Abstract: Microelectronic imaging units and methods for manufacturing microelectronic imaging units are disclosed herein. In one embodiment, a method includes placing a plurality of singulated imaging dies on a support member. The individual imaging dies include an image sensor, an integrated circuit operably coupled to the image sensor, and a plurality of external contacts operably coupled to the integrated circuit. The method further includes disposing a plurality of discrete stand-offs on the support member. The discrete stand-offs are arranged in arrays relative to corresponding imaging dies. The method further includes electrically connecting the external contacts of the imaging dies to corresponding terminals on the support member, and attaching a plurality of covers to corresponding stand-off arrays so that the covers are positioned over the image sensors.

Abstract: An electronic device package is described that includes a non-metal die attached adhesive. The die attach is positioned in discrete positions on a surface to which the die will be fixed. The die is placed on the discrete die attach. The die attach, in an embodiment, is an epoxy resin or other material that is cured. After curing, the die is electrically connected to an external circuit. The volume between the die and surface is filled with an underfill. In an embodiment, underfill cross-links with the die attach.

Abstract: An electronic device package is described that includes a non-metal die attached adhesive. The die attach is positioned in discrete positions on a surface to which the die will be fixed. The die is placed on the discrete die attach. The die attach, in an embodiment, is an epoxy resin or other material that is cured. After curing, the die is electrically connected to an external circuit. The volume between the die and surface is filled with an underfill. In an embodiment, underfill cross-links with the die attach.

Abstract: A method and apparatus for assembling and packaging semiconductor die assemblies utilizes a coating element such as a wafer back side laminate formed on a back side of a semiconductor die is disclosed. The coating element may be formed from a somewhat compressible and, optionally, resilient material, which seals against a surface of a mold cavity while the semiconductor die assembly is being encapsulated. In this manner, the coating element prevents encapsulant material from covering at least a portion of the back side of the semiconductor die to prevent encapsulant flashing over the back side and thus improve heat dissipation characteristics of the packaged semiconductor die during operation.

Abstract: An electronic system includes a processor and at least one semiconductor device with at least one semiconductor die and a carrier. One or more intermediate conductive elements may extend from bond pads of the semiconductor die, through at least one opening through the carrier, to contacts of the carrier. A quantity of dielectric material is disposed between the semiconductor die and the carrier, extends through the at least one opening, and over the at least one intermediate conductive element. The quantity of dielectric material may form a fillet about the periphery of the semiconductor die. The electronic system may include a fence on a surface of the carrier opposite from the surface next to which the semiconductor die is positioned. Such a fence may laterally contain a portion of the quantity of dielectric material, which may have a substantially planar exposed surface. The processor or the at least one semiconductor device may communicate with an input device or an output device.

Abstract: A semiconductor device assembly includes at least one semiconductor die and a carrier. One or more intermediate conductive elements may extend from bond pads of the semiconductor die, through at least one opening through the carrier, to contacts of the carrier. A quantity of dielectric material is disposed between the semiconductor die and the carrier, extends through the at least one opening, and over the at least one intermediate conductive element. The quantity of dielectric material may form a fillet about the periphery of the semiconductor die. The assembly may include a fence on a surface of the carrier opposite from the surface next to which the semiconductor die is positioned. Such a fence may laterally contain a portion of the quantity of dielectric material, which may have a substantially planar exposed surface.

Abstract: The present invention relates to the use of a laser to remove surface contamination and oxidation from a ball grid array substrate. The laser etching can be configured to cover the entire substrate or pinpointed to the epoxy molding compound/solder resist (EMC/SR) interfaces. Additionally, a laser can be used to roughen the surface of a substrate to provide better adhesion when attaching the die to the substrate.

Abstract: An electronic device package is described that includes a non-metal die attached adhesive. The die attach is positioned in discrete positions on a surface to which the die will be fixed. The die is placed on the discrete die attach. The die attach, in an embodiment, is an epoxy resin or other material that is cured. After curing, the die is electrically connected to an external circuit. The volume between the die and surface is filled with an underfill. In an embodiment, underfill cross-links with the die attach.

Abstract: Integrated circuit packages that connect solder balls between solder ball pads of a die and substrate pads of a printed circuit board (PCB). The solder balls are electrically disconnected from any circuit of the die, i.e., “dummy” solder balls, and are used to temporarily hold the die in position with respect to the PCB until the circuit is wire bonded and an underfill material is cured between the die and the PCB to more permanently connect them together. The underfill material is selected to have a coefficient of thermal expansion (CTE) that is substantially equal to the CTE of the solder balls to prevent thermal mismatch problems. An overmolding compound is disposed about the die and the underfill material and about the wire bonds to complete the package. Various arrangements of the solder ball pads on the die include columnar and row, corner, diagonal, cross, and periphery arrangements.

Abstract: Apparatus for the precise positioning of an object such as a work platform relative to a base, comprising, for each of three orthogonal axes, a flexure coupling between the work platform and the base, at least one of the flexure couplings having a rotary bearing and rotary positioning device where it connects with the work platform or the base. The apparatus provides precise positioning in up to three orthogonal rotational axes and up to three linear axes, and it is useful in the electro-optics industry.

Abstract: A disposable electrochemical sensor for the detection of an analyte such as glucose in a liquid sample is provided. The sensor has a working electrode and a reference electrode disposed within a sample-receiving cavity, and a reagent layer disposed within the sample-receiving cavity and over the working electrode. The reagent layer contains at least an enzyme for producing an electrochemical signal in the presence of the analyte. The sample-receiving cavity has a volume of less than 1.5 &mgr;l, and the sensor provides a stable reading of the amount of analyte in a period of 10 seconds or less. Where appropriate for the generation of electrochemical signal, for example in the case of glucose detection, the reagent layer also contains a mediator. The sensor is used in combination with a meter for detection of the analyte in a liquid sample.

Abstract: Apparatus for the precise positioning of an object such as a work platform relative to a base, comprising, for each of three orthogonal axes, a flexure coupling between the work platform and the base, at least one of the flexure couplings having a rotary bearing and rotary positioning device where it connects with the work platform or the base.

Abstract: A disposable electrochemical sensor for the detection of an analyte such as glucose in a liquid sample is provided. The sensor has a working electrode and a reference electrode disposed within a sample-receiving cavity, and a reagent layer disposed within the sample-receiving cavity and over the working electrode. The reagent layer contains at least an enzyme for producing an electrochemical signal in the presence of the analyte. The sample-receiving cavity has a volume of less than 1.5 &mgr;l, and the sensor provides a stable reading of the amount of analyte in a period of 10 seconds or less. Where appropriate for the generation of electrochemical signal, for example in the case of glucose detection, the reagent layer also contains a mediator. The sensor is used in combination with a meter for detection of the analyte in a liquid sample.

Abstract: A fluid pressure compensator for a lubrication system in a rotary drill bit includes a diaphragm (44) with an enlarged thickness central portion (62) having a generally hemispherically shaped deformation (72) at its center to form a minimal thickness thereat progressively increasing to the enlarged thickness. A self sealing puncture (74) is provided at the center of the diaphragm (44) to relieve excess pressure differentials in the lubrication system internally of the drill bit and excess pressure differentials in the drilling fluid externally of the drill bit. The diaphragm (44) has an enlarged protuberance (64) about its outer periphery which is secured in sealing relation within a groove formed by sealing surfaces (66, 68, 70) on a leg (10) of the rotary bit and associated securing cap (46). A protective cup (42) supports the diaphragm (44) in an extended position and has dimples (58) for supporting the diaphragm (46) on the bottom (40) of the lubricant reservoir (49).