Abstract: The present disclosure includes apparatuses and methods related to a non-deterministic memory protocol. An example apparatus can perform operations on the memory device based on commands received from a host according to a protocol, wherein the protocol includes non-deterministic timing of the operations. The memory device can be a non-volatile dual in-line memory module (NVDIMM) device.

Abstract: The invention relates to a test sensor and a heater and thermocouple device for use in a test sensor and other assays, such as a diagnostic test sensor or strip and to a method of manufacturing a test sensor and a device and a method of conducting an assay using the test sensor or device. The invention relates to a test sensor comprising a heater and thermocouple device (100), the heater and thermocouple device (100) comprising: a substrate (10); on the substrate (10), a first layer (12) of a first conductive material of a first conductivity comprising: a first thermocouple element (14); a first connector track (16) connected to the first thermocouple element (14); a resistive heater element (20); and in which at least part of the first thermocouple element (14) is comprised of a portion of the resistive heater element (20); a second layer (22) of a second conductive material of a second conductivity comprising: a second thermocouple element (24) in contact with the first thermocouple element (14) (e.g.

Abstract: The invention relates to a method of and apparatus for determining concentration of an analyte, such as glucose, in a fluid sample, such as body fluid or control solution, using a mediated redox reaction. In particular, the method relates to mitigation of the effects of haematocrit on the response of sensor device used in such a method or apparatus.

Abstract: The present invention relates to a sensor device for measuring a level of an analyte of interest in a fluid, such as body fluid (for example blood, plasma, urine, interstitial fluid, saliva), a method of manufacturing a sensor device, a reagent film for use in a sensor, a method of manufacturing a reagent film for use in a sensor, a method of conducting an assay using a sensor, a method of calibrating a measurement from a sensor, a method of calibrating a batch of sensors, a meter for use with a sensor and a kit comprising a meter and a sensor according to the invention. A first aspect of the invention provides a sensor device for measuring a level of an analyte of interest In a fluid comprising: a flowpath for the fluid; on the flowpath, a reagent for the analyte of interest adjacent to an internal standard comprising a first predetermined amount of a first calibration analyte; and further wherein the reagent and the predetermined amount of a first calibration analyte are in dry form.

Abstract: The invention relates to a method of and apparatus for determining concentration of an analyte, such as glucose, in a fluid sample, such as body fluid or control solution, using a mediated redox reaction. In particular, the method relates to mitigation of the effects of haematocrit on the response of sensor device used in such a method or apparatus.

Abstract: The present invention relates to a sensor device for measuring a level of an analyte of interest in a fluid, such as body fluid (for example blood, plasma, urine, interstitial fluid, saliva), a method of manufacturing a sensor device, a reagent film for use in a sensor, a method of manufacturing a reagent film for use in a sensor, a method of conducting an assay using a sensor, a method of calibrating a measurement from a sensor, a method of calibrating a batch of sensors, a meter for use with a sensor and a kit comprising a meter and a sensor according to the invention. A first aspect of the invention provides a sensor device for measuring a level of an analyte of interest In a fluid comprising: a flowpath for the fluid; on the flowpath, a reagent for the analyte of interest adjacent to an internal standard comprising a first predetermined amount of a first calibration analyte; and further wherein the reagent and the predetermined amount of a first calibration analyte are in dry form.

Abstract: A method of forming molding standoff structures on integrated circuit devices is disclosed which includes forming a plurality of standoff structures on a substantially rectangular sheet of transparent material and, after forming the standoff structures, singulating the substantially rectangular sheet of transparent material into a plurality of individual transparent members, each of which comprise at least one of the plurality of standoff structures.

Abstract: A method of forming molding standoff structures on integrated circuit devices is disclosed which includes forming a plurality of standoff structures on a substantially rectangular sheet of transparent material and, after forming the standoff structures, singulating the substantially rectangular sheet of transparent material into a plurality of individual transparent members, each of which comprise at least one of the plurality of standoff structures.

Abstract: Microelectronic imaging units and methods for manufacturing microelectronic imaging units are disclosed herein. In one embodiment, a method includes placing a plurality of singulated imaging dies on a support member. The individual imaging dies include an image sensor, an integrated circuit operably coupled to the image sensor, and a plurality of external contacts operably coupled to the integrated circuit. The method further includes disposing a plurality of discrete stand-offs on the support member. The discrete stand-offs are arranged in arrays relative to corresponding imaging dies. The method further includes electrically connecting the external contacts of the imaging dies to corresponding terminals on the support member, and attaching a plurality of covers to corresponding stand-off arrays so that the covers are positioned over the image sensors.

Abstract: An apparatus and method for packaging a semiconductor die and a carrier substrate to substantially prevent trapped moisture therebetween and provide a robust, inflexible cost-effective bond. The semiconductor die is attached to the carrier substrate with a plurality of discrete adhesive elements so as to provide a gap or standoff therebetween. Wire bonds may then be formed between bond pads on the semiconductor die to conductive pads or terminals on the carrier substrate. With this arrangement, a dielectric filler material is disposed in the gap or standoff to form a permanent bonding agent between the semiconductor die and the carrier substrate. By applying the dielectric filler material after forming the wire bonds, the dielectric filler material coats at least a portion of the wire bonds to stabilize the wire bonds and prevent wire sweep in an encapsulation process, such as transfer molding, performed thereafter.

Abstract: A method of using a laser to remove surface contamination and oxidation from a ball grid array substrate. The laser etching can be configured to cover the entire substrate or pinpointed to the epoxy molding compound/solder resist (EMC/SR) interfaces. Additionally, a laser can be used to roughen the surface of a substrate to provide better adhesion when attaching the die to the substrate.

Abstract: A method of using a laser to remove surface contamination and oxidation from a ball grid array substrate. The laser etching can be configured to cover the entire substrate or pinpointed to the epoxy molding compound/solder resist (EMC/SR) interfaces. Additionally, a laser can be used to roughen the surface of a substrate to provide better adhesion when attaching the die to the substrate.

Abstract: A method of using a laser to remove surface contamination and oxidation from a ball grid array substrate. The laser etching can be configured to cover the entire substrate or pinpointed to the epoxy molding compound/solder resist (EMC/SR) interfaces. Additionally, a laser can be used to roughen the surface of a substrate to provide better adhesion when attaching the die to the substrate.

Abstract: A method of using a laser to remove surface contamination and oxidation from a ball grid array substrate. The laser etching can be configured to cover the entire substrate or pinpointed to the epoxy molding compound/solder resist (EMC/SR) interfaces. Additionally, a laser can be used to roughen the surface of a substrate to provide better adhesion when attaching the die to the substrate.

Abstract: Integrated circuit packages that connect solder balls between solder ball pads of a die and substrate pads of a printed circuit board (PCB). The solder balls are electrically disconnected from any circuit of the die, i.e., “dummy” solder balls, and are used to temporarily hold the die in position with respect to the PCB until the circuit is wire bonded and an underfill material is cured between the die and the PCB to more permanently connect them together. The underfill material is selected to have a coefficient of thermal expansion (CTE) that is substantially equal to the CTE of the solder balls to prevent thermal mismatch problems. An overmolding compound is disposed about the die and the underfill material and about the wire bonds to complete the package. Various arrangements of the solder ball pads on the die include columnar and row, corner, diagonal, cross, and periphery arrangements.

Abstract: Integrated circuit packages that connect solder balls between solder ball pads of a die and substrate pads of a printed circuit board (PCB). The solder balls are electrically disconnected from any circuit of the die, i.e., “dummy” solder balls, and are used to temporarily hold the die in position with respect to the PCB until the circuit is wire bonded and an underfill material is cured between the die and the PCB to more permanently connect them together. The underfill material is selected to have a coefficient of thermal expansion (CTE) that is substantially equal to the CTE of the solder balls to prevent thermal mismatch problems. An overmolding compound is disposed about the die and the underfill material and about the wire bonds to complete the package. Various arrangements of the solder ball pads on the die include columnar and row, corner, diagonal, cross, and periphery arrangements.

Abstract: Methods for manufacturing microelectronic imaging units and microelectronic imaging units that are formed using such methods are disclosed herein. In one embodiment, a method for manufacturing a plurality of microelectronic imaging units includes placing a plurality of singulated imaging dies on a support member. The individual imaging dies include a first height, an image sensor, an integrated circuit operably coupled to the image sensor, and a plurality of external contacts operably coupled to the integrated circuit. The method further includes electrically connecting the external contacts of the imaging dies to corresponding terminals on the support member and forming a base on the support member between adjacent imaging dies. The base has a second height less than or approximately equal to the first height of the dies. The method further includes attaching a plurality of covers to the base so that the covers are positioned over corresponding image sensors.

Abstract: A method of using a laser to remove surface contamination and oxidation from a ball grid array substrate. The laser etching can be configured to cover the entire substrate or pinpointed to the epoxy molding compound/solder resist (EMC/SR) interfaces. Additionally, a laser can be used to roughen the surface of a substrate to provide better adhesion when attaching the die to the substrate.

Abstract: A method of using a laser to remove surface contamination and oxidation from a ball grid array substrate. The laser etching can be configured to cover the entire substrate or pinpointed to the epoxy molding compound/solder resist (EMC/SR) interfaces. Additionally, a laser can be used to roughen the surface of a substrate to provide better adhesion when attaching the die to the substrate.

Abstract: Methods for manufacturing microelectronic imaging units and microelectronic imaging units that are formed using such methods are disclosed herein. In one embodiment, a method for manufacturing a plurality of microelectronic imaging units includes placing a plurality of singulated imaging dies on a support member. The individual imaging dies include a first height, an image sensor, an integrated circuit operably coupled to the image sensor, and a plurality of external contacts operably coupled to the integrated circuit. The method further includes electrically connecting the external contacts of the imaging dies to corresponding terminals on the support member and forming a base on the support member between adjacent imaging dies. The base has a second height less than or approximately equal to the first height of the dies. The method further includes attaching a plurality of covers to the base so that the covers are positioned over corresponding image sensors.