Abstract: The invention provides an MEMS device. The MEMS device includes: a substrate, a proof mass, a spring, a spring anchor, a first electrode anchor, and a second electrode anchor, a first fixed electrode and a second fixed electrode. The proof mass is connected to the substrate through the spring and the spring anchor. The proof mass includes a hollow structure inside, and the spring anchor, the first electrode anchor, and the second electrode anchor are located in the hollow structure. The proof mass and the first fixed electrode form a first capacitor, and the proof mass and the second fixed electrode form a second capacitor. There is neither any portion of the proof mass nor any portion of any fixing electrode located between the first electrode anchor, second electrode anchor, and the spring anchor.

Abstract: The invention provides a micro-electro-mechanical system (MEMS) module, which includes a MEMS die stacked on an electronic circuit die. The electronic circuit die includes a substrate, the substrate including at least one through-silicon via (TSV) penetrating through the substrate; and at least one electronic circuit. The electronic circuit includes a circuit region, and a signal transmission layer directly connecting the TSV. At least one wire is connected between a middle part of the MEMS die and the TSV. There is no signal communication at the interfacing location where the MEMS die is stacked on and bonded with the electronic circuit die.

Abstract: A MEMS chip includes a cap layer and a composite device layer. The cap layer includes a substrate. The substrate has a first region and a second region, wherein the first region includes plural first trenches and the second region has plural second trenches. The first region has a first etch pattern density and the second region has a second etch pattern density, wherein the first etch pattern density is higher than the second etch pattern density to form chambers of different pressures.

Abstract: A layout method for a printed circuit board (PCB) is provided. The method obtains a memory type of a dynamic random access memory (DRAM) to be mounted on the PCB, obtains a module group from a database according to the memory type of the DRAM, wherein the module group comprises a plurality of routing modules, obtains a plurality of PCB parameters, selects a specific routing module from the module group according to the PCB parameters, and implements the specific routing module into a layout design for PCB fabrication. The specific routing module comprises layout information regarding a main chip, a memory chip and a routing configuration between the main chip and the memory chip.

Abstract: A printed circuit board (PCB) is provided. The PCB has a specific routing module, having a first chip, a memory chip, and a plurality of traces designed for interconnection between the first chip and the memory chip according to a routing configuration between the first chip and the memory chip. The memory chip is a dynamic random access memory (DRAM) with a memory type, the specific routing module is obtained from a module group comprising a plurality of routing modules according to a plurality of PCB parameters, and module group is obtained from a database according to the memory type of the DRAM.

Abstract: The present invention discloses a MEMS chip which includes a device wafer and a cap wafer. The device wafer includes a first substrate and a MEMS device. The MEMS device includes a movable structure. The cap wafer includes a second substrate, an elastic structure and a stopper. The stopper is connected to the second substrate by the elastic structure. The stopper constrains a movement of the movable structure, and when the movable structure contacts the stopper, the elastic structure provides a resilience force to the stopper.

Abstract: A layout method for a printed circuit board (PCB) is provided. A memory type of a dynamic random access memory (DRAM) to be mounted on the PCB is obtained. A module group is obtained from a database according to the memory type of the DRAM, wherein the module group includes a plurality of routing modules. A plurality of PCB parameters are obtained. A specific routing module is selected from the module group according to the PCB parameters. The specific routing module is implemented into a layout design of the PCB. The specific routing module includes layout information regarding a main chip, a memory chip and a routing configuration between the main chip and the memory chip.

Abstract: The invention provides a micro-electro-mechanical system (MEMS) module, which includes a MEMS die stacked on an electronic circuit die. The electronic circuit die includes a substrate, the substrate including at least one through-silicon via (TSV) penetrating through the substrate; and at least one electronic circuit. The electronic circuit includes a circuit region, and a signal transmission layer directly connecting the TSV. At least one wire is connected between a middle part of the MEMS die and the TSV. There is no signal communication at the interfacing location where the MEMS die is stacked on and bonded with the electronic circuit die.

Abstract: A MEMS chip includes a cap layer and a composite device layer. The cap layer includes a substrate. The substrate has a first region and a second region, wherein the first region includes plural first trenches and the second region has plural second trenches. The first region has a first etch pattern density and the second region has a second etch pattern density, wherein the first etch pattern density is higher than the second etch pattern density to form chambers of different pressures.

Abstract: The present invention comprises compounds of Formula (I). wherein: R1, R2, R3, R4, R5, Z1 and Z2 are as defined in the specification. The invention also comprises a method of preventing, treating or ameliorating a syndrome, disorder or disease, wherein said syndrome, disorder or disease is type II diabetes, obesity and asthma. The invention also comprises a method of inhibiting CCR2 activity in a mammal by administration of a therapeutically effective amount of at least one compound of Formula (I).

Abstract: Embodiments of a printed circuit board (PCB) and an electronic apparatus are provided. The PCB includes a PCB substrate and a plurality of the pads. The PCB substrate is disposed with the plurality of the pads. The plurality of the pads include a first type of the pads and a second type of the pads. The first type of the pads adopts the solder mask defined structure, and the second type of the pads adopts the non-solder mask defined structure.

Abstract: A wideband frequency synthesizer and a frequency synthesizing method thereof are provided. The wideband frequency synthesizer includes a phase-locked loop unit, a first voltage-controlled oscillating unit and a first frequency mixer unit. The phase-locked loop unit receives a reference signal and a feedback signal and generates a first oscillating signal according to the reference signal and the feedback signal. The first voltage-controlled oscillating unit generates a second oscillating signal. The first frequency mixer is coupled to the phase-locked loop unit and the first voltage-controlled oscillating unit, receives the first oscillating signal and the second oscillating signal for mixing frequencies of the first oscillating signal and the second oscillating signal to generate an output signal and taking the output signal as the feedback signal for outputting to the phase-locked loop unit.

Abstract: A wideband frequency synthesizer and a frequency synthesizing method thereof are provided. The wideband frequency synthesizer includes a phase-locked loop unit, a first voltage-controlled oscillating unit and a first frequency mixer unit. The phase-locked loop unit receives a reference signal and a feedback signal and generates a first oscillating signal according to the reference signal and the feedback signal. The first voltage-controlled oscillating unit generates a second oscillating signal. The first frequency mixer is coupled to the phase-locked loop unit and the first voltage-controlled oscillating unit, receives the first oscillating signal and the second oscillating signal for mixing frequencies of the first oscillating signal and the second oscillating signal to generate an output signal and taking the output signal as the feedback signal for outputting to the phase-locked loop unit.

Abstract: The present invention comprises compounds of Formula (I). wherein: R0, R1, R2, R3, R4, R5, and A are as defined in the specification. The invention also comprises a method of preventing, treating or ameliorating a syndrome, disorder or disease, wherein said syndrome, disorder or disease is type II diabetes, obesity and asthma. The invention also comprises a method of inhibiting CCR2 activity in a mammal by administration of a therapeutically effective amount of at least one compound of Formula (I).

Abstract: A non-contact vital sign sensing system including a vital sign sensing module and at least one body movement interference cancellation module is provided. The vital sign sensing module and the at least one body movement interference cancellation module are under a self-injection locking (SIL) mode. The vital sign sensing module senses an isotropic vital sign of a body. A mutual injection locking (MIL) mode is achieved between the vital sign sensing module and the at least one body movement interference cancellation module to sense the anisotropic body movement signal and to cancel the body movement interference.

Abstract: A frequency synthesizer and a frequency synthesis method thereof are provided. The frequency synthesizer includes a phase-locked loop unit, a voltage-controlled oscillating unit, and a frequency mixing unit. The phase-locked loop unit receives a reference signal and a feedback injection signal and generates a first oscillating signal according to the reference signal and the feedback injection signal. The voltage-controlled oscillating unit receives the feedback injection signal and generates a second oscillating signal according to the feedback injection signal. The frequency mixing unit is coupled to the phase-locked loop unit and the voltage-controlled oscillating unit, receives the first oscillating signal and the second oscillating signal, and mixes the first oscillating signal and the second oscillating signal to generate the feedback injection signal and an output signal.

Abstract: A motion/vibration detection system and method therefore are provided. The system includes a transmitter and a receiver. The transmitter includes a transmit/receive antenna unit and a first oscillator. The receiver includes a receiving unit and a demodulation unit. The transmit/receive antenna unit receives an output signal from the first oscillator and transmits a detection signal. The detection signal is reflected from at least one object under detection into a reflected detection signal, which is received by the transmit/receive antenna unit. The transmit/receive antenna unit injects the reflected detection signal into the first oscillator and accordingly the first oscillator is under a self-injection locking mode. The receiving unit receives the detection signal. The demodulation unit demodulates the detection signal received by the receiving unit into a baseband output signal, to extract at least one motion/vibration information of the objection under detection.

Abstract: A motion/vibration sensor includes a transmit/receive antenna unit, an oscillation unit and a frequency-mixing unit. The transmit/receive antenna unit receives an output signal from the oscillation unit and transmits a detection signal toward at least one object. The detection signal is reflected by the object as a reflected detection signal and received by the transmit/receive antenna unit. The oscillation unit receives the reflected detection signal from the transmit/receive antenna unit for self-injection locking; and the frequency-mixing unit receives the reflected detection signal from the transmit/receive antenna unit for frequency demodulation. The frequency-mixing unit mixes and demodulates the reflected detection signal from the transmit/receive antenna unit with the output signal from the oscillation unit into a baseband output signal which represents a motion/vibration information.

Abstract: A layout method for a printed circuit board (PCB) is provided. A memory type of a dynamic random access memory (DRAM) to be mounted on the PCB is obtained. A module group is obtained from a database according to the memory type of the DRAM, wherein the module group includes a plurality of routing modules. A plurality of PCB parameters are obtained. A specific routing module is selected from the module group according to the PCB parameters. The specific routing module is implemented into a layout design of the PCB. The specific routing module includes layout information regarding a main chip, a memory chip and a routing configuration between the main chip and the memory chip.

Abstract: A wireless detection apparatus includes an antenna, a voltage control oscillator, and a processing unit. The antenna receives a first wireless signal and generates an electrical signal according to the first wireless signal. The first wireless signal is generated by reflecting a second wireless signal from an object under test. The voltage control oscillator is coupled to the antenna to generate an oscillating signal under an interference of the electrical signal. The oscillating signal varies with variation of the electrical signal. The processing unit is coupled to the voltage control oscillator to evaluate a parameter of the object under test according to the variation of the oscillating signal.