Patents by Inventor Fu Cheng

Fu Cheng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230327927
    Abstract: A method, system and apparatus are disclosed. According to one or more embodiments, a network node configured to communicate with a wireless device is provided. The network node includes processing circuitry configured to dynamically indicate a mixed numerology to the wireless device for implementation where the mixed numerology corresponds to a first numerology for a data channel and a second numerology for a control channel, the first numerology being different from the second numerology.
    Type: Application
    Filed: June 1, 2023
    Publication date: October 12, 2023
    Inventors: Jung-Fu CHENG, Yuhang LIU, Peter ALRIKSSON, Stephen GRANT, Tai DO
  • Patent number: 11785582
    Abstract: There is disclosed a method of operating a user equipment in a radio access network, the user equipment being configured with a transmission resource pool. The transmission resource pool comprises resources for transmission of response control signaling by the user equipment. The method comprises transmitting response control signaling utilising a resource structure, the resource structure being selected from the transmission resource pool based on a signaling characteristic of characterising signaling, the resource structure further being selected based on selection control information included in a received selection control message. The disclosure also pertains to related devices and methods.
    Type: Grant
    Filed: March 29, 2022
    Date of Patent: October 10, 2023
    Assignee: Telefonaktiebolaget LM Ericsson (Publ)
    Inventors: Robert Baldemair, Daniel Chen Larsson, Jung-Fu Cheng, Havish Koorapaty, Stefan Parkvall
  • Patent number: 11784198
    Abstract: A semiconductor device includes a plurality of isolation structures, wherein each isolation structure of the plurality of isolation structures is spaced from an adjacent isolation structure of the plurality of isolation structures in a first direction. The semiconductor device further includes a gate structure. The gate structure includes a top surface; a first sidewall angled at a non-perpendicular angle with respect to the top surface; and a second sidewall angled with respect to the top surface. The gate structure further includes a first horizontal surface extending between the first sidewall and the second sidewall, wherein the first horizontal surface is parallel to the top surface, and a dimension of the gate structure in a second direction, perpendicular to the first direction, is less than a dimension of each of the plurality of isolation structures in the second direction.
    Type: Grant
    Filed: June 2, 2022
    Date of Patent: October 10, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chia-Yu Wei, Fu-Cheng Chang, Hsin-Chi Chen, Ching-Hung Kao, Chia-Pin Cheng, Kuo-Cheng Lee, Hsun-Ying Huang, Yen-Liang Lin
  • Publication number: 20230314983
    Abstract: Systems and methods relating to accurate Channel State Information (CSI) measurements for a License Assisted Secondary Cell (LA SCell) are disclosed herein. An exemplary user equipment enabled includes a transceiver, at least one processor, and memory containing instructions executable by the at least one processor whereby the user equipment operates to detect whether a downlink control information (DCI) message indicating that a Channel State Information Reference Symbol (CSI-RS) transmission from an LA SCell of the user equipment is present in a subframe. When the user equipment detects that the DCI message indicates that a CSI-RS transmission from the LA SCell is present in the subframe, it processes a CSI-RS measurement. When the user equipment detects that the DCI message does not indicate that a CSI-RS transmission from the LA SCell is present in the subframe, it refrains from processing the CSI-RS measurement.
    Type: Application
    Filed: February 7, 2023
    Publication date: October 5, 2023
    Inventors: Mattias Frenne, Jung-Fu Cheng, Sorour Falahati, Havish Koorapaty, Daniel Larsson
  • Publication number: 20230319824
    Abstract: A mechanism for time domain resource allocation for downlink shared channel, in which the time domain resource is allocated according to CORESET configurations when SS/PBCH block and RMSI CORESET are multiplexed with Type 1, Type 2 or Type 3 pattern.
    Type: Application
    Filed: June 7, 2023
    Publication date: October 5, 2023
    Applicant: Telefonaktiebolaget LM Ericsson (publ)
    Inventors: Zhipeng LIN, Jingya LI, Jung-Fu CHENG
  • Publication number: 20230320102
    Abstract: A semiconductor memory device includes a stack of alternating insulating layers and first conductive layers disposed over a substrate; a plurality of memory cell strings penetrating the stack over the substrate, each memory cell string comprising a central portion extending through the stack, a semiconductor layer surrounding the central portion, and a ferroelectric layer surrounding the semiconductor layer, and the central portion comprising a channel isolation structure and a second conductive layer and a third conductive layer at two sides of the channel isolation structure; and a plurality of cell isolation structures penetrating the conductive layers and the insulating layers over the substrate and disposed between two memory cell strings, each cell isolation structure comprising a top portion and a bottom portion adjoined to the top portion and different from the top portion.
    Type: Application
    Filed: June 7, 2023
    Publication date: October 5, 2023
    Inventors: YU-CHIEN CHIU, MENG-HAN LIN, CHUN-FU CHENG, HAN-JONG CHIA, CHUNG-WEI WU, ZHIQIANG WU
  • Publication number: 20230317829
    Abstract: A method for forming a semiconductor device structure is provided. The method includes providing a substrate, a fin, and a semiconductor layer. The fin is over the substrate, the semiconductor layer is over the fin, the substrate and the fin are made of different materials, and the fin and the semiconductor layer are made of different materials. The method includes forming a dielectric layer over the semiconductor layer and the fin. The method includes forming a semiconductor structure over a sidewall of the dielectric layer. The method includes removing a first top portion of the dielectric layer over a top surface of the semiconductor layer. The method includes forming a gate over the semiconductor layer, the dielectric layer, and the semiconductor structure.
    Type: Application
    Filed: March 31, 2022
    Publication date: October 5, 2023
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Zhiqiang WU, Kuo-An LIU, Kai Tak LAM, Meng-Yu LIN, Chun-Fu CHENG, Chieh-Chun CHIANG, Chun-Hsiang FAN
  • Patent number: 11777040
    Abstract: A semiconductor device includes a substrate, a photo sensing region, and a plurality of semiconductor plugs. The photo sensing region is in the substrate. The photo sensing region forms a p-n junction with the substrate. The semiconductor plugs extend from above the photo sensing region into the photo sensing region.
    Type: Grant
    Filed: November 28, 2022
    Date of Patent: October 3, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Hsin-Hsiang Tseng, Chih-Fei Lee, Chia-Pin Cheng, Fu-Cheng Chang
  • Publication number: 20230309107
    Abstract: There is disclosed a method of operating a receiving radio node in a wireless communication network. The method includes communicating utilising data signaling based on a received control information message, the control information message scheduling multiple occurrences of data signaling, wherein communicating is based on extracting a code block group (CBG) setup for communicating based on the received control information message and/or a CBG configuration. The disclosure also pertains to related devices and methods.
    Type: Application
    Filed: June 5, 2023
    Publication date: September 28, 2023
    Inventors: Reem KARAKI, Jung-Fu CHENG, Yuhang LIU, Stephen GRANT
  • Publication number: 20230307456
    Abstract: An integrated circuit includes a complimentary field effect transistor (CFET). The CFET includes a first transistor having a first semiconductor nanostructure corresponding to a channel region of the first semiconductor nanostructure and a first gate metal surrounding the second semiconductor nanostructure. The CFET includes a transistor including a second semiconductor nanostructure above the first semiconductor nanostructure and a second gate metal surrounding the second semiconductor nanostructure. The CFET includes an isolation structure between the first and second semiconductor nanostructures.
    Type: Application
    Filed: August 15, 2022
    Publication date: September 28, 2023
    Inventors: Meng-Yu LIN, Yi-Han WANG, Chun-Fu CHENG, Cheng-Yin WANG, Yi-Bo LIAO, Szuya LIAO
  • Patent number: 11770852
    Abstract: According to some embodiments, a method for use in a user equipment (UE) of transmitting uplink data in unlicensed spectrum comprises receiving, from a network node, an uplink grant comprising an indication of one or more subframes to use for transmitting uplink data. Each subframe comprises a plurality of symbols. The method further comprises obtaining an indication of a listen-before-talk (LBT) type. The LBT type indicates a type of LBT procedure that the UE should perform before transmitting uplink data. The method further comprises determining, using the obtained LBT type, at least one of a starting symbol and a stopping symbol for transmitting uplink data, and transmitting uplink data according to at least one of the determined starting symbol and the determined stopping symbol.
    Type: Grant
    Filed: September 20, 2022
    Date of Patent: September 26, 2023
    Assignee: Withrow & Terranova, PLLC
    Inventors: Havish Koorapaty, Jung-Fu Cheng, Sorour Falahati, Amitav Mukherjee
  • Patent number: 11769954
    Abstract: An antenna array system and a method for making the antenna system. The system includes at least two antenna elements serving as transmitter elements, and at least two antenna elements serving as receiver elements. Each of the transmitter antenna and receiver antenna elements include a pair of curved arms, wherein a first arm in the pair of curved arms is configured to be connected from a signal trace of the antenna system. The second arm in the pair of curved arms is configured to be connected to a ground plane.
    Type: Grant
    Filed: August 24, 2020
    Date of Patent: September 26, 2023
    Assignee: TENSORCOM, INC.
    Inventor: Guang-Fu Cheng
  • Patent number: 11770830
    Abstract: A method, wireless device and network node are configured to generate or process a control channel, having two multiplexed sequences based on a base sequence. In some embodiments, a method includes sampling even samples of the base sequence and modulating the sampled even samples to create a first control channel sequence. The method includes performing a second sampling of odd samples of the base sequence to create a second control channel sequence. The method also includes frequency division multiplexing the first and second control channel sequences to produce the control channel.
    Type: Grant
    Filed: June 5, 2018
    Date of Patent: September 26, 2023
    Assignee: Telefonaktiebolaget LM Ericsson (Publ)
    Inventors: Fredrik Lindqvist, Robert Baldemair, Jung-Fu Cheng, Sorour Falahati, Havish Koorapaty
  • Publication number: 20230300765
    Abstract: The scheduling flexibility of CSI reference signals enables time and frequency synchronization using multiple non-zero CSI-RSs transmitted in the same subframe, or using CSI-RSs transmitted in the same subframe with other synchronization signals. Also, multiple synchronization signals may be scheduled in the same subframe to enable fine time and frequency synchronization without cell-specific reference signals.
    Type: Application
    Filed: April 6, 2023
    Publication date: September 21, 2023
    Inventors: Havish Koorapaty, Mattias Frenne, Daniel Larsson, Jiann-Ching Guey, Jung-Fu Cheng
  • Publication number: 20230299911
    Abstract: There is disclosed a method of operating a transmitting radio node in a wireless communication network, the method including transmitting reference signaling based on a reference pilot sequence, the reference pilot sequence being one of a set of reference pilot sequences, at least one reference pilot sequence of the set being a subsequence of another reference pilot sequence of the set. The disclosure also pertains to related devices and methods.
    Type: Application
    Filed: April 28, 2023
    Publication date: September 21, 2023
    Inventors: Dennis HUI, Jung-Fu CHENG, Mehrnaz AFSHANG
  • Publication number: 20230299104
    Abstract: A method of making an image sensor includes depositing a shield layer over a substrate, wherein the substrate comprises a first photodiode (PD) and a second PD. The method further includes etching the shield layer to define a first recess aligned with the first PD and a second recess aligned with the second PD. The method further includes depositing a flicker reduction layer in the first recess and in the second recess. The method further includes etching the flicker reduction layer to remove the flicker reduction layer from the first recess.
    Type: Application
    Filed: May 17, 2023
    Publication date: September 21, 2023
    Inventors: Po-Han CHEN, Chen-Chun CHEN, Fu-Cheng CHANG, Kuo-Cheng LEE
  • Patent number: 11764062
    Abstract: A method of forming a semiconductor structure is disclosed. A multi-layer structure is formed over a substrate. A photoresist stack with a stepped sidewall is formed on the multi-layer structure. A pattern of the photoresist stack is transferred to the multi-layer structure.
    Type: Grant
    Filed: October 30, 2018
    Date of Patent: September 19, 2023
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ping-Hao Lin, Fu-Cheng Chang
  • Patent number: 11764474
    Abstract: A portable electronic device and a plate antenna module thereof are provided. The plate antenna module includes an antenna carrying structure, an inner surrounding radiation structure, a first inner feeding structure, an outer surrounding radiation structure, and a first outer feeding structure. The first inner feeding structure is surrounded by the inner surrounding radiation structure. The inner surrounding radiation structure is surrounded by the outer surrounding radiation structure. The inner surrounding radiation structure and the outer surrounding radiation structure are respectively disposed on two different planes of the antenna carrying structure.
    Type: Grant
    Filed: February 15, 2022
    Date of Patent: September 19, 2023
    Assignee: Taiwan Inpaq electronic Co., Ltd.
    Inventors: Yang-Hsin Fan, Ta-Fu Cheng, Cheng-Yi Wang, Zhi-Xiang Wang
  • Patent number: 11756959
    Abstract: The present disclosure provides an integrated circuit that includes a circuit formed on a semiconductor substrate; and a de-cap device formed on the semiconductor substrate and integrated with the circuit. The de-cap device includes a filed-effect transistor (FET) that further includes a source and a drain connected through contact features landing on the source and drain, respectively; a gate stack overlying a channel and interposed between the source and the drain; and a doped feature disposed underlying the channel and connecting to the source and the drain, wherein the doped feature is doped with a dopant of a same type of the source and the drain.
    Type: Grant
    Filed: June 14, 2021
    Date of Patent: September 12, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Ching-Wei Tsai, Yu-Xuan Huang, Kuan-Lun Cheng, Wei Ju Lee, Chun-Fu Cheng, Chung-Wei Wu
  • Publication number: 20230278231
    Abstract: A robot gripper for moving wafer carriers and packing materials and a method of operating the same are provided. The gripper mechanism has two clamp assemblies, each with a support pin at the bottom. The clamps are configured to move towards or away from each other, and the support pins are configured to move relative to the clamp assemblies. The first clamp assembly has a main clamp and a secondary clamp with a protrusion, while the second clamp assembly has a similar configuration.
    Type: Application
    Filed: May 12, 2023
    Publication date: September 7, 2023
    Inventors: CHIEN-FA LEE, FENG-KUANG WU, FU-CHENG HUNG, CHI-WEI CHEN, CHIH-HUA CHEN