Abstract: A film thickness measurement device includes a spectroscopic ellipsometer, and the spectroscopic ellipsometer includes a projection module and a light receiving module. The projection module is configured to project a multi-wavelength polarized light onto a thin film. The projection module includes a light source and a polarization state generator. The light receiving module includes a polarization analyzer and an optical detector. The polarization analyzer is configured to screen out a multi-wavelength polarized reflection light according to reflection of the multi-wavelength polarized light by the thin film. The optical detector is configured to receive the multi-wavelength polarized reflection light. The optical detector includes at least one optical splitting unit, at least two optical filtering units and at least two optical detection units.

Abstract: An atomic layer deposition apparatus including a chamber, a platform, a shower head, a bias power supply, a first injection device, and a second injection device is provided. The platform and the shower head are disposed in the chamber, and the platform is configured to carry a substrate having a high aspect ratio structure. The bias power supply is coupled to the platform. The first injection device and the second injection device are connected to the chamber; the first injection device injects a first precursor or a first inert gas into the chamber along a first direction through the shower head, and the second injection device injects a second precursor or a second inert gas into the chamber along a second direction perpendicular to the first direction. When the first precursor or the second precursor is injected into the chamber, the bias power supply is turned on. When the first inert gas or the second inert gas is injected into the chamber, the bias power supply is turned off.

Abstract: A deposition method including following steps is provided. A first precursor is injected into a chamber along a first direction, and a bias power supply is turned on to attract the first precursor to a substrate. A second precursor is injected into the chamber along a second direction perpendicular to the first direction, and the bias power supply is turned on to attract the second precursor to the substrate. A first inert gas is injected into the chamber along the first direction, and the bias power supply is turned off to purge an unnecessary part of the first precursor or an unnecessary part of the second precursor or a by-product. A second inert gas is injected the chamber along the second direction, and the bias power supply is turned off to purge the unnecessary part of the first precursor or the unnecessary part of the second precursor or the by-products.

Abstract: A particles capturing system includes a venturi filter device, a cyclone filter device, a plurality of first nozzles and air to flow through the system. The venturi filter device has an air intake portion, a neck portion and an air outlet portion. The cyclone filter device, disposed in the air outlet portion, has an entrance and an exit. The plurality of first nozzles, disposed inside the venturi filter device, have a height greater than that of the the neck portion. When the air flows, the air enters the venturi filter device via an air inlet of the air intake portion, then orderly passes through the neck portion and the plurality of first nozzles, then enters the cyclone filter device via the entrance, and finally leaves the cyclone filter device via the exit, such that particles in the flowing air can be captured.

Abstract: A deposition apparatus including a chamber, a platform, a shower head, a bias power supply, a first injection device, and a second injection device is provided. The platform and the shower head are disposed in the chamber, and the platform is configured to carry a substrate having a high aspect ratio structure. The bias power supply is coupled to the platform. The first injection device and the second injection device are connected to the chamber; the first injection device injects a first precursor or a first inert gas into the chamber along a first direction through the shower head, and the second injection device injects a second precursor or a second inert gas into the chamber along a second direction perpendicular to the first direction. When the first precursor or the second precursor is injected into the chamber, the bias power supply is turned on. When the first inert gas or the second inert gas is injected into the chamber, the bias power supply is turned off. A deposition method is also provided.

Abstract: A particles capturing system includes a venturi filter device, a cyclone filter device, a plurality of first nozzles and air to flow through the system. The venturi filter device has an air intake portion, a neck portion and an air outlet portion. The cyclone filter device, disposed in the air outlet portion, has an entrance and an exit. The plurality of first nozzles, disposed inside the venturi filter device, have a height greater than that of the the neck portion. When the air flows, the air enters the venturi filter device via an air inlet of the air intake portion, then orderly passes through the neck portion and the plurality of first nozzles, then enters the cyclone filter device via the entrance, and finally leaves the cyclone filter device via the exit, such that particles in the flowing air can be captured.

Abstract: A solidifying device is for solidifying a substrate which includes a middle and two side portions. The thermostability of the middle portion is greater than that of the side portions. The solidifying device includes a housing, a heating member, a temperature control air-floating member and a conveyor. The housing defines a working space. The heating member is in the working space. The substrate has a heat receiving surface facing the heating member. The temperature control air-floating member is in the working space and below the heating member. The conveyor is for transporting the substrate into the working space and between the temperature control air-floating member and the heating member. The heating member is for providing heat to the substrate. The temperature control air-floating member is for supplying air towards the substrate to allow the substrate to float in the working space and form a high-temperature and two low-temperature areas.

Abstract: A solidifying device is for solidifying a substrate which includes a middle and two side portions. The thermostability of the middle portion is greater than that of the side portions. The solidifying device includes a housing, a heating member, a temperature control air-floating member and a conveyor. The housing defines a working space. The heating member is in the working space. The substrate has a heat receiving surface facing the heating member. The temperature control air-floating member is in the working space and below the heating member. The conveyor is for transporting the substrate into the working space and between the temperature control air-floating member and the heating member. The heating member is for providing heat to the substrate. The temperature control air-floating member is for supplying air towards the substrate to allow the substrate to float in the working space and form a high-temperature and two low-temperature areas.

Abstract: An evaporation method in this disclosure is adapted for performing an evaporation process upon a surface of an evaporation target substrate. In an embodiment, an evaporation source plate is arranged to be heated by a heater so as to evaporate an evaporation material to its gaseous state, and then enable the gaseous evaporation material to travel passing through holes of a shutter device and thus spread toward the surface of the evaporation target substrate for depositing a film. Moreover, the evaporation method uses a transmission device for controlling the opening/closing of the holes, and there is a heating area formed at a position between the shutter device and the evaporation source plate for allowing the evaporation source plate, the plural holes, the heating area, the evaporation material and the heater to be arranged parallel to one another from the top to bottom.

Abstract: An evaporation method in this disclosure is adapted for performing an evaporation process upon a surface of an evaporation target substrate. In an embodiment, an evaporation source plate is arranged to be heated by a heater so as to evaporate an evaporation material to its gaseous state, and then enable the gaseous evaporation material to travel passing through holes of a shutter device and thus spread toward the surface of the evaporation target substrate for depositing a film. Moreover, the evaporation method uses a transmission device for controlling the opening/closing of the holes, and there is a heating area formed at a position between the shutter device and the evaporation source plate for allowing the evaporation source plate, the plural holes, the heating area, the evaporation material and the heater to be arranged parallel to one another from the top to bottom.

Abstract: A rotary positioning apparatus includes a fixing base, a rotation mechanism, two driving modules and a carrier. The rotation mechanism is disposed on the fixing base, the first driving module is disposed on the fixing base and coupled to the rotation mechanism to drive the rotation mechanism rotating around a first rotation axis relatively to the fixing base. The carrier has plural accommodating slots on a circular-arc surface thereof and is pivoted to the rotation mechanism through a second rotation axis passing through the curvature center of the circular-arc surface and perpendicular to the first rotation axis, on which the curvature center is located. The second driving module is disposed on the rotation mechanism and coupled to the carrier to drive the carrier rotating around the second rotation axis relatively to the rotation mechanism. An automatic pick-and-place system and an operation method using the rotary positioning apparatus are also provided.

Abstract: An evaporation system and an evaporation method are disclosed, which are adapted for performing an evaporation process upon a surface of an evaporation target substrate. In an embodiment, the evaporation system comprises an evaporation material and an evaporation source plate, whereas the evaporation source plate is arranged to be heated by a heater so as to evaporate the evaporation material form its solid state into its gaseous state, and then enable the gaseous state evaporation material to travel passing through holes by the use of a shutter device so as to spread toward the surface of the evaporation target substrate for forming a film thereon. In addition, the evaporation system further comprises a transmission device, which is to be used for controlling the opening/closing of the holes of the shutter device.

Abstract: A rotatable locating apparatus including a fixing base, a rotatable rack, a first driving module, a carrier, and a second driving module is provided. The rotatable rack is pivoted on the fixing base through a first rotation axis. The first driving module is coupled to the rotatable rack to drive the rotatable rack rotating with respect to the fixing base along the first rotation axis. The carrier is provided with accommodating slots on an arc surface of the carrier, and the carrier is pivoted on the rotatable rack through a second rotation axis. The second rotation axis passes through a curvature center of the arc surface and is perpendicular to the first rotation axis. The curvature center is located on the first rotation axis. The second driving module is coupled to the carrier to drive the carrier rotating with respect to the rotatable rack along the second rotation axis.

Abstract: A multi-mode thin film deposition apparatus including a reaction chamber, a carrying seat, a showerhead, an inert gas supplying source, a first gas inflow system and a second gas inflow system is provided. The carrying seat is disposed in the reaction chamber. The showerhead has a gas mixing room and gas holes disposed at a side of the gas mixing room. The gas mixing room is connected to the reaction chamber through the plurality of gas holes which faces the carrying seat. The first gas inflow system is connected to the reaction chamber and supplies a first process gas during a first thin film deposition process mode. The inert gas supplying source is connected to the gas mixing room for supplying an inert gas. The second gas inflow system is connected to the gas mixing room to supply a second process gas during a second thin film deposition process mode.

Abstract: A multi-mode thin film deposition apparatus including a reaction chamber, a carrying seat, a showerhead, an inert gas supplying source, a first gas inflow system and a second gas inflow system is provided. The carrying seat is disposed in the reaction chamber. The showerhead has a gas mixing room and gas holes disposed at a side of the gas mixing room. The gas mixing room is connected to the reaction chamber through the plurality of gas holes which faces the carrying seat. The first gas inflow system is connected to the reaction chamber and supplies a first process gas during a first thin film deposition process mode. The inert gas supplying source is connected to the gas mixing room for supplying an inert gas. The second gas inflow system is connected to the gas mixing room to supply a second process gas during a second thin film deposition process mode.

Abstract: A rotary positioning apparatus includes a fixing base, a rotation mechanism, two driving modules and a carrier. The rotation mechanism is disposed on the fixing base, the first driving module is disposed on the fixing base and coupled to the rotation mechanism to drive the rotation mechanism rotating around a first rotation axis relatively to the fixing base. The carrier has plural accommodating slots on a circular-arc surface thereof and is pivoted to the rotation mechanism through a second rotation axis passing through the curvature center of the circular-arc surface and perpendicular to the first rotation axis, on which the curvature center is located. The second driving module is disposed on the rotation mechanism and coupled to the carrier to drive the carrier rotating around the second rotation axis relatively to the rotation mechanism. An automatic pick-and-place system and an operation method using the rotary positioning apparatus are also provided.

Abstract: An evaporation device and an evaporation apparatus applying the same are adapted to performing evaporation process to an object to be coated. The evaporation device includes a tape carrier and a mask. The tape carrier has a heating region. The object to be coated is located over the heating region and is adapted to move along a feeding direction. The tape carrier is adapted to carry a coating material to pass through the heating region. The coating material is heated in the heating region and evaporated. The mask having an opening between the heating region and the object to be coated is disposed in the periphery of the heating region. The evaporated coating material is adapted to pass through the opening and coated on the object.

Abstract: According to an embodiment of the disclosure, an organic light emitting device is provided, which includes: an inflexible tube comprising an external surface and an internal surface; a transparent conductive layer on the internal surface of the inflexible tube; an organic light emitting layer disposed in the inflexible tube and on the transparent conductive layer; and a conductive layer disposed in the inflexible tube and on the organic light emitting layer. According to an embodiment of the disclosure, a method for forming an organic light emitting device is also provided.

Abstract: A showerhead integrating intake and exhaust is provided for showering a gas. The showerhead at least includes a showerhead body that has a gas-active surface and a plurality of intake bores thereon. The showerhead body further includes a central exhaust vent disposed on the gas-active surface. The central exhaust vent may exhaust standing gas and further pre-exhaust byproduct from reaction process.

Abstract: A cathode discharge device is provided. The cathode discharge apparatus includes an anode, a cathode and plural cathode chambers. The cathode is located inside the anode, where the cathode has plural flow channels and at least one flow channel hole, and the plural flow channels are connected to one another through the flow channel hole. The plural cathode chambers are located inside the cathode, wherein each of the cathode chambers has a chamber outlet and a chamber inlet connected with at least one of the flow channels.