Abstract: Embodiments of substrate supports are provided herein. In some embodiments, a substrate support includes: a first plate having a plurality of openings extending into the first plate from an upper surface of the first plate to a bottom surface of each respective opening of the plurality of openings; a plurality of tabs comprising three or more tabs disposed in each respective opening and extending towards the upper surface of the first plate; and a plurality of support elements disposed in each of the plurality of openings, wherein the plurality of tabs are disposed around each of the plurality of support elements and configured to retain the plurality of support elements in the plurality of openings.

Abstract: An apparatus for inserting a seal member into a seal groove includes a tray. The tray includes a holding groove formed in a front surface for containing the seal member. The holding groove is sized and shaped to correspond with the seal groove. A method of installing a seal member into a seal groove includes aligning the holding groove with the seal groove, and applying a pressure to a back surface of the tray, thereby deforming the tray and inserting the seal member into the seal groove.

Abstract: Embodiments of substrate supports for use in a process chamber are provided herein. In some embodiments a substrate support for use in a process chamber includes a pedestal having an upper surface for supporting a substrate and an opposite lower surface, a first heater disposed within the pedestal between the upper surface and the lower surface, and thermal baffles having a plurality of voids that are fluidly isolated from each other disposed between the first heater and the lower surface to reduce heat transfer from the first heater to the lower surface of the pedestal.

Abstract: Embodiments of substrate supports for use in a process chamber are provided herein. In some embodiments a substrate support for use in a process chamber includes a pedestal having an upper surface for supporting a substrate and an opposite lower surface, a first heater disposed within the pedestal between the upper surface and the lower surface, and thermal baffles having a plurality of voids that are fluidly isolated from each other disposed between the first heater and the lower surface to reduce heat transfer from the first heater to the lower surface of the pedestal.

Abstract: Embodiments of a substrate carrier are provided herein. In some embodiments, a substrate carrier includes a base plate, wherein the base plate is a thin, solid plate with no through holes or embedded components; and a plurality of raised portions extending from the base plate, wherein the plurality of raised portions include first raised portions and second raised portions, the first raised portions disposed radially inward from the second raised portions, wherein the base plate and the plurality of raised portions define pockets configured to retain a plurality of substrates, and wherein an upper surface of the second raised portions have a greater surface area than an upper surface of the first raised portions.