Patents by Inventor Franz Schellhorn
Franz Schellhorn has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8525206Abstract: An illumination device is specified which comprises an optoelectronic component having a housing body and at least one semiconductor chip provided for generating radiation, and a separate optical element, which is provided for fixing at the optoelectronic component and has an optical axis, the optical element having a radiation exit area and the radiation exit area having a concavely curved partial region and a convexly curved partial region, which at least partly surrounds the concavely curved partial region at a distance from the optical axis, the optical axis running through the concavely curved partial region.Type: GrantFiled: December 17, 2010Date of Patent: September 3, 2013Assignee: Osram Opto Semiconductor GmbHInventors: Simon Blümel, Franz Schellhorn, Günter Waitl, Mario Wanninger
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Patent number: 7942565Abstract: An illumination device is specified which has a light source (1) suitable for coupling divergent electromagnetic radiation (6) into an optical waveguide (2), the electromagnetic radiation (6) being guided in the optical waveguide (2) on the basis of total reflection the optical waveguide (2) being suitable for changing a main radiating direction (17) of the electromagnetic radiation (6), and the optical waveguide (2) being formed in one piece. Light-emitting diodes are preferably used as the light source (1). The illumination device is particularly well suited to the backlighting of displays.Type: GrantFiled: May 19, 2006Date of Patent: May 17, 2011Assignee: Osram Opto Semiconductors GmbHInventors: Gunnar Klick, Hubert Ott, Franz Schellhorn, Mario Wanninger, Georg Bogner
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Publication number: 20110085336Abstract: An illumination device is specified which comprises an optoelectronic component having a housing body and at least one semiconductor chip provided for generating radiation, and a separate optical element, which is provided for fixing at the optoelectronic component and has an optical axis, the optical element having a radiation exit area and the radiation exit area having a concavely curved partial region and a convexly curved partial region, which at least partly surrounds the concavely curved partial region at a distance from the optical axis, the optical axis running through the concavely curved partial region.Type: ApplicationFiled: December 17, 2010Publication date: April 14, 2011Inventors: Simon Blümel, Franz Schellhorn, Günter Waitl, Mario Wanninger
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Patent number: 7880188Abstract: An illumination device is specified which comprises an optoelectronic component having a housing body and at least one semiconductor chip provided for generating radiation, and a separate optical element, which is provided for fixing at the optoelectronic component and has an optical axis, the optical element having a radiation exit area and the radiation exit area having a concavely curved partial region and a convexly curved partial region, which at least partly surrounds the concavely curved partial region at a distance from the optical axis, the optical axis running through the concavely carved partial regionType: GrantFiled: February 21, 2006Date of Patent: February 1, 2011Assignee: Osram Opto Semiconductors GmbHInventors: Simon Blümel, Franz Schellhorn, Günter Waitl, Mario Wanninger
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Patent number: 7688400Abstract: A light source element is employed back-lighting of liquid crystal displays and that comprises an obliquely placed light exit face and/or light entry face. At its surfaces, the light waveguide is surrounded by reflectors into which suitable aperture regions are potentially formed. A plurality of light sources and/or a more direct view is provided and, thus, a corresponding increase of the luminance results. A method is also provided for the manufacture of a light source element with an integrated reflector.Type: GrantFiled: December 29, 1999Date of Patent: March 30, 2010Assignee: Osram GmbHInventors: Franz Schellhorn, Günter Kirchberger, Günter Waitl, Herbert Brunner, Bernhard Bachl
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Patent number: 7688401Abstract: A light source element is employed back-lighting of liquid crystal displays and that comprises an obliquely placed light exit face and/or light entry face. At its surfaces, the light waveguide is surrounded by reflectors into which suitable aperture regions are potentially formed. A plurality of light sources and/or a more direct view is provided and, thus, a corresponding increase of the luminance results. A method is also provided for the manufacture of a light source element with an integrated reflector.Type: GrantFiled: May 14, 2007Date of Patent: March 30, 2010Assignee: Osram GmbHInventors: Franz Schellhorn, Günter Kirchberger, Günter Waitl, Herbert Brunner, Bernhard Bachl
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Publication number: 20090201698Abstract: An illumination device is specified which has a light source (1) suitable for coupling divergent electromagnetic radiation (6) into an optical waveguide (2), the electromagnetic radiation (6) being guided in the optical waveguide (2) on the basis of total reflection the optical waveguide (2) being suitable for changing a main radiating direction (17) of the electromagnetic radiation (6), and the optical waveguide (2) being formed in one piece. Light-emitting diodes are preferably used as the light source (1). The illumination device is particularly well suited to the backlighting of displays.Type: ApplicationFiled: May 19, 2006Publication date: August 13, 2009Applicant: Osram Opto Semiconductors GmbHInventors: Gunnar Klick, Hulbert Ott, Franz Schellhorn, Mario Wanninger, Georg Bogner
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Publication number: 20080210962Abstract: An illumination device is specified which comprises an optoelectronic component having a housing body and at least one semiconductor chip provided for generating radiation, and a separate optical element, which is provided for fixing at the optoelectronic component and has an optical axis, the optical element having a radiation exit area and the radiation exit area having a concavely curved partial region and a convexly curved partial region, which at least partly surrounds the concavely curved partial region at a distance from the optical axis, the optical axis running through the concavely curved partial region.Type: ApplicationFiled: February 21, 2006Publication date: September 4, 2008Applicant: OSRAM OPTO SEMICONDUCTORS GMBHInventors: Simon Blumel, Franz Schellhorn, Gunter Waitl, Mario Wanninger
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Publication number: 20070263411Abstract: A light source element is employed back-lighting of liquid crystal displays and that comprises an obliquely placed light exit face and/or light entry face. At its surfaces, the light waveguide is surrounded by reflectors into which suitable aperture regions are potentially formed. A plurality of light sources and/or a more direct view is provided and, thus, a corresponding increase of the luminance results. A method is also provided for the manufacture of a light source element with an integrated reflector.Type: ApplicationFiled: May 14, 2007Publication date: November 15, 2007Inventors: Franz Schellhorn, Gunter Kirchberger, Gunter Waitl, Herbert Brunner, Bernhard Bachl
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Patent number: 7288831Abstract: In a two-pole SMT miniature housing in leadframe technique for semiconductor components, a semiconductor chip is mounted on one leadframe part and is contacted to a further leadframe part. The further leadframe part is conducted out of the housing in which the chip is encapsulated as a solder terminal. No trimming or shaping process is required and the housing is tight and is capable of further miniaturization. The solder terminals as punched parts of the leadframe are conducted projecting laterally from the housing sidewalls residing opposite one another at least up to the housing floor which forms the components' mounting surface. The chip mounting surface and the components' mounting surface form a right angle with one another.Type: GrantFiled: August 8, 2006Date of Patent: October 30, 2007Assignee: Osram GmbHInventors: Guenther Waitl, Franz Schellhorn, Herbert Brunner
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Patent number: 7199454Abstract: A radiation-emitting and/or radiation-receiving semiconductor component in which a radiation-emitting and/or radiation-receiving semiconductor chip is secured on a chip carrier part of a lead frame. The chip carrier part forms a trough in the region in which the semiconductor chip is secured wherein the inner surface of the trough is designed in such a way that it constitutes a reflector for the radiation emitted and/or received by the semiconductor chip.Type: GrantFiled: December 2, 2004Date of Patent: April 3, 2007Assignee: Osram GmbHInventors: Karlheinz Arndt, Herbert Brunner, Franz Schellhorn, Günter Waitl
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Publication number: 20060284287Abstract: In a two-pole SMT miniature housing in leadframe technique for semiconductor components, a semiconductor chip is mounted on one leadframe part and is contacted to a further leadframe part. The further leadframe part is conducted out of the housing in which the chip is encapsulated as a solder terminal. No trimming or shaping process is required and the housing is tight and is capable of further miniaturization. The solder terminals as punched parts of the leadframe are conducted prong laterally from the housing sidewalls residing opposite one another at least up to the housing floor which forms the components' mounting surface. The chip mounting surface and the components' mounting surface form a right angle with one another.Type: ApplicationFiled: August 8, 2006Publication date: December 21, 2006Inventors: Guenther Waitl, Franz Schellhorn, Herbert Brunner
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Patent number: 7102212Abstract: In a two-pole SMT miniature housing in leadframe technique for semiconductor components, a semiconductor chip is mounted on one leadframe part and is contacted to a further leadframe part. The further leadframe part is conducted out of the housing in which the chip is encapsulated as a solder terminal. No trimming or shaping process is required and the housing is tight and is capable of further miniaturization. The solder terminals as punched parts of the leadframe are conducted projecting laterally from the housing sidewalls residing opposite one another at least up to the housing floor which forms the components' mounting surface. The chip mounting surface and the components' mounting surface form a right angle with one another.Type: GrantFiled: August 30, 2005Date of Patent: September 5, 2006Assignee: Osram GmbHInventors: Guenther Waitl, Franz Schellhorn, Herbert Brunner
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Patent number: 7005311Abstract: In a two-pole SMT miniature housing in leadframe technique for semiconductor components, a semiconductor chip is mounted on one leadframe part and is contacted to a further leadframe part. The further leadframe part is conducted out of the housing in which the chip is encapsulated as a solder terminal. No trimming or shaping process is required and the housing is tight and is capable of further miniaturization. The solder terminals as punched parts of the leadframe are conducted projecting laterally from the housing sidewalls residing opposite one another at least up to the housing floor which forms the components' mounting surface. The chip mounting surface and the components' mounting surface form a right angle with one another.Type: GrantFiled: November 26, 2003Date of Patent: February 28, 2006Assignee: Osram GmbHInventors: Guenther Waitl, Franz Schellhorn, Herbert Brunner
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Publication number: 20060012015Abstract: In a two-pole SMT miniature housing in leadframe technique for semiconductor components, a semiconductor chip is mounted on one leadframe part and is contacted to a further leadframe part. The further leadframe part is conducted out of the housing in which the chip is encapsulated as a solder terminal. No trimming or shaping process is required and the housing is tight and is capable of further miniaturization. The solder terminals as punched parts of the leadframe are conducted projecting laterally from the housing sidewalls residing opposite one another at least up to the housing floor which forms the components' mounting surface. The chip mounting surface and the components' mounting surface form a right angle with one another.Type: ApplicationFiled: August 30, 2005Publication date: January 19, 2006Inventors: Guenther Waitl, Franz Schellhorn, Herbert Brunner
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Patent number: 6975011Abstract: A radiation-emitting and/or radiation-receiving semiconductor component in which a radiation-emitting and/or radiation-receiving semiconductor chip is secured on a chip carrier part of a lead frame. The chip carrier part forms a trough in the region in which the semiconductor chip is secured wherein the inner surface of the trough is designed in such a way that it constitutes a reflector for the radiation emitted and/or received by the semiconductor chip.Type: GrantFiled: April 6, 2004Date of Patent: December 13, 2005Assignee: Osram GmbHInventors: Karlheinz Arndt, Herbert Brunner, Franz Schellhorn, Günter Waitl
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Patent number: 6927469Abstract: A radiation-emitting and/or radiation-receiving semiconductor component, in which a radiation-emitting and/or radiation-receiving semiconductor chip is secured on a chip carrier part of a lead frame. The chip carrier part forms a trough in the region in which the semiconductor chip is secured wherein the inner surface of the trough is designed in such a way that it constitutes a reflector for the radiation emitted and/or received by the semiconductor chip.Type: GrantFiled: June 17, 2002Date of Patent: August 9, 2005Assignee: Osram GmbHInventors: Karlheinz Arndt, Herbert Brunner, Franz Schellhorn, Günter Waitl
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Publication number: 20050116238Abstract: A radiation-emitting and/or radiation-receiving semiconductor component in which a radiation-emitting and/or radiation-receiving semiconductor chip is secured on a chip carrier part of a lead frame. The chip carrier part forms a trough in the region in which the semiconductor chip is secured wherein the inner surface of the trough is designed in such a way that it constitutes a reflector for the radiation emitted and/or received by the semiconductor chip.Type: ApplicationFiled: December 2, 2004Publication date: June 2, 2005Inventors: Karlheinz Arndt, Herbert Brunner, Franz Schellhorn, Gunter Waitl
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Patent number: 6860621Abstract: An LED module includes a substrate having good thermal conductivity and one or more radiation-emitting semiconductor components that fixed on the top side of the substrate. The underside of the substrate is fixed on a carrier body having a high thermal capacity, in which the component fixing between the semiconductor components and the substrate and the substrate fixing between the substrate and the carrier body are embodied with good thermal conductivity. Furthermore, the invention relates to a method for producing the LED module, in which metal areas that are suitable as an etching mask improve the impressing of the current required during the anodic bonding, and at the same time, are used as contact areas for contact-connecting the radiation-emitting semiconductor components. The LED module has the advantage that the semiconductor components can be subjected to higher energization as a result of the high thermal capacity of the carrier body.Type: GrantFiled: January 10, 2003Date of Patent: March 1, 2005Assignee: OSRAM Opto Semiconductors GmbHInventors: Bernhard Bachl, Günter Kirchberger, Franz Schellhorn, Martin Weigert
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Publication number: 20040188790Abstract: A radiation-emitting and/or radiation-receiving semiconductor component in which a radiation-emitting and/or radiation-receiving semiconductor chip is secured on a chip carrier part of a lead frame. The chip carrier part forms a trough in the region in which the semiconductor chip is secured wherein the inner surface of the trough is designed in such a way that it constitutes a reflector for the radiation emitted and/or received by the semiconductor chip.Type: ApplicationFiled: April 6, 2004Publication date: September 30, 2004Applicant: Osram Opto Semiconductors GmbH, a Germany corporationInventors: Karlheinz Arndt, Herbert Brunner, Franz Schellhorn, Gunter Waitl