Abstract: A signal demodulation device includes an IQ mixer, a differential element and a signal processor. The IQ mixer is configured to output a first mixed signal and a second mixed signal. The differential element is electrically connected to the IQ mixer for receiving the first and second mixed signals and configured to differentiate the first and second mixed signals and output a first derivative signal and a second derivative signal. The signal processor is electrically connected to the differential element for receiving the first and second derivative signals and configured to demodulate the first and second derivative signals and output a first demodulated signal.

Abstract: A sensor unit includes a sensor interface and a host interface. The sensor interface can be coupled to a number of sensors mounted on various locations of the ADV. The host interface can be coupled to a host system that is configured to perceive a driving environment surrounding the ADV based on sensor data obtained from the sensors and to plan a path to autonomously drive the ADV. The sensor unit further includes a sensor processing module and a sensor control module coupled to the sensor interface, and a time module coupled to the sensor processing module and the sensor control module. The sensor processing module is configured to process sensor data received from the sensors via the sensor interface. The sensor control module is configured to control operations of the sensors. The time module is configured to generate time to synchronize timing of the operations of the sensors.

Abstract: Provided herein are thiazolidinone and oxazolidinone compounds such as Compound 1, 1A, 1B, 1C, 1D, 1E, 1F, and compounds of Formulas (I), (II), (III), and (IV). Also provided herein are uses of these thiazolidinone and oxazolidinone compounds such as Compound 1, 1A, 1B, 1C, 1D, 1E, 1F, and compounds of Formulas (I), (II), (III), and (IV), pharmaceutical compositions and formulations in the treatment of various diseases, including but not limited to diseases or disorders associated with an activated immune system (e.g., multiple sclerosis and psoriasis).

Abstract: The invention provides synthetic intermediates and synthetic processes that are useful for preparing the antibacterial agent TXA709:

Abstract: A multiple-target vital sign detector includes a self-injection-locked oscillator (SILO), a chirp up/down converter, a frequency demodulator and a multiple-target vital sign processor. The chirp up/down converter performs conversion from an oscillation signal generated by the SILO to a frequency-modulated continuous wave (FMCW) signal to detect an area and from a received FMCW signal reflected from the area to an injection signal, while the SILO is injected with the injection signal to enter a self-injection-locked state. The locations and vital signs of multiple subjects are extracted from the oscillation signal using the frequency demodulator and the multiple-target vital sign processor. The objective of using the SILO is to improve the sensitivity of the FMCW detection process so as to more effectively distinguish the vital signs of multiple subjects at different locations.

Abstract: A leadframe comprising a plurality of leads, each of the plurality of leads having a proximal end and a distal end opposite the proximal end, the distal ends positioned along a linear axis. The leadframe further comprises a die pad closer to the proximal ends than the distal ends of the plurality of leads and including an edge positioned along a plane that intersects the linear axis at an angle less than 90 degrees.

Abstract: A method and apparatus for bonding semiconductor devices are disclosed. In an embodiment, the method may include attaching a first die to a flip head of a flip module, flipping the first die with the flip module, removing the first die from the flip module after flipping the first die, inspecting the flip head of the flip module for contamination after removing the first die, cleaning the flip head with an in situ cleaning module after inspecting the flip head, and attaching a second die to the flip head after cleaning the flip head.

Abstract: Aspects of the disclosure relate generally to semiconductor packaging, and specifically to semiconductor device having a lead frame having a semiconductor supporting die pad that is capable of engaging with a wire bonding clamp.

Abstract: A method and apparatus for bonding semiconductor devices are disclosed. In an embodiment, the method may include attaching a first die to a flip head of a flip module, flipping the first die with the flip module, removing the first die from the flip module after flipping the first die, inspecting the flip head of the flip module for contamination after removing the first die, cleaning the flip head with an in situ cleaning module after inspecting the flip head, and attaching a second die to the flip head after cleaning the flip head.

Abstract: A six-port SIL radar includes an oscillation element, a transceiver element, a power coupling element and a six-port demodulation element. The six-port demodulation element is utilized to demodulate an oscillation signal from the oscillation element such that the operating frequency of the six-port SIL radar will not be restricted by hardware. Further, the power coupling element is configured to divide the oscillation signal into two signals that have equal power when received by the six-port demodulation element for signal-to-noise ratio optimization.

Abstract: In a vital sign sensor of the present invention, an antenna assembly radiates an oscillation signal generated by a SIL oscillator to an object in a form of a wireless signal and receives a reflected signal from the object, and the reflected signal can have the SIL oscillator injection-locked. The wireless signal radiated from the antenna assembly is transmitted to a demodulator for demodulation such that the vital signs of the object can be obtained. Additionally, an isolator of the antenna assembly is provided to prevent the SIL oscillator from receiving a clutter reflected from the demodulator and an environment where the demodulator is placed. As a result, the clutter can't influence the vital sign detection of the object.

Abstract: By changing frequencies of an oscillation signal and an injection signal, a frequency-converted self-injection-locked radar has an oscillation frequency different to a frequency of a transmitted signal from a transceiver antenna element such that the frequency-converted self-injection-locked radar with high sensitivity and penetration or with high sensitivity and low cost is achieved.

Abstract: A detection method by using a FMCW radar is disclosed. The FMCW radar divides a detection signal into short-time detection segments and reconfigure the short-time detection segments into detection sub-signals so as to estimate a distance between an object and the FMCW radar according to peak-to-average ratios of the detection sub-signals.

Abstract: The invention provides synthetic intermediates and synthetic processes that are useful for preparing the antibacterial agent TXA709:

Abstract: By changing frequencies of an oscillation signal and an injection signal, a frequency-converted self-injection-locked radar has an oscillation frequency different to a frequency of a transmitted signal from a transceiver antenna element such that the frequency-converted self-injection-locked radar with high sensitivity and penetration or with high sensitivity d low cost is achieved.

Abstract: A method and apparatus for bonding semiconductor devices are disclosed. In an embodiment, the method may include attaching a first die to a flip head of a flip module, flipping the first die with the flip module, removing the first die from the flip module after flipping the first die, inspecting the flip head of the flip module for contamination after removing the first die, cleaning the flip head with an in situ cleaning module after inspecting the flip head, and attaching a second die to the flip head after cleaning the flip head.

Abstract: A noncontact vibration sensor includes a wireless transceiver, a filter and an amplitude demodulator. The wireless transceiver is configured to transmit a transmission signal to an object and receive a reflected signal from the object. And the wireless transceiver is injection-locked by the reflected signal to output a self-injection-locked (SIL) signal. The filter is electrically connected to the wireless transceiver and configured to receive and convert the SIL signal from frequency modulation into amplitude modulation to output an amplitude-modulated signal. The amplitude demodulator is electrically connected to the filter and configured to receive and amplitude-demodulate the amplitude-modulated signal to output a demodulated signal.

Abstract: A leadframe comprising a plurality of leads, each of the plurality of leads having a proximal end and a distal end opposite the proximal end, the distal ends positioned along a linear axis. The leadframe further comprises a die pad closer to the proximal ends than the distal ends of the plurality of leads and including an edge positioned along a plane that intersects the linear axis at an angle less than 90 degrees.

Abstract: A 3-D path detection system includes an image capture device, a radar device and a computing module. The image capture device is provided to produce a dynamic image for calculating the x- and y-direction (transverse) pixel-value displacements according to a captured moving object image. The radar device is configured to transmit an input wireless signal to a moving object and receive a reflection signal from the moving object, and is configured to calculate a z-direction (longitudinal) displacement of the moving object according to a Doppler shift in the reflection signal. The computing module is configured to construct a 3-D path of the moving object according to the x- and y-direction pixel-value displacements of the moving object image and the z-direction displacement of the moving object.

Abstract: A perception and planning system includes a system frame and one or more cooling fans mounted on a first side of the system frame to generate an airflow flowing outwardly to remove at least a portion of the heat generated by the processors. The system further includes an air filtering module mounted on a second side of the system frame to filter the air flow flowing inwardly to remove durst or contaminated material from the airflow. The air filtering module includes an air filter, a mounting plate, and a cover plate. The mounting plate can be mounted on the second side of the system frame to receive the air filter. The mounting plate includes one or more magnets. The cover plate can be attached to the mounting plate by a magnetic force generated from the magnets to keep the air filter between the mounting plate and the cover plate.