Abstract: The invention relates to a sensor with at least one silicon-based micromechanical structure, which is integrated with a sensor chamber of a foundation wafer, and with at least one covering that covers the foundation wafer in the region of the sensor chamber, and to a method for producing a sensor.

Abstract: A sensor has a foundation wafer having a sensor chamber, at least one silicon-based micromechanical structure integrated with the sensor chamber of the foundation wafer, at least one covering that covers the foundation wafer in a region of the sensor chamber, the covering including a first layer which is a deposition layer and is permeable to an etching medium and reaction products, and a hermetically sealing second layer which is a sealing layer and located above the first layer, the deposition layer which is the first layer being permeable in a region of the sensor chamber to the etching medium and a reaction product, the deposition layer for being permeable having structures selected from the group consisting of etching openings, porous regions, and both.

Abstract: For a sensor whose sensor structure is implemented in a micromechanical structural component and which has parts which are movable in relation to the stationary substrate of the structural component, and which also includes an unsupported a seismic mass, a spring system having at least one spring, the seismic mass being connected to the substrate through the spring system, and an overload protection to limit the deflection of the spring system and the seismic mass in at least one direction, and an arrangement for detecting the deflections of the spring system and the seismic mass, whereby the impact forces may be reduced to prevent conchoidal breaks and resulting incipient damage to the sensor structure, as well as formation of particles. To that end, at least one two-dimensional stop for at least one moving part of the sensor structure is provided as overload protection.

Abstract: A method provides coating of the surface of a microelectromechanical structure (MEMS) wafer by using an anti-stick layer. The anti-stick material is initially applied to a cap wafer, and in subsequent steps this seeded cap wafer is bonded to the MEMS wafer. The anti-stick material is evaporated and deposited at least on parts of the surfaces of the MEMS wafer.

Abstract: For a sensor whose sensor structure is implemented in a micromechanical structural component and which has parts which are movable in relation to the stationary substrate of the structural component, and which also includes

Abstract: A micromechanical structure and a corresponding manufacturing method. The structure includes a substrate, which includes an anchoring device, and a centrifugal mass, which is connected to the anchoring device via a flexible spring device, so that the centrifugal mass is elastically deflectable from its rest position. The centrifugal mass includes clearances and is configured to be deflectable by etching a sacrificial layer underneath it. The sacrificial layer is present in a first area located underneath the centrifugal mass with a first etchable thickness, and in a second area located underneath the centrifugal mass with a second etchable thickness, the second thickness is greater than the first thickness. The centrifugal mass is structured in the first area so that in etching only a maximum of two etching fronts may come together in order to limit the etching residue deposits.

Abstract: The invention relates to a sensor with at least one silicon-based micromechanical structure, which is integrated with a sensor chamber of a foundation wafer, and with at least one covering that covers the foundation wafer in the region of the sensor chamber, and to a method for producing a sensor.

Abstract: A micromechanical structure and a corresponding manufacturing method are described. The structure includes a substrate (10), which has an anchoring device (20), and a centrifugal mass (30), which is connected to the anchoring device (20) via a flexible spring device (40), so that the centrifugal mass (30) is elastically deflectable from its rest position. The centrifugal mass (30) has clearances and is designed to be deflectable by etching a sacrificial layer (50) underneath it. The sacrificial layer (50) is present in a first area located underneath the centrifugal mass (30) with a first etchable thickness (d1), and in a second area located underneath the centrifugal mass (30) with a second etchable thickness (d1+d2+d3), the second thickness being greater than the first thickness (d1). The centrifugal mass (30) is structured in the first area so that in etching only a maximum of two etching fronts may come together in order to limit the etching residue deposits.

Abstract: A continuous flexible web includes a flat flexible insulation substrate, copper cladding on at least one major surface of the substrate and a film of photoresist material adhesively bonded longitudinally to the copper cladding. Prepunched holes are formed in and through the web to ultimately provide through-hole connections between printed circuits formed on opposite sides of the substrate.Successive sections of the web are indexed through an apparatus where the sections are positioned adjacent to a circuit pattern master and exposed to resist-developing ultraviolet rays. A photocell system cooperates with through-slots formed selectively in the web to precisely align the web sections with the circuit pattern master prior to exposure to the ultraviolet rays.