Patents by Inventor Fu Lin

Fu Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Supramolecular structures and method for forming the same
    Publication number: 20070120113
    Abstract: A primary supramolecular structure is described. The primary supramolecular structure has a shape of ring-like disk. The shape of ring-like disk has a diameter of about 10 nanometers to about 60 nanometers. The mentioned primary supramolecular structure is formed by self-assembly of amphiphilic conjugate molecules. Moreover, a secondary supramolecular structure is described. The secondary supramolecular structure has a shape of ring-like disk. The shape of ring-like disk has a diameter of about 100 nanometers to about 300 nanometers. The mentioned secondary supramolecular structure is formed by self-assembly of amphiphilic conjugate molecules hybrid with metal alkoxides or non-metal alkoxides.
    Type: Application
    Filed: November 28, 2005
    Publication date: May 31, 2007
    Inventors: King-Fu Lin, Chi-Chun Hsieh
  • Long seek control device for optical disk drive and method thereof
    Patent number: 7218579
    Abstract: A optical disk drive long distance seek control device and method thereof, capable of feeding back the optical head control device through the step motor control device during the long distance seek; wherein, the step motor control device comprises a velocity profile generator capable of producing a quadratic profile to stabilize the step motor when finishing the seek; and more particular, the optical head control device uses a center error signal and a velocity error signal alternatively; moreover, the velocity error signal can be adjusted according to the output signals from the optical head control device and the step motor control device through a weighting mechanism.
    Type: Grant
    Filed: April 23, 2004
    Date of Patent: May 15, 2007
    Assignee: ALi Corporation
    Inventors: Feng-Fu Lin, Yi-Jen Chung
  • Zipper pull tab
    Patent number: 7204001
    Abstract: The surfaces of a metal pull tab which is hingedly secured to a metal bracket on a zipper slider and/or the surface of the bracket which engages the pull tab is covered by a non-metallic relatively soft coating which prevents wear caused by metal-to-metal contact between the pull tab and the bracket and reduces noise caused by free-swinging contact between the pull tab and the zipper or slider to which it is attached.
    Type: Grant
    Filed: April 27, 2001
    Date of Patent: April 17, 2007
    Assignee: Paragon Luggage, Inc.
    Inventor: Shin-Fu Lin
  • Heat dissipating structure and semiconductor package with the same
    Patent number: 7203072
    Abstract: A heat dissipating structure and a semiconductor package with the same are proposed. A substrate is used to accommodate at least one chip thereon, and the chip is electrically connected to the substrate. A heat dissipating structure having a flat portion and a support portion is mount on the substrate via the support portion by means of an adhesive. At least one groove is formed on the support portion and at least one air vent is formed around the groove to allow the groove to communicate with the outside via the air vent, such that the adhesive is allowed to fill the groove to expel air from the groove to the atmosphere through the air vent, thereby preventing the air from trapped in the groove.
    Type: Grant
    Filed: May 21, 2004
    Date of Patent: April 10, 2007
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventors: Chin-Te Chen, Chang-Fu Lin
  • Line-arranging mechanism
    Publication number: 20070069061
    Abstract: An arranging-line mechanism comprises a cam, an axle connecting to the cam, a sliding element and a transmitting mechanism to drive the cam and the axle. The cam comprises an inclined surface and the sliding element to slide thereon. When the axle revolves, the transmitting mechanism drives the cam to revolve. A power line is wound regularly via the sliding element to slide on the inclined surface.
    Type: Application
    Filed: May 19, 2006
    Publication date: March 29, 2007
    Applicant: LITE-ON TECHNOLOGY CORPORATION
    Inventors: Chia Chiu, Wei Liao, Chun Chu, Fu Lin
  • Semiconductor package with heat sink
    Patent number: 7196414
    Abstract: A semiconductor package with a heat sink is provided in which at least one chip is mounted on the substrate and covered by a heat sink. The heat sink is formed with a plurality of grooves or holes at positions in contact with the substrate, allowing an adhesive material to be applied between the heat sink and the substrate and filled into the grooves or holes for attaching the heat sink onto the substrate. The adhesive material filled into the grooves or holes provides an anchoring effect for firmly positioning the heat sink on the substrate. Therefore, it is not necessary to form predetermined holes on the substrate for being coupled to fixing members such as bolts, and incorporation of the heat sink would not affect trace routability and arrangement of input/output connections such as solder balls on the substrate and would not lead to cracks of the chip.
    Type: Grant
    Filed: August 26, 2005
    Date of Patent: March 27, 2007
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventors: Chang-Fu Lin, Han-Ping Pu, Cheng-Hsu Hsiao, Chien Ping Huang
  • METHOD OF FABRICATING DIELECTRIC LAYER
    Publication number: 20070066085
    Abstract: A method of fabricating a dielectric layer is described. A twelve-inch wafer having at least three metallic layers thereon is provided. A dielectric layer is formed over the twelve-inch wafer by performing a high-density plasma process. The high-density plasma process includes applying a total bias radio frequency (RF) power and a total source radio frequency (RF) power. Furthermore, the ratio between the total bias RF power and the total source RF power is about 0.7 to 2.5.
    Type: Application
    Filed: September 21, 2005
    Publication date: March 22, 2007
    Inventors: Hsien-Che Teng, June-Hung Wu, Jin-Fu Lin
  • Environmental protection start system free of energy source
    Publication number: 20070057587
    Abstract: The present invention provides an environmental protection start system free of energy source, including at least a magnetic movable set, a magnetic cathode transmission gear set and a small amplification transmission gear set. A negative pole of the magnetic movable set is moved towards the magnetic cathode transmission gear set, thereby producing a strong repelling force between negative polarities, which then causes a transmission gear set to rotate. A small amplification transmission gear set is then used to drive a large amplification transmission gear set, thereby achieving a start system that functions to produce an amplified force and speed.
    Type: Application
    Filed: September 12, 2005
    Publication date: March 15, 2007
    Inventor: Jue-Fu Lin
  • PACKAGE STRUCTURE FOR AN INTERFACE CARD
    Publication number: 20070058352
    Abstract: A package structure for an interface card comprises an upper cover, a lower cover, a frame, a connecting port, a rear extending seat, a rear extending cover and a printed circuit board. The upper cover is provide on its connecting side with a plurality of inserting members that extend vertically downward therefrom, the inserting members are spaced apart from one another by an interval and each is formed in the shape of an acute angle, in the frame is formed at least a groove for mating with the connecting side of the upper cover.
    Type: Application
    Filed: September 12, 2005
    Publication date: March 15, 2007
    Applicant: D & C TECHNOLOGY CO., LTD.
    Inventor: Mu-Fu Lin
  • Method of forming a material film
    Patent number: 7189649
    Abstract: A method of forming a material film is provided. A chemical vapor deposition (CVD) chamber including therein a showerhead coupled to a gas source and a pedestal coupled to a heater is provided. The showerhead is coupled to a radio frequency (RF) power source. A substrate is positioned on the pedestal. The substrate is then heated by the heater. A tantalum-containing organic metal precursor gas is flowed into the CVD chamber through the showerhead with the RF power source being off, thereby depositing a material film on the heated substrate. Thereafter the RF power source is turned on to output a RF power. An inert gas is flowed into the chamber. The material film in-situ plasma treated within the CVD chamber by providing the RF power to the inert gas. The substrate is removed out of the CVD chamber.
    Type: Grant
    Filed: August 20, 2004
    Date of Patent: March 13, 2007
    Assignee: United Microelectronics Corp.
    Inventors: Hsien-Che Teng, Chin-Fu Lin
  • Hydrogenation catalyst composition and process for hydrogenation of conjugated diene polymer
    Patent number: 7186782
    Abstract: A process for hydrogenation of an unsaturated polymer. The conjugated diene polymer in an inert organic solvent is brought into contact with hydrogen in the presence of a hydrogenation catalyst composition to selectively hydrogenate the unsaturated double bonds in the conjugated diene units of the conjugated diene polymer. The hydrogenation catalyst composition includes: (a) a titanium compound; (b) a compound represented by formula (II) or formula (III): wherein L1 is a Group IVA element, L2 is a Group IVA element, R3 is C1–C12 alkyl or C1–C12 cycloalkyl, R4 is C2–C12 alkyl or C3–C12 cycloalkyl, and X1, X2, and X3 can be the same or different and are C1–C12 alkyl, C1–C12 alkoxy, C1–C12 cycloalkoxy, phenyl, or phenoxy; and (c) a trialkylaluminum compound.
    Type: Grant
    Filed: March 23, 2005
    Date of Patent: March 6, 2007
    Assignee: TSRC Corporation
    Inventors: Fu Lin, Jing-Cherng Tsai, Chih-Kuang Tsai, Shun-An Liu
  • PROCESSING MODULES WITH MULTILEVEL CACHE ARCHITECTURE
    Publication number: 20070050553
    Abstract: A processing module with multilevel cache architecture, including: a processor; a level-one (L1) cache, coupled to the processor, for caching data for the processor, wherein the L1 cache has at least one L1 cacheable range; a level-two (L2) cache, coupled to the L1 cache, for caching data for the processor, wherein the L2 cache has at least one L2 cacheable range, and the L1 cacheable range and the L2 cacheable range are mutually exclusive; and a memory interface, coupled to the L1 cache and the L2 cache, for transferring data between the L1 cache and a memory and for transferring data between the L2 cache and the memory.
    Type: Application
    Filed: January 23, 2006
    Publication date: March 1, 2007
    Inventors: Ting-Cheng Hsu, Yen-Yu Lin, Chih-Wei Ko, Chang-Fu Lin
  • Fuel-concentration detecting and controlling device for fuel cell
    Publication number: 20070041872
    Abstract: An ultrasonic wave passes different fuels of different concentrations with different velocities. The present invention provides a detecting and controlling device where, by a non-touching method, a velocity for an ultrasonic wave in a first fuel with a first fuel concentration is measured. The velocity obtained is taken for a comparison with another velocity for the same ultrasonic wave in a fuel with a default fuel concentration so that the first fuel concentration of the fuel can be under controlled.
    Type: Application
    Filed: August 17, 2005
    Publication date: February 22, 2007
    Inventors: Kang-Nang Perng, Ching-Shih Liu, Kin-Fu Lin, Charn-Ying Chen, Kang-Lin Hwang, Ying-Sheng Lee
  • Semiconductor package with heat sink
    Patent number: 7177155
    Abstract: A semiconductor package with a heat sink is provided in which at least one chip is mounted on the substrate and covered by a heat sink. The heat sink is formed with a plurality of grooves or holes at positions in contact with the substrate, allowing an adhesive material to be applied between the heat sink and the substrate and filled into the grooves or holes for attaching the heat sink onto the substrate. The adhesive material filled into the grooves or holes provides an anchoring effect for firmly positioning the heat sink on the substrate. Therefore, it is not necessary to form predetermined holes on the substrate for being coupled to fixing members such as bolts, and incorporation of the heat sink would not affect trace routability and arrangement of input/output connections such as solder balls on the substrate and would not lead to cracks of the chip.
    Type: Grant
    Filed: August 26, 2005
    Date of Patent: February 13, 2007
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventors: Chang-Fu Lin, Han-Ping Pu, Cheng-Hsu Hsiao, Chien Ping Huang
  • Fluxless bumping process
    Publication number: 20070028445
    Abstract: A process including providing a semiconductor device including a bond pad, and an under bump metallurgy overlying the bond pad. Forming a solder structure over the under bump metallurgy, and wherein the solder structure includes an outer layer including tin oxide. Producing a plasma from at least one of CF4 and SF6, and exposing the solder structure to the plasma. Heating the solder structure and cooling the same to provide a solder bump on the semiconductor device.
    Type: Application
    Filed: October 13, 2006
    Publication date: February 8, 2007
    Inventors: Chao-Yuan Su, Chia-Fu Lin, Hsin-Hui Lee, Yen-Ming Chen, Kai-Ming Ching, Li-Chih Chen, Wen-Chang Kuo, Yue-Ying Jian
  • Button structure of saxophone
    Patent number: 7161076
    Abstract: A button structure of saxophone comprising of a treble E button, a side C linking rod button and a side B linking rod button; the bottom of the treble E button and the top of the side C linking rod button oblique upward 25° from left to right, the intersection and the horizontal direction of the finger hook form an upward 25° angle; the highest curve point of the side C linking rod button and the side B linking rod button are on the ¾ of the side C linking rod button and the side B linking rod button respectively, then declines from the high points downward on both sides to the rims of both buttons; players fell the reduction of the height difference and increase the contact area while playing that offers smoother play with less errors.
    Type: Grant
    Filed: February 16, 2005
    Date of Patent: January 9, 2007
    Assignee: Chia-Chun HSU
    Inventor: Wei-Fu Lin
  • HEATER FOR HEATING A WAFER AND METHOD FOR PREVENTING CONTAMINATION OF THE HEATER
    Publication number: 20060292896
    Abstract: A method for preventing contamination of a heater which is used for heating a wafer with a wafer bevel contains not directly heating the wafer bevel when using the heater to heat the wafer.
    Type: Application
    Filed: August 14, 2006
    Publication date: December 28, 2006
    Inventors: Hsien-Che Teng, Chin-Fu Lin, Chun-Hao Chu
  • Flash memory and fabrication method thereof
    Publication number: 20060284267
    Abstract: A flash memory comprises a substrate, control gates, doped regions, an isolation layer, isolation structures, floating gates, tunneling dielectric layers and inter-gate dielectric layers. The control gates are arranged over the substrate with a first direction, and the doped regions are arranged within the substrate with a second direction. The isolation layers are disposed between the control gates and the doping regions, and the isolation structures are disposed within the substrate where the doped regions and the control gates do not overlap. Furthermore, the floating gates are disposed between the control gates and the substrate that is not covered by the isolation layers. The tunneling dielectric layers are disposed between the substrate and the floating gates. The inter-gate dielectric layers are disposed between the control gates and the floating gates.
    Type: Application
    Filed: June 20, 2005
    Publication date: December 21, 2006
    Inventors: Hsin-Fu Lin, Chun-Pei Wu
  • Saxophone key
    Publication number: 20060283307
    Abstract: A saxophone key primarily consisting of a connected key fine-tuning structure for a saxophone, which is used to fine-tune the gaps between two connected keys of the saxophone, the fine-tuning structure is characterized in that: the fine-tuning structure consists of a tuning screw and a felt, wherein the tuning screw is fitted within a screw hole of a key surface of a connected key, moreover, the felt is affixed to a flat portion of one end of the tuning screw, the flat portion of the tuning screw being aligned with a tail end of a connecting rod of another connected key, lo and another end of the tuning screw is provided with an tuning groove. The fine-tuning structure can quickly and conveniently fine-tune the gap between the two connected keys. Moreover, the fine-tuning structure is able to reduce noise resulting from the keys colliding when being played.
    Type: Application
    Filed: June 21, 2005
    Publication date: December 21, 2006
    Inventor: Wei-Fu Lin
  • Can opener
    Patent number: D538117
    Type: Grant
    Filed: May 10, 2005
    Date of Patent: March 13, 2007
    Assignee: Aidox Technology Corporation
    Inventor: Chien-Fu Lin