Abstract: The disclosure provides a key structure, which includes a support, a keycap, a linkage, a circuit layer, and a trigger mechanism. The keycap can be lifted and lowered above the support. The linkage is movably connected to the support and the keycap. The support is located between the circuit layer and the linkage. The trigger mechanism is disposed between the circuit layer and the keycap. The key structure of the disclosure provides a disposition of a support spaced circuit layer and a linkage.

Abstract: An electronic device is provided, including a chip unit, a heat dissipation film, an encapsulation layer, a through hole, and a circuit structure. The chip unit has a first side and a second side opposite to the first side. The heat dissipation film is disposed on the first side. The encapsulation layer surrounds the chip unit and the heat dissipation film. The through hole penetrates the encapsulation layer, and has a first position and a second position. The circuit structure is disposed on the second side. The through hole is electrically connected to the chip unit through the circuit structure. The first position is connected to the circuit structure, and the second position is farther away from the circuit structure than the first position. The first position has a first width, the second position has a second width, and the first width is greater than the second width.

Abstract: A method of preparing a polyamide composite membrane using a vapor-assisted electrostatic spray is provided which relates to the field of preparation of polyamide composite membranes and comprises: step S1, adjusting a relative humidity of a surrounding environment of an electrostatic spray equipment to 80% to 90%; step S2, taking an amine monomer solution and an acyl chloride monomer solution as raw materials and placing the two raw materials in a spray system of the electrostatic spray equipment; step S3, wrapping a polymer ultrafiltration membrane on a receiving roller of the electrostatic spray equipment and setting electrostatic spray process parameters for electrostatic spraying; step S4, taking down an electrostatically-sprayed composite polymer membrane and placing the composite polymer membrane in an environment of 50 to 80° C. for heat treatment of 5 to 20 minutes, to prepare a finished polyamide composite membrane.

Abstract: An electronic device includes an electronic unit having a first side and a second side; an encapsulation layer surrounding the electronic unit and having a plurality of openings exposing the second side of the electronic unit; a first circuit structure disposed on the first side of the electronic unit and electrically connected to the electronic unit; a second circuit structure disposed on the second side of the electronic unit; a via penetrating the encapsulation layer and electrically connecting the first circuit structure to the second circuit structure; and a heat dissipation layer disposed on the second side of the electronic unit, wherein the heat dissipation layer contacts the electronic unit through the plurality of openings.

Abstract: An electronic device including an electronic element, an encapsulation layer, a circuit structure, a bonding element, and a bolt is provided. The encapsulation layer surrounds the electronic element. The circuit structure is electrically connected to the electronic element. The bonding element is electrically connected to the electronic element via the circuit structure. The bolt is disposed between the circuit structure and the encapsulation layer. A manufacturing method of an electronic device is also provided.

Abstract: A semiconductor device and a semiconductor device manufacturing method. The semiconductor device includes: a substrate; an epitaxial layer, located on one side of the substrate, where a doped region is formed on a surface that is of the epitaxial layer and that is away from the substrate, and the epitaxial layer includes an active region and a termination region that surrounds the active region; a passivation layer, covering the termination region and on which a window corresponding to the active region is formed; and a metal layer, covering the window and an inner edge that is of the passivation layer and that forms the window, and forming a schottky contact with the active region in the window.

Abstract: A semiconductor structure includes a first die; a plurality of first conductive vias adjacent to the first die. The semiconductor structure further includes a plurality of second conductive vias disposed over the first conductive vias, each of the second conductive vias corresponding to one of the first conductive vias; a plurality of third conductive vias disposed over the first die; and a molding material encapsulating the first die, the first conductive vias, the second conductive vias and the third conductive vias. A first width of each of the plurality of first conductive vias, a second width of each of the plurality of second conductive vias and a third width of the plurality of third conductive vias are different from each other.

Abstract: An electronic device includes an electronic unit, an encapsulation layer surrounding the electronic unit, a circuit structure electrically connected to the electronic unit and a bonding component. The circuit structure includes a first metal layer electrically connected to the electronic unit, a first dielectric layer disposed on the first metal layer and having an opening and a second metal layer disposed in the opening. The bonding component overlaps the second metal layer, and at least partially disposed in the opening. In cross-sectional view, a first height between a first dielectric layer top surface and a first metal layer top surface is greater than a second height between a second metal layer top surface and the first metal layer top surface. A difference between the first height and the second height is greater than or equal to 1 ?m and less than or equal to 15 ?m.

Abstract: An electronic device is provided. The electronic device includes a chip, a redistribution structure, a contact pad, a buffer layer, and a first connection pad. The redistribution structure is electrically connected to the chip. The redistribution structure includes a metal pad, and the metal pad is disposed opposite to the chip. The contact pad is disposed on the metal pad. The buffer layer is disposed on the redistribution structure and includes an opening. The opening exposes at least a portion of the contact pad. The first connection pad is disposed on the contact pad and extends in the opening. Moreover, in a normal direction of the chip, the metal pad, the contact pad and the first connection pad overlap. A method of manufacturing an electronic device is also provided.

Abstract: A semiconductor structure includes a first die; a second die disposed over the first die; a plurality of first conductive vias adjacent to the first die. The semiconductor structure further includes a plurality of second conductive vias disposed over the first conductive vias, each of the second conductive vias corresponding to one of the first conductive vias; a plurality of third conductive vias disposed over the first die and adjacent to the second die; and a molding material encapsulating the first die, the second die, the first conductive vias, the second conductive vias and the third conductive vias. A stepped shape is formed around an interface between each of the first conductive vias and the corresponding one of the second conductive vias.

Abstract: A polymer, a composition, a negative electrode and a battery employing the same are provided. The polymer has a repeat unit represented by Formula (I) wherein R1 is hydrogen or acetyl group; and, each R2 is independently hydrogen, —SO3H, or —SO3Li, and at least one of R2 is —SO3Li.

Abstract: A collet for a tool including an outer nut having a grip and defining a collet bore configured to receive a chuck. The collet bore includes a collet engagement surface engageable with the chuck to selectively secure a tool accessory. The collet also includes a spring having an extension portion engageable with an external part of an output shaft of the tool or an internal part of the outer nut to provide feedback to a user regarding securement of the collet.

Abstract: A plug connector includes an outer member and an insulated member. The outer member has a receiving groove. One of two ends of the outer member has a mating side, and the other end of the outer member has an assembling side. The outer member includes a mating ring portion, one or more extension portions, and one or more elastic pieces. The mating ring portion is at the mating side. The extension portion, the elastic piece, and the mating ring portion are integrally formed as a one-piece structure. The extension portion extends toward the assembling side from a side end of one side of the mating ring portion, and the elastic piece is bent at an end portion of the extension portion and arranged at a side portion of the extension portion. The insulated member is in the receiving groove.

Abstract: An illumination system, a projection device, and a projection control method are provided. The illumination system includes a first light-emitting unit, a second light-emitting unit, a third light-emitting unit, a first dichroic element, a second dichroic element, and a control unit. The first light-emitting unit includes a first light-emitting element and a second light-emitting element. The control unit is electrically connected to the first light-emitting unit and configured to switch the illumination system between a high-performance mode and a high-chroma mode, wherein when the illumination system is in the high-performance mode, the control unit controls a current ratio of the second light-emitting element to be greater than a current ratio of the first light-emitting element, and when the illumination system is in the high-chroma mode, the control unit controls the current ratio of the second light-emitting element to be less than the current ratio of the first light-emitting element.

Abstract: An illumination system provides an illumination beam and includes a red light source, a green light source, a blue light source, a first supplementary light source, a first X-shaped light-splitting assembly, a first light-splitting element, and a light-uniforming element. The red light source provides a red beam. The green light source provides a green beam. The blue light source provides a blue beam. The first supplementary light source provides a first supplementary beam. The first X-shaped light-splitting assembly guides the first supplementary beam and the blue beam to the first light-splitting element. The first light-splitting element guides the red beam, the green beam, the blue beam, and the first supplementary beam to the light-uniforming element. The first supplementary beam is a red supplementary beam or a blue supplementary beam, and the illumination system includes at least five light-emitting elements. A projection apparatus including the above illumination system is also provided.

Abstract: In an embodiment, a structure includes: a first integrated circuit die including first die connectors; a first dielectric layer on the first die connectors; first conductive vias extending through the first dielectric layer, the first conductive vias connected to a first subset of the first die connectors; a second integrated circuit die bonded to a second subset of the first die connectors with first reflowable connectors; a first encapsulant surrounding the second integrated circuit die and the first conductive vias, the first encapsulant and the first integrated circuit die being laterally coterminous; second conductive vias adjacent the first integrated circuit die; a second encapsulant surrounding the second conductive vias, the first encapsulant, and the first integrated circuit die; and a first redistribution structure including first redistribution lines, the first redistribution lines connected to the first conductive vias and the second conductive vias.

Abstract: An electronic device includes a chip and a circuit structure layer overlapped with the chip. The circuit structure layer includes a redistribution structure layer and an element structure layer, and the redistribution structure layer and the element structure layer are electrically connected to the chip. At least one of the redistribution structure layer and the element structure layer includes at least one opening, and in a normal direction of the electronic device, the at least one opening is overlapped with aside of the chip.

Abstract: A projection device, including an illumination system, a control element, a driving element, a light valve, and a projection lens, is provided. The illumination system includes multiple light sources for providing multiple light beams to be combined into an illumination light beam. The driving element respectively drives the light sources in a first mode or a second mode, so that the light beams have respective luminous brightness, and the driving element is switched from the first mode to the second mode according to a first signal. The control element provides the first signal to the driving element according to an optical state or a time state of the projection device. The light valve is adapted to convert the illumination light beam into an image light beam. The projection lens is adapted to project the image light beam out of the projection device.

Abstract: An illumination system for providing an illumination beam includes red, blue, and green light source modules, a first light combining element, and a light uniforming element. The red light source module includes a first red light emitting element emitting first red light and a second red light emitting element emitting second red light. A peak wavelength of the second red light is greater than a peak wavelength of the first red light. The blue light source module includes a first blue light emitting element emitting first blue light and a second blue light emitting element emitting second blue light. A peak wavelength of the second blue light is less than a peak wavelength of the first blue light. The green light source module generates green light. The first light combining element guides these lights into the light uniforming element, so that the illumination system outputs the illumination beam.

Abstract: A cover for covering an opening of a socket formed by a housing comprises a body; one or more bosses extending from the body, a first locking mechanism, a second locking mechanism, and a release tab. The bosses movably couple the body to the housing such that the body is movable between first and second positions. The first locking mechanism releasably attaches to the housing to secure the body in the first position. The second locking mechanism releasably attaches to the housing to secure the body in the second position. The release tab aids in detaching the first locking mechanism from the first wall and the second locking mechanism from the second wall. When the body is in the first position, the body allows access to the socket through the opening. When the body is in the second position, the body prevents access to the socket through the opening.