Abstract: The present invention discloses an over-current protection apparatus, comprising a current-sensitive element, a first electrode and a second electrode. The over-current protection apparatus of the present invention is a three-dimensional multi-layer structure, and can be formed by heating, pressing, etching, cutting and multi-stage deformation to prevent it from breakage during the bending process. Therefore, the over-current protection apparatus with at least one bend is formed.

Abstract: A PCB comprising a substrate, at least one circuit layer and at least one insulating layer, characterized in that the PCB further comprises at least one embedded functional material such as a PTC, and NTC and ZTC material. If the PTC material is applied in the present invention, a normal resistance of the present invention will be substantially smaller than that of the conventional PTC protection apparatus since the area of the PTC material of the present invention is larger than that of the conventional PTC protection apparatus. Moreover, through an electrically conductive hole, an upper electrode and a lower electrode respectively lying on top and bottom surfaces of the functional material are respectively connected with an apparatus mounted on a surface of the PCB to form a conductive circuit. Thus, at least one over-current protection apparatus which is usually mounted on the surface of the PCB is eliminated, and the surface utilization rate of the PCB is improved.

Abstract: The present invention discloses a PCB comprising a substrate, at least one circuit layer and at least one insulating layer, characterized in that the PCB further comprises at least one embedded functional material such as a PTC, and NTC and ZTC material. If the PTC material is applied in the present invention, a normal resistance of the present invention will be substantially smaller than that of the conventional PTC protection apparatus since the area of the PTC material of the present invention is larger than that of the conventional PTC protection apparatus. Moreover, through an electrically conductive hole, an upper electrode and a lower electrode respectively lying on top and bottom surfaces of the functional material are respectively connected with an apparatus mounted on a surface of the PCB to form a conductive circuit. Thus, at least one over-current protection apparatus which is usually mounted on the surface of the PCB is eliminated, and the surface utilization rate of the PCB is improved.

Abstract: Conductive polymer blend composites exhibiting PTC (positive temperature coefficient of resistance) behavior, comprising at least two types of polymers and preferably at least two types of conductive particulate materials (e.g., carbon blacks), and electrical devices containing such composites. The two polymers are selected to have different melt flow index values, while the two particulate materials are selected to have different average particle sizes and DBP values.

Abstract: The present invention relates to an over-current protecting apparatus, which comprises at least one PTC over-current protecting component and a body. The PTC over-current protecting component has a PTC material, electrodes covering the PTC material, and metal terminations electrically connected to the electrodes. The body has an insulating layer and a first conductive and second conductive regions covering the insulating layer. An end of the first conductive region and second conductive region are electrically connected to the metal terminations, and another ends of the first conductive and second conductive regions are mounted to a PCB. The metal material occupies over 20% area of the sidewall of the first conductive and second conductive regions for increasing solderability. Besides, the top of the PTC over-current protecting component can be adhered to another body to form a symmetrical bodies.

Abstract: The present invention relates to a novel thermal-sensitive resistive apparatus, such as PTC and NTC, which allocates planar electrode films on the top and bottom surfaces of a prior art thermal-sensitive resistive apparatus, such as a PTC apparatus, to laminate with an outer electrode layer. A plurality of interconnection vias are electroplated with conductive material to connect to any plane. It is convenient to surface mount the apparatus of the present invention on a printed circuit board. The present invention can largely increase the dimensional stability of components and overcome the disadvantage that thermal diffusion of the prior are surface mounted resistive apparatus is affected easily by line width and environments.

Abstract: An ink which containsA. a colorant;B. a film-forming material represented by the structureWhereA is a segment, non-polymeric or oligomeric, bearing one or more functional groups,Z is an organic linking radical,B is an oligomeric or polymeric segment, andm and n are 1, 2 or 3, the total not exceeding 4; andC. a non-volatile carrier.