Abstract: A waste collection apparatus for collecting waste in water is provided. The waste collection apparatus includes a floating device and a waste collection device coupled to the floating device. The floating device includes a plurality of floating units. The waste collection device is coupled to the floating device. Each of the floating units includes a base and a pillar connected to the base, and the density of the base is greater than the density of the pillar.

Abstract: A waste collection apparatus for collecting waste in water is provided. The waste collection apparatus includes a floating device and a waste collection device coupled to the floating device. The waste collection device includes a fluid ejection element, and the flow out of the fluid ejection element flows toward a space where waste is collected.

Abstract: Provided are an interaction method and apparatus, an electronic device, a storage medium, and a program product. The method includes displaying a gift panel in response to a gift panel display operation for a target object, where the gift panel is configured for a gifting user to select a recipient user corresponding to the target object, the gifting user includes a target user, and the target object is configured to establish, for the recipient user, a first association relationship between the recipient user and the target user; and sending a target gift request to a server in response to a gift operation acting in the gift panel.

Abstract: An electronic device includes a chip and a circuit structure layer overlapped with the chip. The circuit structure layer includes a redistribution structure layer and an element structure layer, and the redistribution structure layer and the element structure layer are electrically connected to the chip. At least one of the redistribution structure layer and the element structure layer includes at least one opening, and in a normal direction of the electronic device, the at least one opening is overlapped with aside of the chip.

Abstract: An electrical connector includes an insulating body and a number of terminal groups. The insulating body includes a mating slot, a first notch and a second notch. The first notch and the second notch are symmetrically arranged on opposite sides of the mating slot. The terminal groups include a first conductive terminal, a second conductive terminal, a third conductive terminal and a fourth conductive terminal. Each conductive terminals includes a mating portion extending into the mating slot. With this arrangement, relatively more terminal groups can be provided, which is beneficial to improve the speed of data transmission. A connector assembly having the electrical connector is also disclosed.

Abstract: An illumination system for providing an illumination beam includes red, blue, and green light source modules, a first light combining element, and a light uniforming element. The red light source module includes a first red light emitting element emitting first red light and a second red light emitting element emitting second red light. A peak wavelength of the second red light is greater than a peak wavelength of the first red light. The blue light source module includes a first blue light emitting element emitting first blue light and a second blue light emitting element emitting second blue light. A peak wavelength of the second blue light is less than a peak wavelength of the first blue light. The green light source module generates green light. The first light combining element guides these lights into the light uniforming element, so that the illumination system outputs the illumination beam.

Abstract: A projection device, including an illumination system, a control element, a driving element, a light valve, and a projection lens, is provided. The illumination system includes multiple light sources for providing multiple light beams to be combined into an illumination light beam. The driving element respectively drives the light sources in a first mode or a second mode, so that the light beams have respective luminous brightness, and the driving element is switched from the first mode to the second mode according to a first signal. The control element provides the first signal to the driving element according to an optical state or a time state of the projection device. The light valve is adapted to convert the illumination light beam into an image light beam. The projection lens is adapted to project the image light beam out of the projection device.

Abstract: An integrated circuit (IC) structure includes a substrate having several regions, several semiconductor devices formed at the substrate and respectively within the regions, and an ultra-deep (UD) trench isolation structure formed in the substrate. The substrate has a top surface and a bottom surface oppositely, and the UD trench isolation structure formed in the substrate surrounds peripheries of each of the regions for structurally and physically isolating the semiconductor devices within different regions. The UD trench isolation structure penetrates the substrate by extending from the top surface of the substrate to the bottom surface of the substrate.

Abstract: A cover for covering an opening of a socket formed by a housing comprises a body; one or more bosses extending from the body, a first locking mechanism, a second locking mechanism, and a release tab. The bosses movably couple the body to the housing such that the body is movable between first and second positions. The first locking mechanism releasably attaches to the housing to secure the body in the first position. The second locking mechanism releasably attaches to the housing to secure the body in the second position. The release tab aids in detaching the first locking mechanism from the first wall and the second locking mechanism from the second wall. When the body is in the first position, the body allows access to the socket through the opening. When the body is in the second position, the body prevents access to the socket through the opening.

Abstract: A semiconductor structure includes a first die; a second die disposed over the first die; a plurality of first conductive vias adjacent to the first die. The semiconductor structure further includes a plurality of second conductive vias disposed over the first conductive vias, each of the second conductive vias corresponding to one of the first conductive vias; a plurality of third conductive vias disposed over the first die and adjacent to the second die; and a molding material encapsulating the first die, the second die, the first conductive vias, the second conductive vias and the third conductive vias. A stepped shape is formed around an interface between each of the first conductive vias and the corresponding one of the second conductive vias.

Abstract: A chip and an electronic device are disclosed. The chip includes a main functional area, a protection area, and a transition area located between the main functional area and the protection area. The chip includes a field oxide, a metal layer, and a passivation layer that are sequentially stacked on a semiconductor substrate. In the transition area, the field oxide includes a primary field oxide and at least one secondary field oxide that are disposed at intervals, the secondary field oxide is located on a side of the primary field oxide facing the main functional area, the metal layer extends from the main functional area to a side of the primary field oxide facing away from the semiconductor substrate. The passivation layer extends from a side of the metal layer facing away from the semiconductor substrate to a side of the metal layer facing away from the main functional area.

Abstract: A release mechanism is disclosed that can facilitate safely and efficiently removing an expansion card from a computing device. The release mechanism can be installed on a motherboard around an expansion slot, and can include an opening that permits access to the expansion slot to allow an expansion card to be installed therein. When removal of the expansion card is desired, a handled of the release mechanism can be pulled, causing contact surfaces of the release mechanism to push the expansion card away from the expansion slot with even force, removing the need to tilt the expansion card.

Abstract: A vapor chamber and a heat dissipation device with the vapor chamber are provided. The vapor chamber includes a first plate, a second plate, a first capillary strip, a first communication structure and a working medium. An accommodation space is defined by the first plate and the second plate collaboratively. The first capillary strip is installed in the accommodation space. The accommodation space is divided into a first region and a second region by the first capillary strip. The working medium is accommodated within the accommodation space. The working medium flows between the first region and the second region through the first communication structure. Since the working medium is guided to flow in the accommodation space by the first capillary strip and the first communication structure, the heat dissipating efficacy is enhanced.

Abstract: A filter element and a projection device are provided. The filter element is configured on the transmission path of at least one light beam, and includes a substrate and a film. The film is located on a surface of the substrate, and includes a first area and a second area. The first area includes a center, corresponding to the central axis of the at least one light beam. The distance between the second area and the center of the first area is greater than the distance between any point in the first area and the center. The average thickness of the second area of the film is greater than the average thickness of the first area of the film. The filter element of the disclosure may still have a similar filter effect when the incident angle is relatively large.

Abstract: A method includes forming a plurality of first conductive vias over a redistribution layer (RDL); disposing a first die over the RDL and adjacent to the first vias; and forming a plurality of second conductive vias over and electrically connected to the first conductive vias, each of the second conductive vias corresponding to one of the first conductive vias. The method further includes forming a plurality of third conductive vias over the first die; disposing a second die over the first die and adjacent to the third conductive vias; and encapsulating the first die, the second die, the first conductive vias, the second conductive vias and the third conductive vias with a molding material.

Abstract: Various example embodiments relate to enhancing excitation and output power in multi-transmitter wireless power transfer system. Transmitter coils are arranged such that they are substantially uncoupled from each other. The transmitter coils are activated one by one to measure induced voltage across adjacent transmitter coils. The induced voltages are used to determine mutual inductance ratios of transmitter-receiver pairs to obtain current distribution coefficients indicative of the position of the receiver for optimal excitation. A device, a method, and a computer program are disclosed.

Abstract: An illumination system, a projection device, and a projection control method are provided. The illumination system includes a first light-emitting unit, a second light-emitting unit, a third light-emitting unit, a first dichroic element, a second dichroic element, and a control unit. The first light-emitting unit includes a first light-emitting element and a second light-emitting element. The control unit is electrically connected to the first light-emitting unit and configured to switch the illumination system between a high-performance mode and a high-chroma mode, wherein when the illumination system is in the high-performance mode, the control unit controls a current ratio of the second light-emitting element to be greater than a current ratio of the first light-emitting element, and when the illumination system is in the high-chroma mode, the control unit controls the current ratio of the second light-emitting element to be less than the current ratio of the first light-emitting element.

Abstract: The disclosure provides a key structure, which includes a support, a keycap, a linkage, a circuit layer, and a trigger mechanism. The keycap can be lifted and lowered above the support. The linkage is movably connected to the support and the keycap. The support is located between the circuit layer and the linkage. The trigger mechanism is disposed between the circuit layer and the keycap. The key structure of the disclosure provides a disposition of a support spaced circuit layer and a linkage.

Abstract: A method includes forming a plurality of first conductive vias over a redistribution layer (RDL); disposing a first die over the RDL and adjacent to the first vias; and forming a plurality of second conductive vias over and electrically connected to the first conductive vias, each of the second conductive vias corresponding to one of the first conductive vias. The method further includes forming a plurality of third conductive vias over the first die; disposing a second die over the first die and adjacent to the third conductive vias; and encapsulating the first die, the second die, the first conductive vias, the second conductive vias and the third conductive vias with a molding material.