Abstract: An apparatus, system and/or method that incorporates teachings of the present disclosure may include, for example, presenting scheduling options on a display device where the scheduling options are determined based on scheduling information that comprises employment schedule data for other users that are associated with a user requesting the scheduling, receiving a scheduling selection from among the scheduling options that is inputted by the user via a user interface and providing the scheduling selection for evaluation. Other embodiments are disclosed.

Abstract: A microelectronic package can include a microelectronic element having a face and a plurality of element contacts thereon, a substrate having first and second surfaces, and terminals on the second surface configured for connecting the package with an external component. The microelectronic element can include a plurality of stacked electrically interconnected semiconductor chips. The substrate can have contacts facing the element contacts of the microelectronic element and joined thereto. The terminals can include first terminals arranged at positions within first and second parallel grids. The first terminals of each grid can be configured to carry address information usable by circuitry within the microelectronic package to determine an addressable memory location from among all the available addressable memory locations within the microelectronic element.

Abstract: A system or microelectronic assembly can include one or more microelectronic packages each having a substrate and a microelectronic element having a face and one or more columns of contacts thereon which face and are joined to corresponding contacts on a surface of the substrate. An axial plane may intersect the face along a line in the first direction and centered relative to the columns of element contacts. Columns of package terminals can extend in the first direction. First terminals in a central region of the second surface can be configured to carry address information usable to determine an addressable memory location within the microelectronic element. The central region may have a width not more than three and one-half times a minimum pitch between the columns of package terminals. The axial plane can intersect the central region.

Abstract: There is disclosed a system, architecture and method for encryption and decryption of a record. In an embodiment, a method comprises identifying a target record to be encrypted; analyzing one or more clear text linguistic attributes of the target record; generating a linguistic encryption key based on the analysis of one or more clear text linguistic attributes; and encrypting the target record with the linguistic encryption key, the linguistic encryption key operable to decrypt the encrypted target record in a reverse operation.

Abstract: A microelectronic assembly can include a microelectronic package connected with a circuit panel. The package has a microelectronic element having a front face facing away from a substrate of the package, and electrically connected with the substrate through conductive structure extending above the front face. First terminals provided in first and second parallel grids or in first and second individual columns can be configured to carry address information usable to determine an addressable memory location from among all the available addressable memory locations of the memory storage array. The first terminals in the first grid can have signal assignments which are a mirror image of the signal assignments of the first terminals in the second grid.

Abstract: A microelectronic package can include a substrate having first and second opposed surfaces and first and second apertures extending between the first and second surfaces, first and second microelectronic elements each having a surface facing the first surface of the substrate, a plurality of terminals exposed at the second surface in a central region thereof, and leads electrically connected between contacts of each microelectronic element and the terminals. The apertures can have first and second parallel axes extending in directions of the lengths of the respective apertures. The second surface can have a central region disposed between the first and second axes. Each microelectronic element can embody a greater number of active devices to provide memory storage array function than any other function. The terminals can be configured to carry all of the address signals transferred to the microelectronic package.

Abstract: Foam systems including a surfactant subsystem including one alpha-olefin sulfonic acid or a plurality of alkali metal alpha-olefin sulfonic acid salts and optionally, one ethoxylated alcohol sulfonate or a plurality of ethoxylated alcohol sulfonates, optionally, a pour point depressant subsystem including one glyme or a plurality of glymes and optionally, a corrosion inhibiting subsystem including one corrosion inhibitor or a plurality of corrosion inhibitors, where the system is thermally or heat stable up to 450° F., the system is environmentally benign, the system is capable of producing a foam in an aqueous medium including high amounts of crude oil, the system is efficient at low usage levels and the system is capable of reuse or at least on foam-defoam cycle. Methods for making and using including preparation of the foam systems, drilling, fracturing, completion and producing using the systems in conjunction with a gas.

Abstract: Methods and apparatus, including computer program products, are provided for providing a query language based on a model. In one aspect, there is provided a computer-implemented method. The method may include receiving a first query; generating, based on a model including metadata representing a data structure, a second query specific to the data structure stored in a database; and sending the second query to the database. Related apparatus, systems, methods, and articles are also described.

Abstract: A connector for connecting a second bone anchor to a first bone anchor includes a first component engageable to the first bone anchor and rotatably adjustable relative to the first bone anchor, a second component connected to the first component and forming a socket to receive the second bone anchor in a plurality of angular orientations, and a closure mechanism engageable with the second component to fix the second bone anchor at a selected angular orientation relative to the second component.

Abstract: A microelectronic assembly can include a circuit panel having first and second surfaces and panel contacts at each surface, and first and second microelectronic packages having terminals mounted to the panel contacts at the first and second surfaces, respectively. The circuit panel can electrically interconnect terminals of the first package with corresponding terminals of the second package. Each package can include a substrate having first and second surfaces, a microelectronic element, conductive structure extending above a front face of the microelectronic element, and parallel columns of terminals at the second surface. The terminals of each package can include first terminals in a central region of the respective second surface and configured to carry address information usable by circuitry within the package to determine an addressable memory location within the respective microelectronic element.

Abstract: The centrifugal force bearing includes a plurality of tapered metal shims such that the thicker end of each tapered metal shim near the inner portion of bearing. The bearing can include a plurality of tapered elastomeric members that are consequently tapered so that the inner portions are narrower than the outer portions. The tapered metal shims can increase the axial stiffness in the direction of the centrifugal force, thereby reducing the axial deflection under loading, as compared to non-tapered shims. Further, reducing axial deflection reduces clearance issues that may arise when the rotor blade is allowed to axial deflect significant distances. As such, the tapered metal shims can increase the capacity of the bearing. Tapering the metal shims can decrease the compression induced shear strain near the outer portions of the elastomeric member, where loads are typically higher.

Abstract: A non-aqueous wellbore servicing fluid comprising a fluid loss additive wherein the fluid loss additive comprises the reaction product of (i) a functional polymer and (ii) an oligomerized fatty acid. A method of conducting an oil-field operation comprising placing a non-aqueous wellbore servicing fluid downhole wherein the non-aqueous wellbore servicing fluid comprises a fluid loss additive comprising the reaction product of (i) a functional polymer and (ii) an oligomerized fatty acid.

Abstract: A microelectronic package can include a substrate and a microelectronic element having a rear face facing a first surface of the substrate, a front face, and a column of element contacts extending in a first direction. Edges of the microelectronic element can define an axial plane extending in the first direction and a third direction normal to the rear face. The package can include columns of terminals extending in the first direction at a second surface of the substrate. The terminals can include first terminals exposed in a central region of the second surface and configured to carry address information usable by circuitry within the package to determine an addressable memory location within the microelectronic element. The central region may have a width not more than three and one-half times a minimum pitch between any two adjacent columns of the terminals. The axial plane can intersect the central region.

Abstract: Embodiments provide histogram-based methods and system to estimate the transfer function of an ADC, and subsequently to linearize a non-linear ADC transfer function. Embodiments include blind algorithms that require no a priori knowledge of the input signal distribution. Embodiments can be implemented using cumulative (i.e., cumulative distribution function (CDF)) or non-cumulative (i.e., probability density function (PDF)) histograms. According to embodiments, a non-linear transfer function can be estimated by linearly approximating successive local intervals of the transfer function. Linearly approximated successive local intervals of the transfer function can then be used to fully characterize and closely estimate the transfer function.

Abstract: Systems and methods for real-time design checking of an integrated circuit design, include the operations of receiving at a design tool, design elements of an integrated circuit design entered by an integrated circuit designer; the design tool performing real-time design checks on the design elements as they are entered by the integrated circuit designer to determine whether a design element violates a design rule; when the design tool detects a violation of a design rule based on the design checks alerting the integrated circuit designer; and the design tool presenting a correction to correct the violation of the design rule. The real-time design checks can include, comparing each design element to one or more known non-compliant design elements stored in a database to determine whether a non-compliant design element was entered or is being entered by the integrated circuit designer.

Abstract: A handle for a razor, the handle having a fixed portion including a first end and a second end opposite the first end, and a rotatable portion coupled to the second end. The rotatable portion is configured to rotate relative to the fixed portion. The rotatable portion includes a first material and a second material such that the first material is different from the second material.

Abstract: An air brake locking device for a vehicle includes a main body having a pair of internal channels capable of connecting to a vehicle air line, a valve interposed between the internal channels for controlling the flow of air, and a control unit for regulating the operation of the valve.

Abstract: A microelectronic package can include a substrate having first and second opposed surfaces and first and second apertures extending between the first and second surfaces, first and second microelectronic elements each having a surface facing the first surface of the substrate, a plurality of terminals exposed at the second surface in a central region thereof, and leads electrically connected between contacts of each microelectronic element and the terminals. The apertures can have first and second parallel axes extending in directions of the lengths of the respective apertures. The central region of the second surface can be disposed between the first and second axes. The terminals can be configured to carry address information usable by circuitry within the microelectronic package to determine an addressable memory location from among all the available addressable memory locations of a memory storage array within the microelectronic elements.

Abstract: A dual-input nine-phase autotransformer converts first and second three-phase AC inputs to a nine-phase AC output. The autotransformer includes input terminals for connection to a first three-phase AC input and a second three-phase AC input smaller than the first three-phase AC input. The autotransformer includes a first plurality of coils, a second plurality, and a third plurality of coils wound on respective phase legs of the autotransformer. The autotransformer includes a plurality of output terminals for providing a plurality of AC output voltages, and a plurality of internal terminals for connecting the first, second, and third plurality of coils in a configuration that provides a 40° phase shift in the AC outputs provided by the dual-input nine-phase autotransformer.

Abstract: A microelectronic package can include a substrate and a microelectronic element having a face and one or more columns of contacts thereon which face and are joined to corresponding contacts on a surface of the substrate. An axial plane may intersect the face along a line in the first direction and centered relative to the columns of element contacts. Columns of package terminals can extend in the first direction. First terminals in a central region of the second surface can be configured to carry address information usable to determine an addressable memory location within the microelectronic element. The central region may have a width not more than three and one-half times a minimum pitch between the columns of package terminals. The axial plane can intersect the central region.