placed concrete area. Optionally, the control may delay lowering of the vibrating member relative to the grade setting device until a period of time has elapsed after an activating event. Optionally, the control may automatically stop vibration of the vibrating member when the screed head assembly is not moving in the screeding direction and may automatically vibrate the vibrating member when the screed head assembly moves in the screeding direction.

Abstract: An inkjet printhead having a housing having a top face and a bottom face, an ink ejection device and a contact circuit. The contact circuit is affixed to the housing in a substantially horizontal orientation and is in communication with the ink ejection device. The contact circuit is configured to connect the ink ejection device to an external device.

Abstract: A soft landing control system for a screeding device is operable to automatically lower a vibrating member relative to a grade setting device after the grade setting device is lowered to the desired grade. The control may be operable to delay lowering the vibrating member relative to the grade setting device at least until the control receives an input indicative of at least a portion of the screed head assembly being moved to a position generally over a newly placed concrete area. Optionally, the control may delay lowering of the vibrating member relative to the grade setting device until a period of time has elapsed after an activating event. Optionally, the control may automatically stop vibration of the vibrating member when the screed head assembly is not moving in the screeding direction and may automatically vibrate the vibrating member when the screed head assembly moves in the screeding direction.

Abstract: Methods for forming electronic devices, such as those having a flexible substrate and printed material on the flexible substrate. In one embodiment, the method may include applying materials to a flexible substrate to form the electronic device. At least some of the materials applied to the flexible substrate may be applied using a printing apparatus. The substrate may be annealed when at least some of the materials are present on the flexible substrate. The resulting electronic device may have a high charge carrier mobility in the range from about 10 cm2/V-s to about 100 cm2/V-s.

Abstract: Electronic devices, such as those having a flexible substrate and printed material on the flexible substrate. In one embodiment, the printed material and substrate are part of an electronic device having at least three terminals, wherein the electronic device has a charge carrier mobility of at least 10 cm2/V-s. Multi-terminal devices can have a substrate including a doped semiconductor layer and at least two doped regions formed upon the substrate. The doped regions can be doped oppositely from the semiconductor layer and exhibit a charge carrier mobility of greater than 10 cm2/V-s. Methods for making the same are also disclosed.