Abstract: A freeze dryer that includes a product chamber configured to accommodate products to be freeze-dried; a condenser connected to the product chamber and configured to trap water during a freeze-drying process; a product chamber cooling circuit configured to cool the product chamber, the product chamber cooling circuit having a first heat transfer fluid; a condenser cooling circuit configured to cool the condenser, the condenser cooling circuit having a second heat transfer fluid and being separate from the product chamber cooling circuit; a first additional cooling circuit having carbon dioxide or ammonia or liquid nitrogen as refrigerant; and a first heat exchanger configured to transfer heat between the condenser cooling circuit and the first additional cooling circuit.

Abstract: The invention relates to a method for producing a wire, having at least the following steps: (i) providing a wire precursor; (ii) pressing depressions on the wire precursor and optionally reshaping the wire precursor in the process, and (iii) annealing the wire precursor provided with depressions in order to form the wire; wherein the wire has a content of at least 95 wt. % of copper based on the total weight of the wire. The invention additionally relates to a wire which can be obtained according to the aforementioned method and to the use of a roller in order to produce the wire and/or in order to set the roughness at at least one location of the wire.

Abstract: The invention relates to a rechargeable battery transportation device (10) for a re-chargeable battery (22), in particular a lithium rechargeable battery, with (a) an external case (12) which has (i) a base body (16) with a filling opening (20), (ii) a cap (18) for creating an air-tight seal of the filling opening (20), and (iii) a ventilation opening (28), and (b) an inner tank (14) which (i) is arranged in the external case (12) and (ii) encloses an accommodation space (30) for accommodating the rechargeable battery (22). According to the invention, between the external case (12) and the inner tank (14) there is at least one flow path (S) from the accommodation space (30) to the ventilation opening (28), and a heat absorption material (36) is arranged along the flow path (S).

Abstract: A semiconductor module (10) contains a ceramic interconnect device (50) having at least one semiconductor component (20). The at least one semiconductor component (20) is covered by an encapsulating compound (30) which contains a cured inorganic cement and has a thermal expansion coefficient in the range of 2 to 10 ppm/K. The ceramic of the ceramic interconnect device (50) is selected from ceramics based on aluminum oxide, aluminum nitride or silicon nitride.

Abstract: The invention relates to a rechargeable battery transportation device (10) for a re-chargeable battery (22), in particular a lithium rechargeable battery, with (a) an external case (12) which has (i) a base body (16) with a filling opening (20), (ii) a cap (18) for creating an air-tight seal of the filling opening (20), and (iii) a ventilation opening (28), and (b) an inner tank (14) which (i) is arranged in the external case (12) and (ii) encloses an accommodation space (30) for accommodating the rechargeable battery (22). According to the invention, between the external case (12) and the inner tank (14) there is at least one flow path (S) from the accommodation space (30) to the ventilation opening (28), and a heat absorption material (36) is arranged along the flow path (S).

Abstract: One aspect relates to an electrical bushing for a medically implantable device, including an electrically insulating base body and an electrical conducting element. The conducting element includes a cermet, and the base body and the conducting element are connected by a sintered bond with a hermetic seal against the base body. The conducting element extends from a first surface of the base body through the base body to a second surface of the base body. The conducting element has first and second electrically conductive areas, and at least one of the electrically conductive areas is at least partially superimposed by a layer-like contact element, including a metal, so that the conducting element is connected in an electroconductive manner via the contact element. The contact element is an electrochemically created layer, such that it has a porous structure, wherein the porosity of the contact element is not more than 20%.

Abstract: A strip-type substrate includes a foil having a number of substrate units for producing chip card modules. The substrate has an inner face for at least partial direct or indirect contacting of a semiconductor chip and an outer face lying opposite the inner face. The foil includes of steel, in particular high-grade steel, and a first layer of nickel or a nickel alloy on at least some sections of the outer face.

Abstract: A semiconductor module (10) contains a ceramic interconnect device (50) having at least one semiconductor component (20). The at least one semiconductor component (20) is covered by an encapsulating compound (30) which contains a cured inorganic cement and has a thermal expansion coefficient in the range of 2 to 10 ppm/K. The ceramic of the ceramic interconnect device (50) is selected from ceramics based on aluminum oxide, aluminum nitride or silicon nitride.

Abstract: One aspect relates to an electrical bushing for a medically implantable device, including an electrically insulating base body and an electrical conducting element. The conducting element includes a cermet, and the base body and the conducting element are connected by a sintered bond with a hermetic seal against the base body. The conducting element extends from a first surface of the base body through the base body to a second surface of the base body. The conducting element has first and second electrically conductive areas, and at least one of the electrically conductive areas is at least partially superimposed by a layer-like contact element, including a metal, so that the conducting element is connected in an electroconductive manner via the contact element. The contact element is an electrochemically created layer, such that it has a porous structure, wherein the porosity of the contact element is not more than 20%.

Abstract: A strip-type substrate includes a foil having a number of substrate units for producing chip card modules. The substrate has an inner face for at least partial direct or indirect contacting of a semiconductor chip and an outer face lying opposite the inner face. The foil includes of steel, in particular high-grade steel, and a first layer of nickel or a nickel alloy on at least some sections of the outer face.

Abstract: A power electronics module includes a semiconductor element and a support with a functional surface for indirectly connecting to the semiconductor element. A palladium barrier layer is formed directly or indirectly on the functional surface, and the semiconductor element is directly or indirectly connected to the barrier layer face facing away from the functional surface by a layer of sintering silver paste. A silver layer is can be formed on the barrier layer, and a nickel layer can be formed between the functional surface and the barrier layer.

Abstract: An electrical contact element includes a base body and a coating covering the base body at least in sections. The coating includes an inner layer and an outer layer. The inner layer is applied to the base body and the outer layer is applied to the inner layer and forms a surface at least in sections of the electrical contact element. The inner layer is made of tin and the outer layer of silver, and the outer layer has a thickness of 50 nm-5.0 ?m.

Abstract: A laminate and method for producing the laminate are provided for contacting at least one electronic component. An insulating layer is laminated between first and second metal layers electrically contacted to each other in at least one contact region. At least one recess in the contact region is generated with at least one embossing and/or bulging in the first metal layer. The distance between the two metal layers is reduced, such that dimensions of the embossing/bulging are sufficient for taking up the electronic component, which is inserted and connected into the embossing/bulging in a conductive manner therein. The electronic component is taken up in the embossing/bulging entirely with respect to its circumference and at least partly with respect to the height (H) of the electronic component. The laminate may be used as a circuit board, sensor, LED lamp, mobile phone component, control, or regulator.

Abstract: A semiconductor module (10) contains a ceramic interconnect device (50) having at least one semiconductor component (20). The at least one semiconductor component (20) is covered by an encapsulating compound (30) which contains a cured inorganic cement and has a thermal expansion coefficient in the range of 2 to 10 ppm/K. The ceramic of the ceramic interconnect device (50) is selected from ceramics based on aluminum oxide, aluminum nitride or silicon nitride.

Abstract: A class of alloys is provided that form metallic glass upon cooling below the glass transition temperature Tg at a rate below 100° K/sec. The alloys have a high value of temperature difference (DT) between the crystallization temperature (Tx) and the glass transition temperature (Tg) of the intermetallic alloy. Such alloys comprise zirconium in the range of 70 to 80 weight percent, beryllium in the range of 0.8 to 5 weight percent, copper in the range of 1 to 15 weight percent, nickel in the range of 1 to 15 weight percent, aluminum in the range of 1 to 5 weight percent and niobium in the range of 0.5 to 3 weight percent, or narrower ranges depending on other alloying elements and the critical cooling rate and value of DT desired. Furthermore, methods are provided for making such metallic glasses.

Abstract: A lead system for a fire/smoke protection device that enables deployment/retraction of the device's flexible protection member relative to a building wall opening and improves the member's resistance to forces. The system comprises lead guides for guiding the flexible protection member between storage and protection configurations, for permitting stretching when a force is applied, and for transferring forces to the building. The guides are configured with the flexible protection member to slidably receive member loops extending about lead members. The guides and lead members are also configured to allow lead member movement and permit elastic deformation or destruction of connections between certain internal guide components, when a force is exerted on the flexible protection member. Additionally, the system comprises one or more members configured with a flexible protection member having a bar to enable bar movement during stretching of the flexible protection member responsive to a force.

Abstract: A class of alloys is provided that form metallic glass upon cooling below the glass transition temperature Tg at a rate below 100° K/sec. The alloys have a high value of temperature difference (DT) between the crystallization temperature (Tx) and the glass transition temperature (Tg) of the intermetallic alloy. Such alloys comprise zirconium in the range of 70 to 80 weight percent, beryllium in the range of 0.8 to 5 weight percent, copper in the range of 1 to 15 weight percent, nickel in the range of 1 to 15 weight percent, aluminum in the range of 1 to 5 weight percent and niobium in the range of 0.5 to 3 weight percent, or narrower ranges depending on other alloying elements and the critical cooling rate and value of DT desired. Furthermore, methods are provided for making such metallic glasses.

Abstract: A method is provided for production of a medical marker (4) made of an X-ray-opaque material, including the following steps: a) photolithographic application of a mask (31) on a substrate (1); b) deposition of the X-ray-opaque material (40) of the marker (4) on the substrate (1); c) removal of the mask (31); and d) elimination of the substrate (1).

Abstract: One aspect relates to a stimulation electrode including an electrically conducting base body. The base body encompasses tantalum and is at least partially covered with a porous tantalum oxide layer, which is anodically applied by means of high voltage pulses. Provision is made according to an embodiment for a metallic protective layer to cover the porous tantalum oxide layer so as to prevent a hydrogen embrittlement.

Abstract: The present disclosure describes a fire and smoke protection system for limiting the spread of fire and smoke through an opening, including those in building structures. The system includes a flexible protection member configurable in a storage configuration for subsequent deployment into a protection configuration when fire occurs. The flexible protection member is configurable in single and/or multi-layer arrangements with one or more materials, alone or in combination, and using a variety of construction methods. Generally, the flexible protection member is manufacturable using fire resistant woven and knitted fabric elements, metal foil elements, intumescent elements, and/or wire mesh elements arranged to increase the resistance to forces encountered during a fire. The various elements may be seamed using different stitching patterns and gathered using non-fire resistant thread in order to increase flexibility and resistance to forces.