Abstract: An apparatus is disclosed comprising: a light guide having an opening formed thereon; an illumination source at least partially disposed in the opening, the illumination source including a plurality of LEDs disposed on a flexible circuit that is wrapped around a base, which may be thermally conductive, the base having a central opening, and the flexible circuit including a plurality of legs, each leg including electrical wiring for independently operating a different one of the LEDs, each leg being wrapped around a bottom edge of the base, and into the central opening, to come above the illumination source and connect to a control board that is situated above the illumination source; and a heat-dissipating element disposed over the illumination source, the heat-dissipating element being thermally coupled to the base to dissipate heat generated by the LEDs that is supplied to the heat dissipating element via the base.

Abstract: A light engine and system are disclosed in which the light engine contains a core comprising an opening extending through opposing surfaces and a flexible printed circuit board (PCB). The PCB includes a flexible body disposed on an outside of the core and having independently addressable sets of illumination sources mounted thereto, and flexible legs extending from the body and through the opening. The legs are bent such that a terminal portion of each leg is substantially parallel to the opposing surfaces of the core. Independent control of the sets of illumination sources is provided via the legs. The body is separated into segments, each on a different section of the outside and containing body contacts electrically independent of the body contacts of each other segment. Each leg is associated with a different segment, and contains leg contacts on the terminal portion in electrical contact with the associated body contacts.

Abstract: A light engine is disclosed in which the light engine contains a core comprising an opening extending completely through the core and independently addressable LED segments. The opening defines an inner surface of the core. Each segment has multiple LEDs. A PCB contains a body adjacent to one of an inner or outer surface of the core and to which the LED segments are attached and legs extending from the body and bent to be adjacent and traverse to the other of the inner or outer surface. Each leg is associated with a different LED segment. Control circuitry is connected with the legs of the flexible PCB and independently controls parameters of the LED segments to provide a preset illumination distribution and intensity based on user input.

Abstract: A light engine is disclosed in which the light engine contains a core having an opening extending completely therethrough and independently addressable LED segments. The opening defines an inner surface of the core. Each segment has LEDs and is attached to a flexible PCB. The PCB has a flexible body attached to one of an inner or outer surface of the core and to which the segments are mounted, and flexible legs extending from the body, along the core, and traverse and adjacent to the other of the inner or outer surface. A light guide plate (LGP) receives and guides light from the segments so that the light exits to provide illumination. The segments emit light in all directions of a plane created by the LGP. A reflector opposes and covers a top surface of the LGP and the segments and reflects light from the LGP back into the LGP.

Abstract: A mounting substrate has a patterned metal layer defining a plurality of top metal bond pads for bonding to bottom metal bond pads of LED dies. A solder mask layer is formed over the mounting substrate, where the mask has openings that expose the top metal bond pads and protects metal traces on the substrate. The mask layer is a highly reflective white paint. The exposed top metal bond pads are then wetted with solder. The LED dies' bottom metal bond pads are then soldered to the exposed top metal bond pads, such that the mask layer surrounds each LED die to reflect light. A reflective ring is affixed to the substrate to surround the LED dies. A viscous phosphor material then partially fills the ring and is cured. All downward light by the LED dies and phosphor is reflected upward by the ring and solder mask layer.

Abstract: A light emitting device comprises a detector circuit and a light emitting diode (LED) die. The LED die includes a semiconductor stack grown on a substrate. The LED includes an emitter segment formed from one segment of the semiconductor stack. The LED die includes a photosensor segment formed from another segment of the semiconductor stack. The LED die includes a segmentation layer formed between the emitter segment and the photosensor segment. The segmentation layer electrically isolates the emitter segment from the photosensor segment. The LED die includes first electrodes configured to provide power to energize the emitter segment. The LED die includes second electrodes configured to send the current to the detector circuit. The detector circuit is configured to convert the current to a signal which provides operational feedback with respect to the emitter segment.

Abstract: A light-emitting device comprising: a light source; and a light guide that is optically coupled to the light source, the light guide including a plurality of first non-fluorescent light extraction elements and a plurality of second non-fluorescent light extraction elements that are printed on the light guide, each of the first light extraction elements having a reflectance that is higher than a reflectance of any of the second light extraction elements, each of the first light extraction elements having a light transmittance that is lower than a light transmittance of any the second light extraction elements, each of the first light extraction elements having the same shape and size as any other one of the plurality first light extraction elements, and each of the second light extraction elements having the same shape and size as any other one of the plurality of second light extraction elements.

Abstract: A lens is affixed over an LED die mounted on a substrate to encapsulate the LED die. The lens may have a top surface shaped as a dome or other shape to achieve the desired light pattern. The lens has a cavity for the LED die. A reflector pattern is molded into the bottom surface of the lens, such as one or more facet rings with an angled surface surrounding the LED die. The angled surface of the facet ring reflects the downward or shallow light emission from the LED die upward. A plurality of facet rings of different radii and heights may be formed in the bottom of the lens for shaping the light emission. Any suitable shape of facet may be used. The facet rings may be formed to cause the LED module to emit a narrow beam or other light emission patterns.

Abstract: An apparatus is disclosed including a light guide and a plurality of light emitting diodes (LEDs). The light guide includes a rear portion including a first edge, a second edge, and a rear edge. The first edge meets the rear edge at a first obtuse angle, and the second edge meets the rear edge at a second obtuse angle. The plurality of light emitting diodes (LEDs) disposed on the first edge, the second edge, and the rear edge, and it is arranged to produce an asymmetric light distribution pattern including a rear light emission and a forward light emission having a greater peak intensity than the rear light emission.

Abstract: A light emitting diode (LED) may include a conductive via in a first portion of an epitaxial layer and a first contact on a second portion of the epitaxial layer. The first portion and the second portion may be separated by an isolation region. The LED may include a transparent conductive layer on the epitaxial layer.

Abstract: A patterned conductive layer on a flexible substrate includes pads for mounting an array of LEDs, conductive strips, and conductive tabs that couple the conductive strips to the pads. The desired circuit configuration is created by removing select tabs by punching holes or otherwise piercing the flexible substrate at the location of the tabs. In some embodiments, the patterned conductive layer is arranged to permit each LED to be mounted in either of two mirrored orientations, and in some embodiments, the patterned conductive layer is arranged to permit a separation between LEDs that is not predefined by the pattern. In some embodiments, the unmodified patterned conductive layer is arranged to provide a parallel circuit configuration, and the modified patterned conductive layer is arranged to provide a series or series-parallel configuration.

Abstract: Light emitting diodes (LEDs) having a sensor segment for operational feedback are described. A semiconductor stack is grown on a sapphire substrate. The semiconductor stack is segmented to form at least two segments, where one segment senses light emissions (photosensor segment) from the other segment (emitter segment). The segmentation is achieved by etching a trench or forming a segmentation layer between the segments. One segment can alternate on a predetermined basis between functioning as a photosensor segment or as an emitter segment. The photosensor segment can detect either a side light ray emitting from the emitter segment or a reflected light ray from a substrate. The photosensor segment generates a current based on the detected light ray. A detector circuit can provide operational feedback based on the sensed current.

Abstract: A mounting substrate (40) has a patterned metal layer defining a plurality of top metal bond pads for bonding to bottom metal bond pads of LED dies. A solder mask layer (52) is formed over the mounting substrate, where the mask has openings that expose the top metal bond pads and protects metal traces on the substrate. The mask layer is a highly reflective white paint. The exposed top metal bond pads are then wetted with solder. The LED dies' bottom metal bond pads are then soldered to the exposed top metal bond pads, such that the mask layer surrounds each LED die to reflect light. A reflective ring (60) is affixed to the substrate to surround the LED dies. A viscous phosphor material (62) then partially fills the ring and is cured. All downward light by the LED dies and phosphor is reflected upward by the ring and solder mask layer.

Abstract: A light-emitting diode (LED) strip is disclosed. The LED strip includes: an input terminal for receiving a first reference signal, a first LED coupled to an end of a power bus and driven by a first current signal, the first current signal being supplied to the first LED via the power bus; a current-copying circuit arranged to control a flow rate of the first current signal based on the first reference signal; and a first switching element arranged to re-couple the first LED to the power bus when the first LED is disconnected from the end of the power bus as a result of the LED strip being cut at a first location.

Abstract: A light emitting structure includes a packaged back-emitting light emitting device mounted on a reflective substrate. The properties of the reflective surface may be controlled to provide a desired luminance pattern. In this manner, the creation of a light emitting structure that provides a desired luminance pattern may be independent of the provider of the packaged light emitting device.

Abstract: In embodiments of the invention, a passivation layer is disposed over a side of a semiconductor structure including a light emitting layer disposed between an n-type region and a p-type region. A material configured to adhere to an underfill is disposed over an etched surface of the semiconductor structure.

Abstract: A light emitting structure includes a packaged back-emitting light emitting device mounted on a reflective substrate. The properties of the reflective surface may be controlled to provide a desired luminance pattern. In this manner, the creation of a light emitting structure that provides a desired luminance pattern may be independent of the provider of the packaged light emitting device.

Abstract: A method, apparatus, and system are disclosed for increasing light extraction efficiency in a light guide optical system. The light guide optical system may comprise a light emitting source. The light emitting source may be, for example, a light-emitting diode (LED) or plurality of LEDS. The light guide optical system may also comprise a light guide plate (LGP). The LGP may include light extraction features located on surfaces of the LGP. The LGP may also include a shaped injection surface on an input surface of the LGP. The shaped injection surface may be angled to deviate near-parallel light emitted from the LED to enable the near-parallel light emitted from the LED to be extracted from the LGP via the light extraction features. The shaped injection surface may be a split edge (i.e. a V-groove) or a curved edge.

Abstract: In embodiments of the invention, a passivation layer is disposed over a side of a semiconductor structure including a light emitting layer disposed between an n-type region and a p-type region. A material configured to adhere to an underfill is disposed over an etched surface of the semiconductor structure.

Abstract: Light emitting diodes (LEDs) having a sensor segment for operational feedback are described. A semiconductor stack is grown on a sapphire substrate. The semiconductor stack is segmented to form at least two segments, where one segment senses light emissions (photosensor segment) from the other segment (emitter segment). The segmentation is achieved by etching a trench or forming a segmentation layer between the segments. One segment can alternate on a predetermined basis between functioning as a photosensor segment or as an emitter segment. The photosensor segment can detect either a side light ray emitting from the emitter segment or a reflected light ray from a substrate. The photosensor segment generates a current based on the detected light ray. A detector circuit can provide operational feedback based on the sensed current.