Abstract: A method includes forming a first conductive feature over a semiconductor substrate, forming an ILD layer over the first conductive feature, patterning the ILD layer to form a trench, and forming a conductive layer over the patterned ILD layer to fill the trench. The method further includes polishing the conductive layer to form a via contact configured to interconnect the first conductive feature with a second conductive feature, where polishing the conductive layer exposes a top surface of the ILD layer, polishing the exposed top surface of the ILD layer, such that a top portion of the via contact protrudes from the exposed top surface of the ILD layer, and forming the second conductive feature over the via contact, such that the top portion of the via contact extends into the second conductive feature.

Abstract: A carrier structure is provided, in which at least one positioning area is defined on a chip-placement area of a package substrate, and at least one alignment portion is disposed on the positioning area. Therefore, the precision of manufacturing the alignment portion is improved by disposing the positioning area on the chip-placement area, such that the carrier structure can provide a better alignment mechanism for the chip placement operation.

Abstract: A locking mechanism is provided. The locking mechanism includes a base, a connecting rod, a fastener, and a linking member. The connecting rod and the fastener penetrate the base and are rotatable relative to the base. The connecting rod and the fastener are disposed parallel to each other. The linking member is connected to the connecting rod and the fastener, and is configured to link up the connecting rod and the fastener. Accordingly, the locking mechanism may be suitable for an expansion device with a specific size, and therefore the performance and the design flexibility of the electronic apparatus may be enhanced.

Abstract: A server apparatus includes a fixing mechanism and a holding casing having a fixing member. The fixing mechanism includes a containing casing having a guiding slot and an engaging hole, an actuator having a driving member and pivoted to the containing casing to be movable between a first position and a second position, and a driven structure. The driven structure has a driven member and a first slot and is slidable on the holding casing. When the engaging hole is engaged with the fixing member and the actuator moves to the first position, the driving member slides along the first slot to drive the driven structure to a mounting position, so as to slide the driven member along the guiding slot.

Abstract: A case module that is capable of installing a first electronic module and a second electronic module, includes a cage and a restraining component. The first electronic module can move relative to the cage to a first installation position along a first direction. The second electronic module can move relative to the cage to a second installation position along a second direction perpendicular to the first direction. When the first electronic module moves relative to the cage toward the first installation position along the first direction, the restraining component is driven to move relative to the cage toward a restraining position along the first direction. The second electronic module can be stopped by the restraining component when the restraining component is located at the restraining position.

Abstract: A case module that is capable of installing a first electronic module and a second electronic module, includes a cage and a restraining component. The first electronic module can move relative to the cage to a first installation position along a first direction. The second electronic module can move relative to the cage to a second installation position along a second direction perpendicular to the first direction. When the first electronic module moves relative to the cage toward the first installation position along the first direction, the restraining component is driven to move relative to the cage toward a restraining position along the first direction. The second electronic module can be stopped by the restraining component when the restraining component is located at the restraining position.

Abstract: A server apparatus includes a fixing mechanism and a holding casing having a fixing member. The fixing mechanism includes a containing casing having a guiding slot and an engaging hole, an actuator having a driving member and pivoted to the containing casing to be movable between a first position and a second position, and a driven structure. The driven structure has a driven member and a first slot and is slidable on the holding casing. When the engaging hole is engaged with the fixing member and the actuator moves to the first position, the driving member slides along the first slot to drive the driven structure to a mounting position, so as to slide the driven member along the guiding slot.

Abstract: An apparatus for throttling uplink data based on a temperature state is provided. The apparatus includes a temperature sensor, a processor and a memory. The temperature sensor senses an internal temperature of the apparatus. The memory is operatively coupled to the processor. The processor is configured to execute a program code stored in the memory to: compare the internal temperature to a corresponding temperature range according to a predetermined table of temperature ranges; and control a packet buffer to adjust a current data rate to a corresponding target data rate according to the comparison result.

Abstract: A method for integrated circuit design includes providing a layout of an integrated circuit; determining key parameters of the integrated circuit; determining target values of the key parameters; and performing a first shrinkage of the layout using a first shrink percentage to generate a shrunk layout. The shrunk layout is evaluated by generating values of the key parameters from the shrunk layout. A portion of the values of the key parameters failing to meet respective ones of the target values is found. Guidelines for tuning manufacturing processes of the shrunk layout are provided, so that the portion of the values of the key parameters can meet the respective ones of the target values.

Abstract: A fuse circuit is disclosed, which comprises at least one electrical fuse element having a resistance that changes after being stressed in an electromigration mode, a switching device serially coupled with the electrical fuse element in a predetermined path between a fuse programming power supply (VDDQ) and a low voltage power supply (GND) for selectively allowing a programming current passing through the electrical fuse element during a programming operation, and at least one peripheral circuit coupled to the VDDQ, wherein the peripheral circuit is active and draws current from the VDDQ during a fuse programming operation.

Abstract: A fuse circuit is disclosed, which comprises at least one electrical fuse element having a resistance that changes after being stressed in an electromigration mode, a switching device serially coupled with the electrical fuse element in a predetermined path between a fuse programming power supply (VDDQ) and a low voltage power supply (GND) for selectively allowing a programming current passing through the electrical fuse element during a programming operation, and at least one peripheral circuit coupled to the VDDQ, wherein the peripheral circuit is active and draws current from the VDDQ during a fuse programming operation.

Abstract: A fuse circuit is disclosed, which comprises at least one electrical fuse element having a resistance that changes after being stressed in an electromigration mode, a switching device serially coupled with the electrical fuse element in a predetermined path between a fuse programming power supply (VDDQ) and a low voltage power supply (GND) for selectively allowing a programming current passing through the electrical fuse element during a programming operation, and at least one peripheral circuit coupled to the VDDQ, wherein the peripheral circuit is active and draws current from the VDDQ during a fuse programming operation.

Abstract: A method for integrated circuit design includes providing a layout of an integrated circuit; determining key parameters of the integrated circuit; determining target values of the key parameters; and performing a first shrinkage of the layout using a first shrink percentage to generate a shrunk layout. The shrunk layout is evaluated by generating values of the key parameters from the shrunk layout. A portion of the values of the key parameters failing to meet respective ones of the target values is found. Guidelines for tuning manufacturing processes of the shrunk layout are provided, so that the portion of the values of the key parameters can meet the respective ones of the target values.

Abstract: A method for error detection and correction (EDC) includes: generating a complete EDC code in response to a data packet; distributing the complete EDC code among the data packet to create a plurality of bytes, each including a data portion from the data packet and an EDC code portion from the complete EDC code; storing the bytes in a memory module; retrieving the bytes from the memory module; forwarding the data portions of the bytes retrieved from the memory module to a requesting device; providing the data portions of the bytes retrieved from the memory module to an EDC functional block; providing the EDC code portions of the bytes retrieved from the memory module to the EDC functional block; and performing error checking and correction in the EDC functional block upon receiving the complete EDC code from the provided EDC code portions.

Abstract: A circuit and method for providing a two phase word line pulse for use during access cycles in an SRAM memory with improved operating margins. A first and a second timing circuit are provided and a word line voltage suppression circuit is provided to reduce the voltage on the active word lines in a first phase of a word line pulse, and to allow the word lines to rise to a second, unsuppressed voltage in a second phase of the word line pulse, responsive to the first and second timing circuits. The first and second timing circuits observe the bit lines voltage discharge and provide control signals active when the bit lines are discharged past certain thresholds, these signals control the voltage suppression circuit. Operating margins for the SRAM are therefore improved. Methods for operating an SRAM using a two phase word line pulse are provided.

Abstract: A fuse circuit is disclosed, which comprises at least one electrical fuse element having a resistance that changes after being stressed in an electromigration mode, a switching device serially coupled with the electrical fuse element in a predetermined path between a fuse programming power supply (VDDQ) and a low voltage power supply (GND) for selectively allowing a programming current passing through the electrical fuse element during a programming operation, and at least one peripheral circuit coupled to the VDDQ, wherein the peripheral circuit is active and draws current from the VDDQ during a fuse programming operation.

Abstract: A method for error detection and correction (EDC) includes: generating a complete EDC code in response to a data packet; distributing the complete EDC code among the data packet to create a plurality of bytes, each including a data portion from the data packet and an EDC code portion from the complete EDC code; storing the bytes in a memory module; retrieving the bytes from the memory module; forwarding the data portions of the bytes retrieved from the memory module to a requesting device; providing the data portions of the bytes retrieved from the memory module to an EDC functional block; providing the EDC code portions of the bytes retrieved from the memory module to the EDC functional block; and performing error checking and correction in the EDC functional block upon receiving the complete EDC code from the provided EDC code portions.

Abstract: A circuit and method for providing a two phase word line pulse for use during access cycles in an SRAM memory with improved operating margins. A first and a second timing circuit are provided and a word line voltage suppression circuit is provided to reduce the voltage on the active word lines in a first phase of a word line pulse, and to allow the word lines to rise to a second, unsuppressed voltage in a second phase of the word line pulse, responsive to the first and second timing circuits. The first and second timing circuits observe the bit lines voltage discharge and provide control signals active when the bit lines are discharged past certain thresholds, these signals control the voltage suppression circuit. Operating margins for the SRAM are therefore improved. Methods for operating an SRAM using a two phase word line pulse are provided.

Abstract: An embedded memory system includes an array of dynamic random access memory (DRAM) cells, which are isolated with deep trench isolation, and logic transistors, which are isolated with shallow trench isolation. Each DRAM cell includes an access transistor and a capacitor structure. The capacitor structure is fabricated by forming a metal-dielectric-semiconductor (MOS) capacitor in a deep trench isolation region. A cavity is formed in the deep trench isolation, thereby exposing a sidewall region of the substrate. The sidewall region is doped, thereby forming one electrode of the cell capacitor. A gate dielectric layer is formed over the exposed sidewall, and a polysilicon layer is deposited over the resulting structure, thereby filling the cavity. The polysilicon layer is patterned to form the gate electrode of the access transistor and a capacitor electrode, which extends over the sidewall region and upper surface of the substrate.

Abstract: A memory system with transparent error correction circuitry provides full stuck-at fault coverage for both test data patterns and the corresponding error correction code (ECC) values. The memory system includes a semiconductor memory having a memory array, a memory interface and an error detection/correction unit. The memory array is configured to store test data patterns and corresponding error correction code (ECC) values. The memory interface is configured such that the ECC values are not directly accessible. The error detection/correction unit is configured to correct single-bit errors in the test data patterns and corresponding ECC values. A set of test data patterns associated with the semiconductor memory is selected such that any multiple-bit error in a test data pattern and the corresponding ECC value causes the error detection/correction unit to provide an output data pattern having an error, thereby rendering multiple-bit faults 100% detectable.