Abstract: In a two-pole SMT miniature housing in leadframe technique for semiconductor components, a semiconductor chip is mounted on one leadframe part and is contacted to a further leadframe part. The further leadframe part is conducted out of the housing in which the chip is encapsulated as a solder terminal. No trimming or shaping process is required and the housing is tight and is capable of further miniaturization. The solder terminals as punched parts of the leadframe are conducted projecting laterally from the housing sidewalls residing opposite one another at least up to the housing floor which forms the components' mounting surface. The chip mounting surface and the components' mounting surface form a right angle with one another.

Abstract: In a two-pole SMT miniature housing in leadframe technique for semiconductor components, a semiconductor chip is mounted on one leadframe part and is contacted to a further leadframe part. The further leadframe part is conducted out of the housing in which the chip is encapsulated as a solder terminal. No trimming or shaping process is required and the housing is tight and is capable of further miniaturization. The solder terminals as punched parts of the leadframe are conducted projecting laterally from the housing sidewalls residing opposite one another at least up to the housing floor which forms the components' mounting surface. The chip mounting surface and the components' mounting surface form a right angle with one another.

Abstract: A radiation-emitting and/or radiation-receiving semiconductor component in which a radiation-emitting and/or radiation-receiving semiconductor chip is secured on a chip carrier part of a lead frame. The chip carrier part forms a trough in the region in which the semiconductor chip is secured wherein the inner surface of the trough is designed in such a way that it constitutes a reflector for the radiation emitted and/or received by the semiconductor chip.

Abstract: An LED module includes a substrate having good thermal conductivity and one or more radiation-emitting semiconductor components that fixed on the top side of the substrate. The underside of the substrate is fixed on a carrier body having a high thermal capacity, in which the component fixing between the semiconductor components and the substrate and the substrate fixing between the substrate and the carrier body are embodied with good thermal conductivity. Furthermore, the invention relates to a method for producing the LED module, in which metal areas that are suitable as an etching mask improve the impressing of the current required during the anodic bonding, and at the same time, are used as contact areas for contact-connecting the radiation-emitting semiconductor components. The LED module has the advantage that the semiconductor components can be subjected to higher energization as a result of the high thermal capacity of the carrier body.

Abstract: In a two-pole SMT miniature housing in leadframe technique for semiconductor components, a semiconductor chip is mounted on one leadframe part and is contacted to a further leadframe part. The further leadframe part is conducted out of the housing in which the chip is encapsulated as a solder terminal. No trimming or shaping process is required and the housing is tight and is capable of further miniaturization. The solder terminals as punched parts of the leadframe are conducted projecting laterally from the housing sidewalls residing opposite one another at least up to the housing floor which forms the components' mounting surface. The chip mounting surface and the components' mounting surface form a right angle with one another.

Abstract: A radiation-emitting and/or radiation-receiving semiconductor component in which a radiation-emitting and/or radiation-receiving semiconductor chip is secured on a chip carrier part of a lead frame. The chip carrier part forms a trough in the region in which the semiconductor chip is secured. Wherein the inner surface of the trough is designed in such a way that it constitutes a reflector for the radiation emitted and/or received by the semiconductor chip.

Abstract: In a two-pole SMT miniature housing in leadframe technique for semiconductor components, a semiconductor chip is mounted on one leadframe part and is contacted to a further leadframe part. The further leadframe part is conducted out of the housing in which the chip is encapsulated as a solder terminal. No trimming or shaping process is required and the housing is tight and is capable of further miniaturization. The solder terminals as punched parts of the leadframe are conducted projecting laterally from the housing sidewalls residing opposite one another at least up to the housing floor which forms the components' mounting surface. The chip mounting surface and the components' mounting surface form a right angle with one another.

Abstract: The drive circuit is suitable for an LED array, comprising a number of clusters of LEDs, with one cluster comprising a number of LEDs which are arranged in series and are connected to a supply voltage (UBatt). A semiconductor switch (transistor T) is arranged in series between the LED and the supply voltage and allows the LED current to be supplied in a pulsed manner. A measurement resistor (Rshunt) for measuring the LED current is arranged in series between the LED and ground, with a control loop controlling the semiconductor switch such that a constant mean value of the LED current is achieved.

Abstract: An optical connection between an optoelectronic structural element and a fiber-optic beam waveguide is described which is reliable, simple, and space-saving. A lens and a hollow cylinder are integrated in the structural component of optoelectronic structural elements. Each end of a fiber-optic beam waveguide is inserted into the hollow cylinders, and the optoelectronic structural elements are connected with the aid of a heat-shrinkable tubing with the fiber-optic beam waveguide such that the ends of the light beam waveguide to be coupled abut each of the lens integrated into the optoelectronic structural elements. An optocoupler according to the invention may be advantageously used in motor vehicles, in electromedicine, in power electronics, in robot control, in sensory analysis, and in "instrumentaion-control-regulation" tasks.

Abstract: A surface-mountable opto-component capable of flexible use is disclosed. The opto-component has at least one base member that can be automatically assembled with the assistance of an assembly means and contains at least one optical transmitter and/or receiver. The opto-component also has at least one optical means for shaping the light to be emitted and/or to be received. Adjustment aids serve for the adjusted fastening of the at least one optical means.

Abstract: A surface-mountable opto-component has at least one transmitter and/or receiver and is capable of being flexibly employed. The surface-mountable opto-component has at least two surfaces and at least two electrical terminals at each of these at least two surfaces so that the opto-component is optionally mountable at each of these two surfaces.

Abstract: An optical emission device with an emitter semiconductor chip and a cover intended to be suitable for backlighting areas, the device having a comparatively low structural height and low packing density. The cover has a light aperture formed using a convex and concave lens for radiating light in a solid angle of maximum size. This device can also be used in combination with an additional external reflector and diffusion screen.