Abstract: A new class of dielectric polymer material, which is particularly suitable for the manufacturing of electronic devices, is formed by reacting bismaleimide compounds and shows an advantageous well-balanced profile of favorable material properties. The bismaleimide compounds have an oligomeric structure with an heteroaromatic extended repeating unit in the middle part of the molecule and maleimide groups at each terminal end of the molecule. There is further provided a method for forming said dielectric polymer material. Beyond that, the present invention relates to the dielectric polymer material and to an electronic device including the same.

Abstract: An imaging apparatus for obtaining images of an object from various orientations during different specific lighting conditions. The imaging apparatus includes an enclosed housing which block any exterior ambient light from entering the interior chamber. A rotatable turntable is positioned within the housing, and a camera is located within the housing and positioned above the turntable for capturing images of objects placed on the turntable. A light assembly is included which includes various different lights at different locations within the housing to illuminate and identify different features and flaws on an object placed on the turntable. A light intensity sensor is located within the housing, the light intensity sensor is configured to monitor the intensity of light generated by the light assembly. A controller is also provided which is configured to control the operation of the camera, the turntable, the light intensity sensor, and the lights in the light assembly.

Abstract: A wire mesh layer, including warp wires and weft wires, wherein the warp wires and the weft wires form woven meshes and open up a woven surface. A connecting member is provided, which includes a thermoplastic material. The multilayered product is provided having such a wire mesh layer and a further layer, wherein the wire mesh layer and the further layer are connected by the thermally deformed connecting member. In a method of manufacturing such a multilayered product, the wire mesh layer and the further layer are placed on top of one another in a predetermined orientation. Due to the thermal deformation of the thermoplastic material of the connecting member, the wire mesh layer and the further layer will be interconnected.

Abstract: A circuit carrier for establishing mechanical and electrical connection for at least one (power) electronics component, having a carrier plate which has at least one passage hole, and at least one electrically and thermally conductive insert element which is arranged in the passage hole and has a first contact surface for establishing electrical and thermal connections to the component and a second contact surface, which faces away from the first contact surface, for establishing thermal connections to a cooling body. The insert element further forms a bushing and has a contact side face which is situated against the bushing and is designed for establishing an electrical and thermal connection to an electrical connecting element.

Abstract: An imaging apparatus for obtaining images of an object from various orientations during different specific lighting conditions. The imaging apparatus includes an enclosed housing which blocks any exterior ambient light from entering the interior chamber. A vacuum table is positioned within the housing, and a camera is located within the housing and positioned above the vacuum table for capturing images of objects placed on the vacuum table. A light assembly is included which includes various different lights at different locations within the housing to illuminate and identify different features and flaws on an object placed on the vacuum table. A light intensity sensor is located within the housing which is configured to monitor the intensity of light from the light assembly. A controller is also provided which is configured to control the operation of the camera, the vacuum table, the light intensity sensor, and the lights in the light assembly.

Abstract: An imaging apparatus for obtaining images of an object from various orientations during different specific lighting conditions. The imaging apparatus includes an enclosed housing which block any exterior ambient light from entering the interior chamber. A rotatable turntable is positioned within the housing, and a camera is located within the housing and positioned above the turntable for capturing images of objects placed on the turntable. A light assembly is included which includes various different lights at different locations within the housing to illuminate and identify different features and flaws on an object placed on the turntable. A light intensity sensor is located within the housing, the light intensity sensor is configured to monitor the intensity of light generated by the light assembly. A controller is also provided which is configured to control the operation of the camera, the turntable, the light intensity sensor, and the lights in the light assembly.

Abstract: The present invention relates to a novel class of polymers which can be used as dielectric material for the preparation of passivation layers in electronic devices. The polymers are prepared from polymerizable compounds having mesogenic groups and they provide excellent film forming capability and excellent mechanical properties and have a low dielectric constant and a low coefficient of thermal expansion (CTE). There is further provided a method for forming said polymers and an electronic device containing said polymers as dielectric material. Beyond that, the present invention relates to a manufacturing method for preparing a packaged microelectronic structure and to a microelectronic device comprising said packaged microelectronic structure formed by said manufacturing method.

Abstract: Rail fastening system (1) for fastening a rail (2) to a rail subsurface, preferably for a ballastless track, comprising a base plate (10), preferably made of a plastic, and at least one dowel (20), wherein the base plate (10) has at least one opening (15), which completely penetrates the base plate (10) in the thickness direction, and the dowel (20) is introduced into the opening (15), is held therein by means of a retaining contour and projects in the thickness direction at least on one side beyond the base plate (10).

Abstract: A recipe program with a plurality of recipe instructions for the preparation of a food product includes recipe instructions to be executed by a multifunction cooking apparatus as controlled by a recipe execution engine. A recipe instruction analyzer module analyzes a recipe instruction with regard to parameters (cooking mode, temperature, ingredients) of the recipe instruction. A cleaning mode determination module determines suitable cleaning mode(s) dependent on the results of the analysis by using a decision module which associates one or more cleaning modes with the parameters. A cleaning mode selector module selects, in accordance with predefined selection rules, a particular cleaning mode from the suitable cleaning mode(s). A cleaning execution module executes the selected cleaning mode after completed execution of the respective recipe instruction if the respective recipe instruction is not associated with a non-cleaning indicator in the recipe program.

Abstract: A method for acquiring a textual context of a user. The method includes: obtaining at least one character originating from at least one input peripheral device of an electronic device; optical character recognition applied to all or part of an image representative of a content displayed by at least one display peripheral device of the electronic device to obtain a character sequence; searching for the at least one character in the character sequence and, when the search is positive, acquisition, from the character sequence, of the textual context.

Abstract: The present invention relates to a polymerizable mixture which can be used to form a dielectric material for the preparation of passivation layers in electronic devices. The polymerizable mixture comprises a first monomer and a second monomer which may react to form a copolymer providing excellent film forming capability, excellent thermal properties and excellent mechanical properties. There is further provided a method for forming said copolymers and an electronic device containing said copolymers as dielectric material. Beyond that, the present invention relates to a manufacturing method for preparing a packaged microelectronic structure and to a microelectronic device comprising said packaged microelectronic structure formed by said manufacturing method.

Abstract: Rail fastening system for fastening at least one rail (2) to a rail substrate, preferably a solid travel path, which comprises: a rail support plate (1) arranged for holding the rail (2), wherein the rail (2) in the mounted state is in contact with the rail support plate and is fastened thereto by a rail mount (1a, 1b, 1c); a base plate (3) arranged for fastening the rail support plate (1) on the rail substrate, wherein the rail support plate (1) in the mounted state is fastened on the base plate (3) by way of one or more, preferably two, retaining elements (6) and the base plate (3) is in contact with the rail substrate; wherein the base plate (3) is of multi-part, preferably two-part, construction so that this is adjustable to different dimensions of the rail support plate (1).

Abstract: The present invention relates to a polymerizable mixture which can be used to form a dielectric material for the preparation of passivation layers in electronic devices. The polymerizable mixture comprises a first monomer and a second monomer which may react to form a copolymer providing excellent film forming capability, excellent thermal properties and excellent mechanical properties. There is further provided a method for forming said copolymers and an electronic device containing said copolymers as dielectric material. Beyond that, the present invention relates to a manufacturing method for preparing a packaged microelectronic structure and to a microelectronic device comprising said packaged microelectronic structure formed by said manufacturing method.

Abstract: A circuit carrier for establishing mechanical and electrical connection for at least one (power) electronics component, having a carrier plate which has at least one passage hole, and at least one electrically and thermally conductive insert element which is arranged in the passage hole and has a first contact surface for establishing electrical and thermal connections to the component and a second contact surface, which faces away from the first contact surface, for establishing thermal connections to a cooling body. The insert element further forms a bushing and has a contact side face which is situated against the bushing and is designed for establishing an electrical and thermal connection to an electrical connecting element.

Abstract: A wire mesh layer, including warp wires and weft wires, wherein the warp wires and the weft wires form woven meshes and open up a woven surface. A connecting member is provided, which includes a thermoplastic material. The multilayered product is provided having such a wire mesh layer and a further layer, wherein the wire mesh layer and the further layer are connected by the thermally deformed connecting member. In a method of manufacturing such a multilayered product, the wire mesh layer and the further layer are placed on top of one another in a predetermined orientation. Due to the thermal deformation of the thermoplastic material of the connecting member, the wire mesh layer and the further layer will be interconnected.

Abstract: The present invention relates to a novel class of polymers which can be used as dielectric material for the preparation of passivation layers in electronic devices. The polymers are prepared from polymerizable compounds having mesogenic groups and they provide excellent film forming capability and excellent mechanical properties and have a low dielectric constant and a low coefficient of thermal expansion (CTE). There is further provided a method for forming said polymers and an electronic device containing said polymers as dielectric material. Beyond that, the present invention relates to a manufacturing method for preparing a packaged microelectronic structure and to a microelectronic device comprising said packaged microelectronic structure formed by said manufacturing method.

Abstract: A rail fastening system for fastening a rail on a subsurface, preferably a ballastless track, comprises at least one retaining element for mounting the rail on the subsurface. The retaining element has an angle guide plate that, in the assembled state, is configured to divert transverse forces from the rail into the subsurface and a shoulder part that, in the assembled state, is configured to butt together with the angle guide plate and to lie in a recess of the subsurface in a positive-locking manner.

Abstract: Rail fastening system (1) for fastening a rail (2) to a rail subsurface, preferably for a ballastless track, comprising a base plate (10), preferably made of a plastic, and at least one dowel (20), wherein the base plate (10) has at least one opening (15), which completely penetrates the base plate (10) in the thickness direction, and the dowel (20) is introduced into the opening (15), is held therein by means of a retaining contour and projects in the thickness direction at least on one side beyond the base plate (10).

Abstract: A holddown assembly fastens a railway rail to a transversely extending hollow sleeper formed with a vertically throughgoing hole. An upwardly projecting lateral brace element is provided on the sleeper offset from the hole, and the assembly has a body fitted between the rail and the brace element and transversely bracing the rail against the brace element. An anchor of the assembly is engaged through the hole, projects upward from the sleeper, is transversely shiftable in the hole, and bears upward on the sleeper. A spring clip is pressed by the anchor down against the rail and presses the rail down against the metal sleeper.

Abstract: A coating material, suitable for a self-cleaning coating on a part on or in a cooking, frying, baking or grilling appliance for removing residual foodstuffs without mechanical intervention, includes porous particles and a binder which connects the porous particles. The binder has precipitated, inorganic particles which are particles produced via a precipitation reaction and subsequent grinding.