Patents by Inventor Fred C. Redeker

Fred C. Redeker has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and Apparatus for Material Deposition
    Publication number: 20080153291
    Abstract: Broadly speaking, a method and an apparatus are provided for depositing a material on a semiconductor wafer (“wafer”). More specifically, the method and apparatus provide for selective heating of a surface of the wafer exposed to an electroless plating solution. The selective heating is provided by applying radiant energy to the wafer surface. The selective heating of the wafer surface causes a temperature increase at an interface between the wafer surface and the electroless plating solution. The temperature increase at the interface in turn causes a plating reaction to occur at the wafer surface. Thus, material is deposited on the wafer surface through an electroless plating reaction that is initiated and controlled by varying the temperature of the wafer surface using an appropriately defined radiant energy source.
    Type: Application
    Filed: March 7, 2008
    Publication date: June 26, 2008
    Applicant: Lam Research Corporation
    Inventors: Yezdi Dordi, John Boyd, William Thie, Bob Maraschin, Fred C. Redeker, Joel M. Cook
  • Apparatus and method for providing a confined liquid for immersion lithography
    Patent number: 7367345
    Abstract: A method for processing a substrate is provided which includes generating a meniscus on the surface of the substrate and applying photolithography light through the meniscus to enable photolithography processing of a surface of the substrate.
    Type: Grant
    Filed: April 28, 2004
    Date of Patent: May 6, 2008
    Assignee: Lam Research Corporation
    Inventors: David Hemker, Fred C. Redeker, John Boyd, John M. de Larios, Michael Ravkin, Mikhail Korolik
  • Method and apparatus for semiconductor wafer planarization
    Patent number: 7368017
    Abstract: Broadly speaking, the present invention provides a method and an apparatus for planarizing a semiconductor wafer (“wafer”). More specifically, the present invention provides for depositing a planarizing layer over the wafer, wherein the planarizing layer serves to fill recessed areas present on a surface of the wafer. A planar member is positioned over and proximate to a top surface of the wafer. Positioning of the planar member serves to entrap electroless plating solution between the planar member and the wafer surface. Radiant energy is applied to the wafer surface to cause a temperature increase at an interface between the wafer surface and the electroless plating solution. The temperature increase in turn causes plating reactions to occur at the wafer surface. Material deposited through the plating reactions forms a planarizing layer that conforms to a planarity of the planar member.
    Type: Grant
    Filed: December 12, 2003
    Date of Patent: May 6, 2008
    Assignee: Lam Research Corporation
    Inventors: Fred C. Redeker, John Boyd, Yezdi Dordi, William Thie, Bob Maraschin
  • Method and apparatus for material deposition in semiconductor fabrication
    Patent number: 7358186
    Abstract: Broadly speaking, a method and an apparatus are provided for depositing a material on a semiconductor wafer (“wafer”). More specifically, the method and apparatus provide for selective heating of a surface of the wafer exposed to an electroless plating solution. The selective heating is provided by applying radiant energy to the wafer surface. The selective heating of the wafer surface causes a temperature increase at an interface between the wafer surface and the electroless plating solution. The temperature increase at the interface in turn causes a plating reaction to occur at the wafer surface. Thus, material is deposited on the wafer surface through an electroless plating reaction that is initiated and controlled by varying the temperature of the wafer surface using an appropriately defined radiant energy source.
    Type: Grant
    Filed: December 12, 2003
    Date of Patent: April 15, 2008
    Assignee: Lam Research Corporation
    Inventors: Yezdi Dordi, John Boyd, William Thie, Bob Maraschin, Fred C. Redeker, Joel M. Cook
  • Proximity brush unit apparatus and method
    Patent number: 7353560
    Abstract: An apparatus is provided for producing a wet region and corresponding dry region on a wafer. A proximity brush unit delivers fluids with a rotatable brush to produce the wet region on the wafer. As the proximity brush unit moves in a selected scan method across the wafer, a plurality of ports produces the dry region on the wafer. Further, the rotatable brush disposed within the proximity brush unit can rotate via mechanical gears or electromagnetic levitation. The selected scan method that produces the wet region and the dry region moves the proximity brush unit in a variety of methods including a radial scan, a linear scan, a spiral scan and a raster scan. To further produce a dry region during the selected scan method, the plurality of ports disposed on the surface of the proximity brush unit is on the trailing edges of the proximity head unit and the wafer.
    Type: Grant
    Filed: December 18, 2003
    Date of Patent: April 8, 2008
    Assignee: Lam Research Corporation
    Inventors: John M. Boyd, Michael L. Orbock, Fred C. Redeker
  • Edge wheel dry manifold
    Patent number: 7350315
    Abstract: A apparatus for drying a substrate includes a vacuum manifold positioned adjacent to an edge wheel. The edge wheel includes an edge wheel groove for receiving a peripheral edge of a substrate, and the edge wheel is capable of rotating the substrate at a desired set velocity. The vacuum manifold includes a proximity end having one or more vacuum ports defined therein. The proximity end is positioned at least partially within the edge wheel groove, and using supplied vacuum removes fluids that accumulate in the edge wheel groove and prevents re-deposit of trapped fluids around the peripheral edge of the substrate.
    Type: Grant
    Filed: December 22, 2003
    Date of Patent: April 1, 2008
    Assignee: Lam Research Corporation
    Inventors: Glenn W. Davis, Carl Woods, John Parks, Fred C. Redeker, Mike Ravkin, Michael L. Orbock
  • Vibration damping in chemical mechanical polishing system
    Patent number: 7331847
    Abstract: A carrier head for chemical mechanical polishing, includes a base, a support structure attached to the base having a surface for contacting a substrate, and a retaining structure attached to the base to prevent the substrate from moving along the surface. The retaining structure and the surface define a cavity for receiving the substrate. A polishing station includes a platen, a vibration damper mounted on the platen and a substrate polishing pad mounted on the vibration damper. The vibration damper includes a material that does not rebound to its original shape when subjected to a deformation.
    Type: Grant
    Filed: January 17, 2006
    Date of Patent: February 19, 2008
    Assignee: Applied Materials, Inc
    Inventors: Hung Chih Chen, John M. White, Shijian Li, Fred C. Redeker, Ramin Emami
  • Method and apparatus for cleaning a substrate using megasonic power
    Patent number: 7264007
    Abstract: A method for processing a substrate is provided that includes generating a fluid meniscus on a surface of the substrate and applying acoustic energy to the fluid meniscus. The method also includes moving the fluid meniscus over the surface the substrate to process the surface of the substrate.
    Type: Grant
    Filed: June 30, 2003
    Date of Patent: September 4, 2007
    Assignee: Lam Research Corporation
    Inventors: John M. Boyd, Mike Ravkin, Fred C. Redeker, John de Larios
  • System and method for integrating in-situ metrology within a wafer process
    Patent number: 7252097
    Abstract: A system and method for processing a wafer includes applying a process to the wafer. The process being supported by a surface tension gradient device. A result of the process is monitored. The monitored result is output.
    Type: Grant
    Filed: June 24, 2003
    Date of Patent: August 7, 2007
    Assignee: Lam Research Corporation
    Inventors: John M. Boyd, John M. de Larios, Michael Ravkin, Fred C. Redeker
  • Compliant grinding wheel
    Patent number: 7252736
    Abstract: A pre-planarization module configured to perform a long range planarization operation is provided. The pre-planarization module includes a semiconductor substrate support configured to rotate about a first axis. The pre-planarization module also includes an annular ring having a first side with a compliant layer affixed thereto. The second side of the compliant layer is affixed to a planarizing surface. The annular ring is configured to move perpendicular and parallel to a plane associated with the substrate support. Additionally, the annular ring is configured to rotate about a second axis, where the second axis is offset from the first axis. The substrate support and the annular ring rotate in the same direction. A method for performing a planarization process and a substrate grinding device are also provided.
    Type: Grant
    Filed: March 31, 2004
    Date of Patent: August 7, 2007
    Assignee: Lam Research Corporation
    Inventors: John M. Boyd, Fred C. Redeker, Yezdi Dordi
  • Method of chemical mechanical polishing with high throughput and low dishing
    Patent number: 7232761
    Abstract: Method and apparatus are provided for polishing conductive materials with low dishing of features and reduced or minimal remaining residues. In one aspect, a method is provided for processing a substrate by polishing the substrate to remove bulk conductive material and polishing the substrate by a ratio of carrier head rotational speed to platen rotational speed of between about 2:1 and about 3:1 to remove residual conductive material. In another aspect, a method is provided for processing a substrate including polishing the substrate at a first relative linear velocity between about 600 mm/second and about 1900 mm/second at the center of the substrate, and polishing the substrate at a second relative linear velocity between about 100 mm/second and about 550 mm/second at the center of the substrate.
    Type: Grant
    Filed: August 24, 2004
    Date of Patent: June 19, 2007
    Assignee: Applied Materials, Inc.
    Inventors: Shijian Li, Jui-Lung Li, Shi-Ping Wang, Gary Lam, David Mai, Fred C. Redeker
  • Method and apparatus for simultaneously cleaning the front side and back side of a wafer
    Patent number: 7231682
    Abstract: A method for cleaning a semiconductor substrate is provided. The method initiates with transferring the semiconductor substrate into a chamber. Then, a first side of the semiconductor substrate is cleaned according to a first cleaning technique. A second side of the semiconductor substrate is simultaneously cleaned according to a second cleaning technique. The semiconductor substrate is then transferred from the chamber. A system and apparatus for simultaneously cleaning opposing sides of a semiconductor substrate are also provided.
    Type: Grant
    Filed: August 28, 2003
    Date of Patent: June 19, 2007
    Assignee: Lam Research Corporation
    Inventors: John M. Boyd, Katrina Mikhaylich, Fred C. Redeker
  • Cu CMP polishing pad cleaning
    Patent number: 7220322
    Abstract: A polishing pad is cleaned of Cu CMP by-products, subsequent to planarizing a wafer, to reduce pad-glazing by applying to the polishing pad surface a composition comprising about 0.1 to about 3.0 wt. % of at least one organic compound having one or more amine or amide groups, an acid or a base in an amount sufficient to adjust the pH of the composition to about 5.0 to about 12.0, the remainder water. Embodiments comprise ex situ cleaning of a rotating polishing pad by applying a solution having a pH of about 5.0 to about 12.0 at a flow rate of about 100 to about 600 ml/min. for about 3 to about 20 seconds after polishing a wafer having a Cu-containing surface and then removing the cleaning solution from the polishing pad by high pressure rinsing with water.
    Type: Grant
    Filed: August 24, 2000
    Date of Patent: May 22, 2007
    Assignee: Applied Materials, Inc.
    Inventors: Lizhong Sun, Shijian Li, Fred C. Redeker
  • Chemical mechanical polishing a substrate having a filler layer and a stop layer
    Patent number: 7201636
    Abstract: A substrate is chemical mechanical polished with a high-selectivity slurry until the stop layer is at least partially exposed, and then the substrate is polished with a low-selectivity slurry until the stop layer is completely exposed.
    Type: Grant
    Filed: March 8, 2005
    Date of Patent: April 10, 2007
    Assignee: Applied Materials, Inc.
    Inventors: Raymond R. Jin, Shijian Li, Fred C. Redeker, Thomas H. Osterheld
  • Method and apparatus for semiconductor wafer cleaning using high-frequency acoustic energy with supercritical fluid
    Patent number: 7191787
    Abstract: An apparatus and a method is provided for using high-frequency acoustic energy with a supercritical fluid to perform a semiconductor wafer (“wafer”) cleaning process. High-frequency acoustic energy is applied to the supercritical fluid to impart energy to particulate contamination present on the wafer surface. Energy imparted to particulate contamination via the high-frequency acoustic energy and supercritical fluid is used to dislodge and remove the particulate contamination from the wafer. Additionally, the wafer cleaning process benefits from the supercritical fluid properties of near zero surface tension, high diffusivity, high density, and chemical mixing capability.
    Type: Grant
    Filed: February 3, 2003
    Date of Patent: March 20, 2007
    Assignee: Lam Research Corporation
    Inventors: Fred C. Redeker, John M. Boyd, John Parks
  • Temperature control in a chemical mechanical polishing system
    Patent number: 7153188
    Abstract: The carrier head has a base and a substrate backing structure for holding a substrate against a polishing surface during polishing. The substrate backing structure is connected to the base and includes an external surface that contacts a backside of the substrate during polishing. The substrate backing structure also includes a resistive heating system to distribute heat over an area of the external surface and at least one thermally conductive membrane. The external surface is a first surface of the at least one thermally conductive membrane, and the resistive heating system is integrated within one of the at least one thermally conductive membrane.
    Type: Grant
    Filed: October 7, 2005
    Date of Patent: December 26, 2006
    Assignee: Applied Materials, Inc.
    Inventors: Steven M. Zuniga, Hung Chih Chen, Stan D. Tsai, Kapila Wijekoon, Fred C. Redeker, Rajeev Bajaj
  • Apparatus and method for depositing and planarizing thin films of semiconductor wafers
    Patent number: 7153400
    Abstract: An electroplating apparatus for depositing a metallic layer on a surface of a wafer is provided. In one example, a proximity head capable of being electrically charged as an anode is placed in close proximity to the surface of the wafer. A plating fluid is provided between the wafer and the proximity head to create localized metallic plating.
    Type: Grant
    Filed: June 27, 2003
    Date of Patent: December 26, 2006
    Assignee: Lam Research Corporation
    Inventors: Mike Ravkin, John Boyd, Yezdi N. Dordi, Fred C. Redeker, John M. de Larios
  • System and method for modulating flow through multiple ports in a proximity head
    Patent number: 7143527
    Abstract: A method of forming a dynamic liquid meniscus includes forming a meniscus at a first size, the meniscus being formed between a proximity head and a first surface and changing the meniscus to a second size by modulating a flow through at least one of a set of ports on the proximity head. A system for modulating flow through the ports in a proximity head is also described.
    Type: Grant
    Filed: November 14, 2005
    Date of Patent: December 5, 2006
    Assignee: Lam Research Corporation
    Inventors: James P. Garcia, Fred C. Redeker, John de Larios
  • Methods and systems for processing a substrate using a dynamic liquid meniscus
    Patent number: 7127831
    Abstract: A system and method of moving a meniscus from a first surface to a second surface includes forming a meniscus between a head and a first surface. The meniscus can be moved from the first surface to an adjacent second surface, the adjacent second surface being parallel to the first surface. The system and method of moving the meniscus can also be used to move the meniscus along an edge of a substrate.
    Type: Grant
    Filed: December 22, 2005
    Date of Patent: October 31, 2006
    Assignee: LAM Research Corporation
    Inventors: James P. Garcia, John M. de Larios, Michael Ravkin, Fred C. Redeker, Carl Woods
  • Compliant wafer chuck
    Patent number: 7108591
    Abstract: A semiconductor substrate support is provided. The semiconductor substrate support includes a chuck configured to change between a compliant state and a rigid state. An electromagnetic field source configured to apply an electromagnetic field to the chuck is included. The electromagnetic field causes the chuck to change from the compliant state to the rigid state. A method for supporting a semiconductor substrate and a system for cleaning a substrate and an apparatus are also provided.
    Type: Grant
    Filed: March 31, 2004
    Date of Patent: September 19, 2006
    Assignee: Lam Research Corporation
    Inventors: John M. Boyd, Fred C. Redeker, Yezdi Dordi