Abstract: A method of transferring semiconductor wafers and a semiconductor wafer support device including lift pins having a first end configured to contact a backside surface of the semiconductor wafer and at least one stress reduction feature. The stress reduction feature may be configured to reduce contact stress between the lift pins and the wafer.

Abstract: A method of forming a semiconductor device includes implanting dopants of a first conductivity type into a semiconductor substrate to form a first well, epitaxially growing a channel layer over the semiconductor substrate, forming a fin from the second semiconductor material, and forming a gate structure over a channel region of the fin. The semiconductor substrate includes a first semiconductor material. Implanting the dopants may be performed at a temperature in a range of 150° C. to 500° C. The channel layer may include a second semiconductor material. The channel layer may be doped with dopants of the first conductivity type.

Abstract: A semiconductor device may include a semiconductor fin, a source/drain region extending from the semiconductor fin, and a gate electrode over the semiconductor fin. The semiconductor fin may include a first well and a channel region over the first well. The first well may have a first dopant at a first dopant concentration and the channel region may have the first dopant at a second dopant concentration smaller than the first dopant concentration. The first dopant concentration may be in range from 1017 atoms/cm3 to 1019 atoms/cm3.

Abstract: An embodiment of the invention provides a data authentication device. The data authentication device may include a main memory, a backup memory, a platform control hub (PCH) and an embedded controller (EC). The main memory may be configured to store data. The backup memory may be configured to back up the data stored in the main memory. The PCH is coupled to the main memory and generates a write command to write a first data image to the main memory, wherein the first data image comprises updated data and a digital signature. The EC is coupled to the main memory, the backup memory and the PCH and obtains the first data image from the PCH. When the EC detects a write command, the EC may perform an authentication for the updated data based on the first data image or a second data image corresponding to the first data image.

Abstract: A bus system is provided. A plurality of slave devices are electrically connected to a master device through an enhanced serial peripheral interface (eSPI) bus. Each slave device has an alert handshake pin. The alert handshake pins of the slave devices are electrically connected together via an alert handshake control line. In a first phase of a plurality of phases in each assignment period of an assignment stage after a synchronization stage, the first slave device is configured to control the alert handshake control line to a second voltage level via the alert handshake pin. In the phases of each of the assignment periods except for the first phase, a first slave device of the slave devices is configured to control the alert handshake control line to communicate with the slave devices via the alert handshake pin. The first phase corresponds to a first slave device.

Abstract: A bus system is provided. A plurality of slave devices are electrically connected to a master device through an enhanced serial peripheral interface (eSPI) bus. The slave devices are electrically connected together via a control line. A first slave device is configured to provide a first clock signal to each second slave device via the control line, so that a second clock signal of each second slave device is synchronized with the first clock signal. After the second clock signals are synchronized with the first clock signal, each second slave device is configured to adjust a phase of the second clock signal in a clock phase shift stage, so that each second clock signal has a phase difference with the first clock signal. The phase differences between the second clock signals of the second slave devices and the first clock signal are different.

Abstract: A connector structure includes an insulated housing, at least one terminal assembly and at least one conductive assembly. The terminal assembly is disposed in the insulated housing. The conductive assembly is disposed at one side of the terminal assembly by crossing over the terminal assembly. The conductive assembly includes at least one metal piece and at least one polymer included conductive component. The polymer included conductive component is used to electrically connect the at least one metal pieces. The metal piece includes at least one spring finger contact, and the spring finger contact is electrically connected to the ground terminal in the terminal assembly. In additional, a terminal assembly structures of connector is also provided.

Abstract: A bus system is provided. The bus system includes a master device, an enhanced serial peripheral interface (eSPI) bus, an SPI bus, a memory device electrically connected to the master device via the SPI bus, and a plurality of slave devices electrically connected to the master device via the eSPI bus. Each of the slave devices has a pin, and the pins of the slave devices are electrically connected together via a control line. After obtaining program code from the memory device via the master device, a first slave device is configured to decrypt the program code according to a first security code, and transmit the program code decrypted by the first security code to the slave devices via the control line, so that the program code decrypted by the first security code is decrypted in the slave devices according to a decryption sequence.

Abstract: A bus system is provided. A plurality of slave devices are electrically connected to a master device through an enhanced serial peripheral interface (eSPI) bus. The slave devices are electrically connected together via a control line. A first slave device is configured to provide a first clock signal to each second slave device via the control line, so that a second clock signal of each second slave device is synchronized with the first clock signal. After the second clock signals are synchronized with the first clock signal, each second slave device is configured to adjust a phase of the second clock signal in a clock phase shift stage, so that each second clock signal has a phase difference with the first clock signal. The phase differences between the second clock signals of the second slave devices and the first clock signal are different.

Abstract: A bus system is provided. A memory device is electrically connected to a master device via a serial peripheral interface (SPI) bus. A plurality of slave devices are electrically connected to the master device via an enhanced SPI (eSPI) bus. Each of the slave devices has an alert handshake pin. The alert handshake pins of the slave devices are electrically connected together via an alert-handshake control line. The first slave device is electrically connected to the memory device via the SPI bus. After obtaining a program code from the memory device, the first slave device verifies the program code using a security code and controls the alert-handshake control line to unlock all the slave devices except for the first slave device via the alert handshake pin in response to the program code being verified. The unlocked slave devices communicate with the master device via the eSPI bus.

Abstract: A bus system is provided. The bus system includes a master device, an enhanced serial peripheral interface (eSPI) bus, an SPI bus, a memory device electrically connected to the master device via the SPI bus, and a plurality of slave devices electrically connected to the master device via the eSPI bus. Each of the slave devices has a pin, and the pins of the slave devices are electrically connected together via a control line. After obtaining program code from the memory device via the master device, a first slave device is configured to decrypt the program code according to a first security code, and transmit the program code decrypted by the first security code to the slave devices via the control line, so that the program code decrypted by the first security code is decrypted in the slave devices according to a decryption sequence.

Abstract: A User Equipment (UE) including a wireless transceiver and a controller is provided. The wireless transceiver performs wireless transmission and reception to and from a mobile communication network. The controller determines whether the mobile communication network supports IMS services. The controller establishes a Packet Data Network (PDN) connection or a Protocol Data Unit (PDU) session with the mobile communication network for the IMS services via the wireless transceiver in response to the mobile communication network supporting the IMS services. The controller sends application data on the PDN connection or PDU session via the wireless transceiver.

Abstract: A User Equipment (UE) including a wireless transceiver and a controller is provided. The wireless transceiver performs wireless transmission and reception to and from a mobile communication network. The controller determines whether the mobile communication network supports IMS services. The controller establishes a Packet Data Network (PDN) connection or a Protocol Data Unit (PDU) session with the mobile communication network for the IMS services via the wireless transceiver in response to the mobile communication network supporting the IMS services. The controller sends application data on the PDN connection or PDU session via the wireless transceiver.

Abstract: A bus system is provided. A memory device is electrically connected to a master device via a serial peripheral interface (SPI) bus. A plurality of slave devices are electrically connected to the master device via an enhanced SPI (eSPI) bus. Each of the slave devices has an alert handshake pin. The alert handshake pins of the slave devices are electrically connected together via an alert-handshake control line. The first slave device is electrically connected to the memory device via the SPI bus. After obtaining a program code from the memory device, the first slave device verifies the program code using a security code and controls the alert-handshake control line to unlock all the slave devices except for the first slave device via the alert handshake pin in response to the program code being verified. The unlocked slave devices communicate with the master device via the eSPI bus.

Abstract: A method of forming a semiconductor device includes implanting dopants of a first conductivity type into a semiconductor substrate to form a first well, epitaxially growing a channel layer over the semiconductor substrate, forming a fin from the second semiconductor material, and forming a gate structure over a channel region of the fin. The semiconductor substrate includes a first semiconductor material. Implanting the dopants may be performed at a temperature in a range of 150° C. to 500° C. The channel layer may include a second semiconductor material. The channel layer may be doped with dopants of the first conductivity type.

Abstract: A bus system is provided. A plurality of slave devices are electrically connected to a master device through an enhanced serial peripheral interface (eSPI) bus. Each slave device has an alert handshake pin. The alert handshake pins of the slave devices are electrically connected together via an alert handshake control line. In a first phase of a plurality of phases in each assignment period of an assignment stage after a synchronization stage, the first slave device is configured to control the alert handshake control line to a second voltage level via the alert handshake pin. In the phases of each of the assignment periods except for the first phase, a first slave device of the slave devices is configured to control the alert handshake control line to communicate with the slave devices via the alert handshake pin. The first phase corresponds to a first slave device.

Abstract: A method of forming a semiconductor device includes implanting dopants of a first conductivity type into a semiconductor substrate to form a first well, epitaxially growing a channel layer over the semiconductor substrate, forming a fin from the second semiconductor material, and forming a gate structure over a channel region of the fin. The semiconductor substrate includes a first semiconductor material. Implanting the dopants may be performed at a temperature in a range of 150° C. to 500° C. The channel layer may include a second semiconductor material. The channel layer may be doped with dopants of the first conductivity type.

Abstract: A connector structure includes an insulated housing, at least one terminal assembly and at least one conductive assembly. The terminal assembly is disposed in the insulated housing. The conductive assembly is disposed at one side of the terminal assembly by crossing over the terminal assembly. The conductive assembly includes at least one metal piece and at least one polymer included conductive component. The polymer included conductive component is used to electrically connect the at least one metal pieces. The metal piece includes at least one spring finger contact, and the spring finger contact is electrically connected to the ground terminal in the terminal assembly. In additional, a terminal assembly structures of connector is also provided.

Abstract: An integrated circuit includes a specific pin, an output circuit, a voltage detector, and a controller. The output circuit is coupled to the specific pin. The voltage detector obtains a detection voltage value from the specific pin. In response to an alert request, the controller provides a control signal to the output circuit based on the detection voltage value, so as to selectively control the output circuit to transmit the alert signal to the specific pin. When the control signal instructs the integrated circuit to operate in a blocking mode, the output circuit blocks the alert signal from being transmitted to the specific pin. When the control signal instructs the integrated circuit to operate in a transmission mode, the output circuit transmits the alert signal to the specific pin.