Abstract: An over-current protection device is disposed on a circuit board and configured to protect a battery. The over-current protection device includes a resistive device, at least one insulation layer and a weld electrode layer. The resistive device exhibits positive temperature coefficient behavior. The insulation layer has a thickness of at least 0.03 mm. The weld electrode layer is configured to weld a strip interconnect member to electrically coupled to the battery, and has a thickness of at least 0.03 mm. The insulation layer and the resistive device are disposed between the weld electrode layer and the circuit board. The circuit board, the resistive device and the weld electrode layer are electrically coupled in series. The association of the resistive device and the weld electrode layer has a thermal mass capable of withstanding welding the strip interconnect member without significant damage to the over-current protection device.

Abstract: An over-current protection device includes a conductive composite having a first crystalline fluorinated polymer, a plurality of particulates, a conductive filler, and a non-conductive filler, wherein the plurality of particulates include a second crystalline fluorinated polymer. The first crystalline fluorinated polymer has a crystalline melting temperature of between 150 and 190 degrees Celsius. The plurality of particulates including the second crystalline fluorinated polymer are disposed in the conductive composite, having a crystalline melting temperature of between 320 and 390 degrees Celsius and having a particulate diameter of from 1 to 50 micrometers. The conductive filler and the non-conductive filler are dispersed in the conductive composite.

Abstract: A heat-conductive dielectric polymer material includes a thermosetting epoxy resin, a nonwoven fiber component, a curing agent and a heat-conductive filler. The thermosetting epoxy resin is selected from the group consisting of end-epoxy-function group epoxy resin, side chain epoxy function group epoxy resin, multi-functional epoxy resin or the mixture thereof. The thermosetting epoxy resin comprises 4%-60% by volume of the heat-conductive dielectric polymer material. The curing agent is configured to cure the thermosetting epoxy resin at a curing temperature. The heat-conductive filler comprises 40%-70% by volume of the heat-conductive dielectric polymer material. The nonwoven fiber component comprises 1%-35% by volume of the heat-conductive dielectric polymer material. The heat-conductive dielectric polymer material has a thermal conductivity greater than 0.5 W/mK.

Abstract: An over-current protection device includes a conductive composite having a first crystalline fluorinated polymer, a plurality of particulates, a conductive filler, and a non-conductive filler, wherein the plurality of particulates include a second crystalline fluorinated polymer. The first crystalline fluorinated polymer has a crystalline melting temperature of between 150 and 190 degrees Celsius. The plurality of particulates including the second crystalline fluorinated polymer are disposed in the conductive composite, having a crystalline melting temperature of between 320 and 390 degrees Celsius and having a particulate diameter of from 1 to 50 micrometers. The conductive filler and the non-conductive filler are dispersed in the conductive composite.

Abstract: An over-current protection device comprises two metal foils and a positive temperature coefficient (PTC) material layer. The PTC material layer is sandwiched between the two metal foils and has a volume resistivity below 0.1 ?-cm. The PTC material layer includes (i) plural crystalline polymers having at least one crystalline polymer of a melting point less than 115° C.; (ii) an electrically conductive nickel filler having a volume resistivity less than 500 ??-cm; and (iii) a non-conductive metal nitride filler. The electrically conductive nickel filler and non-conductive metal nitride filler are dispersed in the crystalline polymer.

Abstract: A surface-mounted over-current protection device with positive temperature coefficient (PTC) behavior is disclosed. The surface-mounted over-current protection device comprises a first metal foil, a second metal foil corresponding to the first metal foil, a PTC material layer stacked between the first metal foil and the second metal foil, a first metal electrode, a first metal conductor electrically connecting the first metal foil to the first metal electrode, a second metal electrode corresponding to the first metal electrode, a second metal conductor electrically connecting the second metal foil to the second metal electrode, and at least one insulated layer to electrically insulate the first metal electrode from the second metal electrode. The surface-mounted over-current protection device, at 25° C., indicates that a hold current thereof divided by the product of a covered area thereof and the number of the conductive composite module is at least 0.16 A/mm2.

Abstract: A heat-conductive dielectric polymer material having an inter-penetrating-network (IPN) structure includes a polymer component, a curing agent, and a heat-conductive filler uniformly dispersed in the polymer component. The polymer component includes a thermoplastic plastic and a thermosetting epoxy resin. The curing agent is used to cure the thermosetting epoxy resin at a curing temperature. The heat conductivity of the heat-conductive dielectric polymer material is larger than 0.5 W/mK. A heat dissipation substrate including the heat-conductive dielectric polymer material in the present invention has a thickness of less than 0.5 mm and bears a voltage of over 1000 volts.

Abstract: An over-current protection device comprises two metal foils and a positive temperature coefficient (PTC) material layer. The PTC material layer is sandwiched between the two metal foils and has a volume resistivity below 0.1 ?-cm. The PTC material layer includes (i) plural crystalline polymers having at least one crystalline polymer of a melting point less than 115° C.; (ii) an electrically conductive nickel filler having a volume resistivity less than 500 ??-cm; and (iii) a non-conductive metal nitride filler. The electrically conductive nickel filler and non-conductive metal nitride filler are dispersed in the crystalline polymer.

Abstract: A surface-mounted over-current protection device with positive temperature coefficient (PTC) behavior is disclosed. The surface-mounted over-current protection device comprises a first metal foil, a second metal foil corresponding to the first metal foil, a PTC material layer stacked between the first metal foil and the second metal foil, a first metal electrode, a first metal conductor electrically connecting the first metal foil to the first metal electrode, a second metal electrode corresponding to the first metal electrode, a second metal conductor electrically connecting the second metal foil to the second metal electrode, and at least one insulated layer to electrically insulate the first metal electrode from the second metal electrode. The surface-mounted over-current protection device, at 25° C., indicates that a hold current thereof divided by the product of a covered area thereof and the number of the conductive composite module is at least 0.16 A/mm2.

Abstract: A surface-mounted over-current protection device with positive temperature coefficient (PTC) behavior is disclosed. The surface-mounted over-current protection device comprises a first metal foil, a second metal foil corresponding to the first metal foil, a PTC material layer stacked between the first metal foil and the second metal foil, a first metal electrode, a first metal conductor electrically connecting the first metal foil to the first metal electrode, a second metal electrode corresponding to the first metal electrode, a second metal conductor electrically connecting the second metal foil to the second metal electrode, and at least one insulated layer to electrically insulate the first metal electrode from the second metal electrode. The surface-mounted over-current protection device, at 25° C., indicates that a hold current thereof divided by the product of a covered area thereof and the number of the conductive composite module is at least 0.16 A/mm2.

Abstract: An over-current protection device comprises two metal foils and a positive temperature coefficient (PTC) material layer. The PTC material layer is sandwiched between the two metal foils and comprises plural crystalline polymers with at least one polymer melting point below 115° C., and a non-oxide electrically conductive ceramic powder. The non-oxide electrically conductive ceramic powder exhibits a certain particle size distribution. The PTC material layer has a resistivity below 0.1 ?-cm. The initial resistance of the device is below 20 m?, and the area of the PTC material layer is below 30 mm2. The over-current protection device exhibits a surface temperature below 100° C. under the trip state of over-current protection.

Abstract: A heat-conductive dielectric polymer material having an inter-penetrating-network (IPN) structure includes a polymer component, a curing agent, and a heat-conductive filler uniformly dispersed in the polymer component. The polymer component includes a thermoplastic plastic and a thermosetting epoxy resin. The curing agent is used to cure the thermosetting epoxy resin at a curing temperature. The heat conductivity of the heat-conductive dielectric polymer material is larger than 0.5 W/mK. A heat dissipation substrate including the heat-conductive dielectric polymer material in the present invention has a thickness of less than 0.5 mm and bears a voltage of over 1000 volts.

Abstract: A heat dissipation substrate for an electronic device comprises a first metal layer, a second metal layer, and a thermally conductive polymer dielectric insulating layer. A surface of the first metal layer carries the electronic device, e.g., a light-emitting diode (LED) device. The thermally conductive polymer dielectric insulating layer is stacked between the first metal layer and the second metal layer in a physical contact manner, and interfaces therebetween include at least one micro-rough surface with a roughness Rz larger than 7.0. The micro-rough surface includes a plurality of nodular projections, and the grain sizes of the nodular projections mainly are in a range of 0.1-100 ?m. The heat dissipation substrate has a thermal conductivity larger than 1.0 W/m·K, and a thickness smaller than 0.5 mm, and comprises (1) a fluorine-containing polymer with a melting point higher than 150° C.

Abstract: The over-current protection device of the present invention uses the unbalanced properties of the thermal expansion coefficients between the outer and inner sides for an upper metallic conductive sheet and a lower metallic conductive sheet to generate a torque to deform outwardly. The torque is used to pull a current-sensing element and present with at least a cracking face, so as to introduce an electrically open effect similar to a fuse. Thus, the present invention can achieve the object for preventing the danger of circuit system by the short circuit during the burning of over-current protection device.

Abstract: The over-current protection device of the present invention uses the unbalanced properties of the thermal expansion coefficients between the outer and inner sides for an upper metallic conductive sheet and a lower metallic conductive sheet to generate a torque to deform outwardly. The torque is used to pull a current-sensing element and present with at least a cracking face, so as to introduce an electrically open effect similar to a fuse. Thus, the present invention can achieve the object for preventing the danger of circuit system by the short circuit during the burning of over-current protection device.

Abstract: The present invention discloses a manufacturing method of an over-current protection device, characterized in that the PTC plaque is conducted by punching under frozen state to form the over-current protection devices so as to reduce the heating and temperature rising in the PTC plaque due to punching and temperature difference between the metal foil and the conductive composite material. Relatively, the deformation and stress of the over-current protection device caused by punching will also be reduced. Therefore, there is no need for additional process to increase the temperature sensitivity and electrical property stability of the over-current protection device.

Abstract: The present invention discloses an over-current protection apparatus for high voltage, which connects the ceramic current-sensing element and polymer current-sensing element in series to form a novel over-current protection apparatus. By the characteristic of the polymer current-sensing element having higher switching off speed, the invention first responds to the over-current by raising its temperature, and then the heat is thermally conducted through the adhesive layer to the ceramic current-sensing element, resulting in a voltage drop produced by the over-current partially or predominantly received by the ceramic current-sensing element. Thus, the over-current protection device of the invention not only can endure high voltage (>600V), but also will not exhibit a negative temperature coefficient phenomenon.

Abstract: An over-current protection device comprises a positive temperature coefficient material layer, an upper electrode foil, a lower electrode foil, a first metal terminal layer, a second metal terminal layer and at least one insulating layer. The upper electrode foil is disposed on the upper surface of the positive temperature coefficient material layer, and the lower electrode foil is disposed on the lower surface of the positive temperature coefficient material layer. The first metal terminal layer electrically connects the upper electrode foil with at least one non-full-circular conductive through hole and at least one full-circular conductive through hole, and the second metal terminal layer electrically connects the lower electrode foil with at least one non-full-circular conductive through hole and at least one full-circular conductive through hole. The insulating layer isolates the upper electrode foil from the second metal terminal layer and the lower electrode foil from the first metal terminal layer.

Abstract: The present invention discloses a surface mountable device comprising a current-sensitive element and two electrodes. The current-sensitive element is composed of a PTC conductive composite, comprising at least one polymer and a conductive filler. The feature of the present invention is that the current-sensitive element is a three-dimensional bent structure so that the shape, length and height of the device can be varied according to the space of the circuit board and the resistance of the surface mountable device. Therefore, the mountable surface of the circuit board can be used more efficiently. Moreover, the area of the current-sensitive element of the present invention is larger than that of the conventional surface mountable device. Consequently, the normal resistance of the surface mountable device of the present invention is smaller than that of the conventional surface mountable device and the voltage endurance of the surface mountable device of the present invention is increased.

Abstract: A surface-mounted over-current protection device with positive temperature coefficient (PTC) behavior is disclosed. The surface-mounted over-current protection device comprises a first metal foil, a second metal foil corresponding to the first metal foil, a PTC material layer stacked between the first metal foil and the second metal foil, a first metal electrode, a first metal conductor electrically connecting the first metal foil to the first metal electrode, a second metal electrode corresponding to the first metal electrode, a second metal conductor electrically connecting the second metal foil to the second metal electrode, and at least one insulated layer to electrically insulate the first metal electrode from the second metal electrode. The surface-mounted over-current protection device, at 25° C., indicates that a hold current thereof divided by the product of a covered area thereof and the number of the conductive composite module is at least 0.16 A/mm2.