Patents by Inventor Fred C. Redeker
Fred C. Redeker has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12023853Abstract: A polishing article manufacturing system includes a feed section and a take-up section, the take-up section comprising a supply roll having a polishing article disposed thereon for a chemical mechanical polishing process, a print section comprising a plurality of printheads disposed between the feed section and the take-up section, and a curing section disposed between the feed section and the take-up section, the curing section comprising one or both of a thermal curing device and an electromagnetic curing device.Type: GrantFiled: December 2, 2019Date of Patent: July 2, 2024Assignee: Applied Materials, Inc.Inventors: Kasiraman Krishnan, Daniel Redfield, Russell Edward Perry, Gregory E. Menk, Rajeev Bajaj, Fred C. Redeker, Nag B. Patibandla, Mahendra C. Orilall, Jason G. Fung
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Patent number: 11980992Abstract: Embodiments described herein relate to integrated abrasive (IA) polishing pads, and methods of manufacturing IA polishing pads using, at least in part, surface functionalized abrasive particles in an additive manufacturing process, such as a 3D inkjet printing process. In one embodiment, a method of forming a polishing article includes dispensing a first plurality of droplets of a first precursor, curing the first plurality of droplets to form a first layer comprising a portion of a sub-polishing element, dispensing a second plurality of droplets of the first precursor and a second precursor onto the first layer, and curing the second plurality of droplets to form a second layer comprising portions of the sub-polishing element and portions of a plurality of polishing elements. Here, the second precursor includes functionalized abrasive particles having a polymerizable group chemically bonded to surfaces thereof.Type: GrantFiled: September 16, 2022Date of Patent: May 14, 2024Assignee: Applied Materials, Inc.Inventors: Ashavani Kumar, Ashwin Chockalingam, Sivapackia Ganapathiappan, Rajeev Bajaj, Boyi Fu, Daniel Redfield, Nag B. Patibandla, Mario Dagio Cornejo, Amritanshu Sinha, Yan Zhao, Ranga Rao Arnepalli, Fred C. Redeker
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Patent number: 11958162Abstract: Embodiments of the disclosure generally provide polishing pads having a composite pad body and methods for forming the polishing pads. In one embodiment, the composite pad body includes one or more first features formed from a first material or a first composition of materials, and one or more second features formed from a second material or a second composition of materials, wherein the one or more first features and the one or more second features are formed by depositing a plurality of layers comprising the first material or first composition of materials and second material or second composition of materials.Type: GrantFiled: January 17, 2020Date of Patent: April 16, 2024Assignee: Applied Materials, Inc.Inventors: Rajeev Bajaj, Kasiraman Krishnan, Mahendra C. Orilall, Daniel Redfield, Fred C. Redeker, Nag B. Patibandla, Gregory E. Menk, Jason G. Fung, Russell Edward Perry, Robert E. Davenport
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Publication number: 20230330805Abstract: Implementations disclosed herein generally relate to polishing articles and methods for manufacturing polishing articles used in polishing processes. More specifically, implementations disclosed herein relate to porous polishing pads produced by processes that yield improved polishing pad properties and performance, including tunable performance. Additive manufacturing processes, such as three-dimensional printing processes provides the ability to make porous polishing pads with unique properties and attributes.Type: ApplicationFiled: April 24, 2023Publication date: October 19, 2023Applicant: Applied Materials, Inc.Inventors: Sivapackia GANAPATHIAPPAN, Nag B. PATIBANDLA, Rajeev BAJAJ, Daniel REDFIELD, Fred C. REDEKER, Mahendra C. ORILALL, Boyi FU, Mayu YAMAMURA, Ashwin CHOCKALINGAM
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Patent number: 11780046Abstract: A polishing system includes a platen having a top surface to support an annular polishing pad, a carrier head to hold a substrate in contact with the annular polishing pad, a support structure extending above the platen and to which one or more polishing system components are secured, and a support post. The platen is rotatable about an axis of rotation that passes through approximately a center of the platen. The first support post has an upper end coupled to and supporting the support structure and a lower portion that is supported on the platen or that extends through an aperture in the platen.Type: GrantFiled: August 25, 2022Date of Patent: October 10, 2023Assignee: Applied Materials, Inc.Inventors: Paul D. Butterfield, Thomas H. Osterheld, Jeonghoon Oh, Shou-Sung Chang, Steven M. Zuniga, Fred C. Redeker
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Publication number: 20230052048Abstract: Embodiments described herein relate to integrated abrasive (IA) polishing pads, and methods of manufacturing IA polishing pads using, at least in part, surface functionalized abrasive particles in an additive manufacturing process, such as a 3D inkjet printing process. In one embodiment, a method of forming a polishing article includes dispensing a first plurality of droplets of a first precursor, curing the first plurality of droplets to form a first layer comprising a portion of a sub-polishing element, dispensing a second plurality of droplets of the first precursor and a second precursor onto the first layer, and curing the second plurality of droplets to form a second layer comprising portions of the sub-polishing element and portions of a plurality of polishing elements. Here, the second precursor includes functionalized abrasive particles having a polymerizable group chemically bonded to surfaces thereof.Type: ApplicationFiled: September 16, 2022Publication date: February 16, 2023Inventors: Ashavani KUMAR, Ashwin CHOCKALINGAM, Sivapackia GANAPATHIAPPAN, Rajeev BAJAJ, Boyi FU, Daniel REDFIELD, Nag B. PATIBANDLA, Mario Dagio CORNEJO, Amritanshu SINHA, Yan ZHAO, Ranga Rao ARNEPALLI, Fred C. REDEKER
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Publication number: 20220410335Abstract: A polishing system includes a platen having a top surface to support an annular polishing pad, a carrier head to hold a substrate in contact with the annular polishing pad, a support structure extending above the platen and to which one or more polishing system components are secured, and a support post. The platen is rotatable about an axis of rotation that passes through approximately a center of the platen. The first support post has an upper end coupled to and supporting the support structure and a lower portion that is supported on the platen or that extends through an aperture in the platen.Type: ApplicationFiled: August 25, 2022Publication date: December 29, 2022Inventors: Paul D. Butterfield, Thomas H. Osterheld, Jeonghoon Oh, Shou-Sung Chang, Steven M. Zuniga, Fred C. Redeker
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Patent number: 11511388Abstract: A polishing system includes a platen having a top surface to support an annular polishing pad, a carrier head to hold a substrate in contact with the annular polishing pad, a support structure extending above the platen and to which one or more polishing system components are secured, and a support post. The platen is rotatable about an axis of rotation that passes through approximately a center of the platen. The first support post has an upper end coupled to and supporting the support structure and a lower portion that is supported on the platen or that extends through an aperture in the platen.Type: GrantFiled: December 6, 2019Date of Patent: November 29, 2022Assignee: Applied Materials, Inc.Inventors: Paul D. Butterfield, Thomas H. Osterheld, Jeonghoon Oh, Shou-Sung Chang, Steven M. Zuniga, Fred C. Redeker
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Patent number: 11471999Abstract: Embodiments described herein relate to integrated abrasive (IA) polishing pads, and methods of manufacturing IA polishing pads using, at least in part, surface functionalized abrasive particles in an additive manufacturing process, such as a 3D inkjet printing process. In one embodiment, a method of forming a polishing article includes dispensing a first plurality of droplets of a first precursor, curing the first plurality of droplets to form a first layer comprising a portion of a sub-polishing element, dispensing a second plurality of droplets of the first precursor and a second precursor onto the first layer, and curing the second plurality of droplets to form a second layer comprising portions of the sub-polishing element and portions of a plurality of polishing elements. Here, the second precursor includes functionalized abrasive particles having a polymerizable group chemically bonded to surfaces thereof.Type: GrantFiled: July 23, 2018Date of Patent: October 18, 2022Assignee: APPLIED MATERIALS, INC.Inventors: Ashavani Kumar, Ashwin Chockalingam, Sivapackia Ganapathiappan, Rajeev Bajaj, Boyi Fu, Daniel Redfield, Nag B. Patibandla, Mario Dagio Cornejo, Amritanshu Sinha, Yan Zhao, Ranga Rao Arnepalli, Fred C. Redeker
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Patent number: 11446788Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one resin precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions.Type: GrantFiled: August 15, 2019Date of Patent: September 20, 2022Assignee: APPLIED MATERIALS, INC.Inventors: Rajeev Bajaj, Daniel Redfield, Mahendra C. Orilall, Boyi Fu, Ashwin Chockalingam, Ashavani Kumar, Fred C. Redeker, Nag B. Patibandla
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Publication number: 20220281062Abstract: A polishing apparatus includes a support configured to receive and hold a substrate in a plane, a polishing pad affixed to a cylindrical surface of a rotary drum, a first actuator to rotate the drum about a first axis parallel to the plane, a second actuator to bring the polishing pad on the rotary drum into contact with the substrate, and a port for dispensing a polishing liquid to an interface between the polishing pad and the substrate.Type: ApplicationFiled: March 1, 2022Publication date: September 8, 2022Inventors: Ekaterina A. Mikhaylichenko, Fred C. Redeker, Brian J. Brown, Chirantha Rodrigo, Steven M. Zuniga, Jay Gurusamy
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Patent number: 10875145Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one resin precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions.Type: GrantFiled: October 22, 2015Date of Patent: December 29, 2020Assignee: APPLIED MATERIALS, INC.Inventors: Rajeev Bajaj, Daniel Redfield, Mahendra C. Orilall, Boyi Fu, Aniruddh Khanna, Jason G. Fung, Mario Cornejo, Ashwin Chockalingam, Mayu Yamamura, Veera Raghava Reddy Kakireddy, Ashavani Kumar, Venkat Hariharan, Gregory E. Menk, Fred C. Redeker, Nag B. Patibandla, Hou T. Ng, Robert E. Davenport, Amritanshu Sinha
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Patent number: 10821573Abstract: Embodiments of the present disclosure relate to advanced polishing pads with tunable chemical, material and structural properties, and new methods of manufacturing the same. According to one or more embodiments of the disclosure, it has been discovered that a polishing pad with improved properties may be produced by an additive manufacturing process, such as a three-dimensional (3D) printing process. Embodiments of the present disclosure thus may provide an advanced polishing pad that has discrete features and geometries, formed from at least two different materials that include functional polymers, functional oligomers, reactive diluents, and curing agents. For example, the advanced polishing pad may be formed from a plurality of polymeric layers, by the automated sequential deposition of at least one resin precursor composition followed by at least one curing step, wherein each layer may represent at least one polymer composition, and/or regions of different compositions.Type: GrantFiled: October 19, 2015Date of Patent: November 3, 2020Assignee: APPLIED MATERIALS, INC.Inventors: Rajeev Bajaj, Daniel Redfield, Mahendra C. Orilall, Boyi Fu, Aniruddh Khanna, Jason G. Fung, Mario Cornejo, Ashwin Chockalingam, Mayu Yamamura, Veera Raghava Reddy Kakireddy, Ashavani Kumar, Venkat Hariharan, Gregory E. Menk, Fred C. Redeker, Nag B. Patibandla, Hou T. Ng, Robert E. Davenport, Amritanshu Sinha
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Patent number: 10800000Abstract: The present disclosure relates generally to a polishing article, and apparatus and methods of chemical mechanical polishing substrates using the polishing article. In some embodiments, the polishing article, such as a polishing pad, includes multiple layers in which one or more layers (i.e., at least the top layer) includes a plurality of nano-fibers that a positioned to contact a substrate during a polishing process. In one embodiment, a polishing article comprises a layer having a thickness less than about 0.032 inches, and the layer comprising fibers having a diameter of about 10 nanometers to about 200 micro meters.Type: GrantFiled: January 29, 2016Date of Patent: October 13, 2020Assignee: APPLIED MATERIALS, INC.Inventors: Robert D. Tolles, Mahendra C. Orilall, Fred C. Redeker, Rajeev Bajaj
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Patent number: 10786885Abstract: A method and apparatus for polishing a substrate that includes a polishing article comprising a polymeric sheet having a raised surface texture, which is formed on the surface of the polymeric sheet is provided. According to one or more implementations of the present disclosure, an advanced polishing article has been developed, which does not require abrasive pad conditioning. In some implementations of the present disclosure, the advanced polishing article comprises a polymeric sheet having a polishing surface with a raised surface texture or “micro-features” and/or a plurality of grooves or “macro-features” formed in the polishing surface. In some implementations, the raised surface texture is embossed, etched, machined or otherwise formed in the polishing surface prior to installing and using the advanced polishing article in a polishing system. In one implementation, the raised features have a height within one order of magnitude of the features removed from the substrate during polishing.Type: GrantFiled: January 19, 2018Date of Patent: September 29, 2020Assignee: APPLIED MATERIALS, INC.Inventors: Robert D. Tolles, Gregory E. Menk, Eric Davey, You Wang, Huyen Karen Tran, Fred C. Redeker, Veera Raghava Reddy Kakireddy, Ekaterina Mikhaylichenko, Jay Gurusamy
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Publication number: 20200147750Abstract: Embodiments of the disclosure generally provide polishing pads having a composite pad body and methods for forming the polishing pads. In one embodiment, the composite pad body includes one or more first features formed from a first material or a first composition of materials, and one or more second features formed from a second material or a second composition of materials, wherein the one or more first features and the one or more second features are formed by depositing a plurality of layers comprising the first material or first composition of materials and second material or second composition of materials.Type: ApplicationFiled: January 17, 2020Publication date: May 14, 2020Inventors: Rajeev BAJAJ, Kasiraman KRISHNAN, Mahendra C. ORILALL, Daniel REDFIELD, Fred C. REDEKER, Nag B. PATIBANDLA, Gregory E. MENK, Jason G. FUNG, Russell Edward PERRY, Robert E. DAVENPORT
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Publication number: 20200114487Abstract: A polishing system includes a platen having a top surface to support an annular polishing pad, a carrier head to hold a substrate in contact with the annular polishing pad, a support structure extending above the platen and to which one or more polishing system components are secured, and a support post. The platen is rotatable about an axis of rotation that passes through approximately a center of the platen. The first support post has an upper end coupled to and supporting the support structure and a lower portion that is supported on the platen or that extends through an aperture in the platen.Type: ApplicationFiled: December 6, 2019Publication date: April 16, 2020Inventors: Paul D. Butterfield, Thomas H. Osterheld, Jeonghoon Oh, Shou-Sung Chang, Steven M. Zuniga, Fred C. Redeker
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Publication number: 20200101657Abstract: A polishing article manufacturing system includes a feed section and a take-up section, the take-up section comprising a supply roll having a polishing article disposed thereon for a chemical mechanical polishing process, a print section comprising a plurality of printheads disposed between the feed section and the take-up section, and a curing section disposed between the feed section and the take-up section, the curing section comprising one or both of a thermal curing device and an electromagnetic curing device.Type: ApplicationFiled: December 2, 2019Publication date: April 2, 2020Inventors: Kasiraman KRISHNAN, Daniel REDFIELD, Russell Edward PERRY, Gregory E. MENK, Rajeev BAJAJ, Fred C. REDEKER, Nag B. PATIBANDLA, Mahendra C. ORILALL, Jason G. FUNG
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Patent number: 10562147Abstract: A polishing system includes a platen having a top surface, an annular polishing pad supported on the platen, a carrier head to hold a substrate in contact with the annular polishing pad, a support structure from which the carrier head is suspended and which is configured to move the hold the carrier head laterally across the polishing pad, and a controller. The platen is rotatable about an axis of rotation that passes through approximately the center of the platen, and the inner edge of the annular polishing pad is positioned around the axis of rotation. The controller is configured to cause the support structure to position the carrier head such that a portion of the substrate overhangs the inner edge of the annular polishing pad while the substrate is contacting the polishing pad.Type: GrantFiled: August 30, 2017Date of Patent: February 18, 2020Assignee: Applied Materials, Inc.Inventors: Paul D. Butterfield, Thomas H. Osterheld, Jeonghoon Oh, Shou-Sung Chang, Steven M. Zuniga, Fred C. Redeker
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Patent number: 10537974Abstract: Embodiments of the disclosure generally provide polishing pads includes a composite pad body and methods for forming the polishing pads. One embodiment provides a polishing pad including a composite pad body. The composite pad body includes one or more first features formed from a first material or a first composition of materials, and one or more second features formed from a second material or a second composition of materials, wherein the one or more first features and the one or more second features are formed by depositing a plurality of layers comprising the first material or first composition of materials and second material or second composition of materials.Type: GrantFiled: January 22, 2018Date of Patent: January 21, 2020Assignee: APPLIED MATERIALS, INC.Inventors: Rajeev Bajaj, Kasiraman Krishnan, Mahendra C. Orilall, Daniel Redfield, Fred C. Redeker, Nag B. Patibandla, Gregory E. Menk, Jason G. Fung, Russell Edward Perry, Robert E. Davenport