Abstract: An analytical system for performing centrifugal analysis on a working fluid with different components includes a uniform-dividing unit with a reduced cross section to divide the working fluid, a separating unit connected to the uniform-dividing unit, and a detecting unit. The detecting unit includes a detection compartment and a constant-quantity region connected to the separating unit through a separation channel. When rotating the uniform-dividing unit, the working fluid located at the uniform-dividing unit is transmitted to and separated by the separating unit, thereby causing one component of the working fluid to be separated from the other component and transmitted to the detection compartment through the constant-quantity region. With constant-quantity region, the detection compartment can be prevented from flushing by the excess of the separated component, and thus yield of product detection can be increased and different assays detection is carried out with a small sample volume at the same time.

Abstract: A power supply protection method for a power supply device includes: detecting whether an output voltage of the power supply device reaches a voltage protection threshold to generate a detection result; generating a first control signal according to a power good input signal and the detection result; utilizing a fault protection circuit to decide whether to output a fault protection signal according to the first control signal; and using a short circuit protection circuit to receive the power good input signal and determining whether to generate a second control signal according to the power good input signal. When the power good input signal is not enabled during a specific time after the power supply device is started, the short circuit protection circuit is directly used to generate the second control signal into the fault protection circuit for triggering the fault protection circuit to output the fault protection signal.

Abstract: The present invention provides a plastic package structure for a communication component. The plastic package structure comprises a leadframe and a die. Two sides of a die pad of the leadframe have two protruding portions. The die is glued on the protruding portions of the die pad to form a hollow region between the die and the die pad. After the operation of soldering, an insulating seal is used to seal the other two sides of the die and the die pad to form a closed cavity on the circuit face of the die. An encapsulation is then used to sheathe all the above parts. Thereby, a plastic package for a communication component provided by the present invention has low cost and high production speed, and is suitable to mass production.