Patents by Inventor Frank Henning

Frank Henning has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240141077
    Abstract: A process for preparing polyether-modified amino-functional polybutadienes involves a) reacting at least one polybutadiene (A) with at least one epoxidizing reagent (B) to give at least one epoxy-functional polybutadiene (C); b) reacting the at least one epoxy-functional polybutadiene (C) with at least one amino-functional compound (D) to give at least one hydroxy- and amino-functional polybutadiene (E); and c) reacting the at least one hydroxy- and amino-functional polybutadiene (E) with at least one epoxy-functional compound (F) to give at least one polyether-modified amino-functional polybutadiene (G). The polyether-modified amino-functional polybutadienes preparable by this process are also provided.
    Type: Application
    Filed: February 9, 2022
    Publication date: May 2, 2024
    Applicant: Evonik Operations GmbH
    Inventors: Frank Schubert, Sarah Otto, Dirk Wojtasik, Frauke Henning
  • Patent number: 11969755
    Abstract: Described herein are a method for transferring an embossed structure, which includes at least the steps (1-i) and (2-i) or (1-ii) and (2-ii), where steps (1-i) and (2-i) or (1-ii) and (2-ii) are carried out using an embossing tool (P1) including at least one embossing die (p1), where the embossing die (p1) of the embossing tool (P1) is pretreated, before the implementation of step (2-i) or before the implementation of step (1-ii), with at least one organic solvent and/or at least one reactive diluent, and also a method of using a corresponding pretreated embossing tool (P1) including at least one embossing die (p1) for the purpose of transferring an embossed structure in such a way.
    Type: Grant
    Filed: June 3, 2020
    Date of Patent: April 30, 2024
    Assignee: BASF COATINGS GMBH
    Inventors: Jan-Bernd Kues, Susanne Piontek, Joerg Exner, Birgit Kleine-Bley, Alberto Garcia Martin, Jens-Henning Noatschk, Michael Lorenz, Robert Von Der Aa, Frank Bergmann, Wilfried Schipper
  • Patent number: 11926651
    Abstract: The present invention relates to a polypeptide construct comprising at least two fragments of an allergen from the Amb a 1 family of allergens from Ambrosia atermisiifolia or variants of said at least two fragments, wherein each of the at least two fragments consist of 20 to 50 amino acid residues and wherein at least one fragment is derived from amino acid residues 1 to 50 of the mature allergen and at least one fragment is derived from amino acid residues 240 and ending at the C-terminal end of the mature allergen.
    Type: Grant
    Filed: September 20, 2017
    Date of Patent: March 12, 2024
    Assignee: WORG PHARMACEUTICALS (ZHEJIANG) CO., LTD.
    Inventors: Monika Hochradl, Frank Stolz, Angela Neubauer, Rainer Henning, Elijahu Babaev
  • Patent number: 9278308
    Abstract: A construction element for a plant for capture of an acidic gas using an aqueous amine absorbent, wherein at least a part of a surface of said element comprises a polyolefin, and a hydrolytically stable antioxidant, is described. Additionally, a liner comprising said polyolefin and the hydrolytically stable antioxidant, is described. The construction element may be a column, a pipe, an insert, like a column packing element or a tray. An apparatus for capturing CO2 using the construction elements, is also described.
    Type: Grant
    Filed: July 5, 2012
    Date of Patent: March 8, 2016
    Assignee: Aker Engineering & Technology AS
    Inventors: Svein Jamtvedt, Harry Øysæd, John Ole Gjerp, Frank Henning Forsberg
  • Patent number: 8901684
    Abstract: A micromechanical component including a first composite of a plurality of semiconductor chips, the first composite having a first front and back surfaces, a second composite of a corresponding plurality of carrier substrates, the second composite having a second front and back surfaces; wherein the first front surface and the second front surface are connected via a structured adhesion promoter layer in such a way that each semiconductor chip is connected, essentially free of cavities, to a corresponding carrier substrate corresponding to a respective micromechanical component.
    Type: Grant
    Filed: June 5, 2012
    Date of Patent: December 2, 2014
    Assignee: Robert Bosch GmbH
    Inventors: Hubert Benzel, Frank Henning, Armin Scharping, Christoph Schelling
  • Publication number: 20140123851
    Abstract: A construction element for a plant for capture of an acidic gas using an aqueous amine absorbent, wherein at least a part of a surface of said element comprises a polyolefin, and a hydrolytically stable antioxidant, is described. Additionally, a liner comprising said polyolefin and the hydrolytically stable antioxidant, is described. The construction element may be a column, a pipe, an insert, like a column packing element or a tray. An apparatus for capturing CO2 using the construction elements, is also described.
    Type: Application
    Filed: July 5, 2012
    Publication date: May 8, 2014
    Applicant: Aker Engineering & Technology AS
    Inventors: Svein Jamtvedt, Harry Øysæd, John Ole Gjerp, Frank Henning Forsberg
  • Patent number: 8595916
    Abstract: A construction concept for high-pressure sensors is provided, which enables simple and economical production of reliable high-pressure sensors even for pressure ranges above 2200 bar. A high-pressure sensor of this kind encompasses a sensor element for pressure sensing and a connector piece for coupling the sensor element to a system to be measured. A diaphragm is embodied in the base element of the sensor element, and a pressure conduit is embodied in the base element of the connector piece. The sensor element is mounted on the connector piece so that the pressure to be measured is able to act upon the diaphragm via the pressure conduit. Firstly the base element of the sensor element is mounted on the base element of the connector piece, a full-area connection being generated between the mounting surfaces of the two base elements. Only thereafter is the pressure conduit configured in the connector piece, and the diaphragm of the sensor element exposed.
    Type: Grant
    Filed: August 25, 2009
    Date of Patent: December 3, 2013
    Assignee: Robert Bosch GmbH
    Inventors: Frank Henning, Wilhelm Frey
  • Publication number: 20130001711
    Abstract: A micromechanical component including a first composite of a plurality of semiconductor chips, the first composite having a first front and back surfaces, a second composite of a corresponding plurality of carrier substrates, the second composite having a second front and back surfaces; wherein the first front surface and the second front surface are connected via a structured adhesion promoter layer in such a way that each semiconductor chip is connected, essentially free of cavities, to a corresponding carrier substrate corresponding to a respective micromechanical component.
    Type: Application
    Filed: June 5, 2012
    Publication date: January 3, 2013
    Inventors: Hubert BENZEL, Frank Henning, Armin Scharping, Christoph Schelling
  • Patent number: 8232126
    Abstract: A manufacturing method for a micromechanical component, a corresponding composite component, and a corresponding micromechanical component are described.
    Type: Grant
    Filed: April 21, 2009
    Date of Patent: July 31, 2012
    Assignee: Robert Bosch GmbH
    Inventors: Hubert Benzel, Frank Henning, Armin Scharping, Christoph Schelling
  • Publication number: 20110252621
    Abstract: A construction concept for high-pressure sensors is provided, which enables simple and economical production of reliable high-pressure sensors even for pressure ranges above 2200 bar. A high-pressure sensor of this kind encompasses a sensor element for pressure sensing and a connector piece for coupling the sensor element to a system to be measured. A diaphragm is embodied in the base element of the sensor element, and a pressure conduit is embodied in the base element of the connector piece. The sensor element is mounted on the connector piece so that the pressure to be measured is able to act upon the diaphragm via the pressure conduit. Firstly the base element of the sensor element is mounted on the base element of the connector piece, a full-area connection being generated between the mounting surfaces of the two base elements. Only thereafter is the pressure conduit configured in the connector piece, and the diaphragm of the sensor element exposed.
    Type: Application
    Filed: August 25, 2009
    Publication date: October 20, 2011
    Inventors: Frank Henning, Wilhelm Frey
  • Publication number: 20110203385
    Abstract: A device for measuring torsions, bendings, and the like, of a target component includes a metallic substrate, an insulating layer, and a sensing layer in the form of a gauge system. The device is configured to be fixed to the target component via a fixed connection.
    Type: Application
    Filed: February 17, 2011
    Publication date: August 25, 2011
    Inventors: Jan Huels, Frank Henning, Wilhelm Frey
  • Publication number: 20110163396
    Abstract: The present invention relates to a manufacturing method for a micromechanical component, a corresponding composite component, and a corresponding micromechanical component.
    Type: Application
    Filed: April 21, 2009
    Publication date: July 7, 2011
    Applicant: ROBERT BOSCH GMBH
    Inventors: Hubert Benzel, Frank Henning, Armin Scharping, Christoph Schelling
  • Publication number: 20110104489
    Abstract: A process for the production of hollow carbon fibres by the treatment of a stabilised carbon fibre precursor in an application device using high-frequency electromagnetic waves. The application device includes structure supplying the electromagnetic waves to a outcoupling region and a hollow outer conductor terminating in the outcoupling region. For the treatment, a field of the high-frequency electromagnetic waves is generated and a field strength in the range from 15 to 40 kV/m is set in the outcoupling region of the application device. The stabilised carbon fibre precursor is conveyed continuously as an inner conductor through the hollow outer conductor, thereby forming a coaxial conductor having an outer and an inner conductor, and through the subsequent outcoupling region. An inert gas atmosphere is created in the coaxial conductor and in the outcoupling region by passing through an inert gas.
    Type: Application
    Filed: September 17, 2008
    Publication date: May 5, 2011
    Applicant: TOHO TENAX CO., LTD.
    Inventors: Michael Wolki, Bernd Wohlmann, Mathias Kaiser, Rudolf Emmerich, Frank Henning
  • Publication number: 20090277772
    Abstract: A process for continuous production of carbon fibres whereby stabilised precursor fibres are carbonised and graphitised with the help of high-frequency electromagnetic waves, characterised in that the stabilised precursor fibres are continuously conveyed, as the inner conductor of a coaxial conductor consisting of an outer and an inner conductor, through the coaxial conductor and a treatment zone; that the stabilised precursor fibres are irradiated in the treatment zone with high-frequency electromagnetic waves that are absorbed by the precursor fibres, which are thereby heated and converted into carbon fibres; and that the stabilised precursor fibres or carbon fibres are conveyed under an inert gas atmosphere through the coaxial conductor and the treatment zone.
    Type: Application
    Filed: March 31, 2007
    Publication date: November 12, 2009
    Applicant: TOHO TENAX CO., LTD.
    Inventors: Mathias Kaiser, Lukas Alberts, Frank Henning, Rudolf Emmerich, Christian Hunyar, Klaus-Dieter Nauenburg, Ralf Dreher, Peter Elsner, Bernd Wohlmann
  • Patent number: 7497722
    Abstract: A sensor system includes a sensor element and a body. A number of electrical contact points with which contact may be created via electrical contact elements are provided on one side of the sensor element. Electrically conductive insertion parts are introduced into the body made of a non-conductive material and create a contact with the electrical contact points of the sensor element when the sensor element and the body are mechanically joined together.
    Type: Grant
    Filed: July 7, 2005
    Date of Patent: March 3, 2009
    Assignee: Robert Bosch GmbH
    Inventors: Rálf Henn, Holger Scholzen, Frank Henning
  • Patent number: 7273764
    Abstract: The invention relates to a sensor with at least one silicon-based micromechanical structure, which is integrated with a sensor chamber of a foundation wafer, and with at least one covering that covers the foundation wafer in the region of the sensor chamber, and to a method for producing a sensor.
    Type: Grant
    Filed: January 3, 2005
    Date of Patent: September 25, 2007
    Assignee: Robert Bosch GmbH
    Inventors: Frank Reichenbach, Stefan Pinter, Frank Henning, Hans Artmann, Helmut Baumann, Franz Laemer, Michael Offenberg, Georg Bischopink
  • Patent number: 6995514
    Abstract: The electrode system for a metal halide lamp with ceramic discharge vessel (4) comprises an electrically conductive leadthrough (9, 10) and an electrode connected thereto, the leadthrough having a fusible region with respect to the electrode, in which that end of the electrode which faces the leadthrough is embedded, at least the fusible region containing one of the high-melting metals Mo or W, and the electrode having a shank made from tungsten. In the regions surrounded by the material of the leadthrough, the electrode has a positively locking means which at least comprises a recess in the shank of the electrode.
    Type: Grant
    Filed: June 13, 2003
    Date of Patent: February 7, 2006
    Assignee: Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH
    Inventors: Frank Henning, René Roatzsch
  • Publication number: 20060019547
    Abstract: A sensor system includes a sensor element and a body. A number of electrical contact points with which contact may be created via electrical contact elements are provided on one side of the sensor element. Electrically conductive insertion parts are introduced into the body made of a non-conductive material and create a contact with the electrical contact points of the sensor element when the sensor element and the body are mechanically joined together.
    Type: Application
    Filed: July 7, 2005
    Publication date: January 26, 2006
    Inventors: Ralf Henn, Holger Scholzen, Frank Henning
  • Publication number: 20050280370
    Abstract: The electrode system for a metal halide lamp with ceramic discharge vessel (4) comprises an electrically conductive leadthrough (9, 10) and an electrode connected thereto, the leadthrough having a fusible region with respect to the electrode, in which that end of the electrode which faces the leadthrough is embedded, at least the fusible region containing one of the high-melting metals Mo or W, and the electrode having a shank made from tungsten. In the regions surrounded by the material of the leadthrough, the electrode has a positively locking means which at least comprises a recess in the shank of the electrode.
    Type: Application
    Filed: June 13, 2003
    Publication date: December 22, 2005
    Inventors: Frank Henning, Rene Roatzsch
  • Publication number: 20050230708
    Abstract: The invention relates to a sensor with at least one silicon-based micromechanical structure, which is integrated with a sensor chamber of a foundation wafer, and with at least one covering that covers the foundation wafer in the region of the sensor chamber, and to a method for producing a sensor.
    Type: Application
    Filed: January 3, 2005
    Publication date: October 20, 2005
    Inventors: Frank Reichenbach, Stefan Pinter, Frank Henning, Hans Artmann, Helmut Baumann, Franz Laemer, Michael Offenberg, Georg Bischopink