Patents by Inventor Fu Tang

Fu Tang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20090039704
    Abstract: A power converter system includes multiple converter modules connected to a share bus. Each of the converter modules mirrors the phase current of itself to provide a mirror current to the share bus, extracts an average current from the share bus, and compares the phase current of itself with the average current it extracts from the share bus to produce an output signal for modulation of the phase current of itself. Specifically, each of the converter modules is provided with a resistor connected to the share bus such that all the resistors are connected in parallel, and thus each of the resistors automatically receives an average current from the share bus.
    Type: Application
    Filed: August 6, 2008
    Publication date: February 12, 2009
    Inventors: Isaac Y. Chen, Chien-Fu Tang
  • Publication number: 20080238397
    Abstract: For soft start of a switching regulator, the output voltage of the switching regulator is fed back to be compared with a ramp signal, in order to trigger a comparison signal when the ramp signal rises up to reach the feedback signal, to enable the switching regulator such that the output voltage changes from a residual voltage toward a target value. The low side switch of the switching regulator is kept off for a period of time after the switching regulator is enabled, so as to prevent a reverse current during the soft start period.
    Type: Application
    Filed: March 24, 2008
    Publication date: October 2, 2008
    Inventors: Isaac Y. Chen, Chien-Fu Tang
  • Publication number: 20080176360
    Abstract: A method for sawing a wafer includes the following steps. A wafer which has an active surface, a back surface and a plurality of longitudinal and transverse sawing lines is provided, wherein the sawing lines are located on the active surface so as to define a plurality of dies. A multiple tape is attached on the active surface of the wafer, wherein the multiple tape includes a first tape and a second tape, the second tape is located between the first tape and the active surface of the wafer, and the second tape is transparent. The back surface of the wafer is grinded. The first tape is removed. Finally, the wafer including the second tape is sawn along the sawing lines so as to separate the dies from one another.
    Type: Application
    Filed: January 22, 2008
    Publication date: July 24, 2008
    Applicant: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Fu Tang CHU, Chi Yuam CHUNG
  • Publication number: 20080122494
    Abstract: An on-chip mode-setting circuit and method are provided for a chip having an output driver with an output terminal connected to a pin of the chip. The pin may be defined between two states from exterior of the chip. The on-chip mode-setting circuit includes an electronic element connected to a bias input of the output driver for producing a voltage when the pin is defined at one of the two states, and a voltage detector for monitoring the voltage to determine which one of the two states the pin is at, and producing a mode-setting signal accordingly.
    Type: Application
    Filed: November 20, 2007
    Publication date: May 29, 2008
    Inventors: Chien-Fu Tang, Isaac Y. Chen
  • Publication number: 20080045124
    Abstract: The present invention relates to a sawing method for a wafer. The sawing method of the invention comprises: (a) providing a wafer, the wafer having an active surface and a back surface, the active surface having a plurality of sawing lines; (b) coating a protection layer on the active surface and the sawing lines; (c) taping a grinding tape on a surface of the protection layer; (d) grinding the back surface of the wafer to thin the wafer; (e) removing the grinding tape; and (f) sawing the wafer to form a plurality of dice. Whereby, the problems of die cracking, die scratching, die contamination and peeling of the surface of the sawing lines can be avoided.
    Type: Application
    Filed: April 19, 2007
    Publication date: February 21, 2008
    Inventors: Fu-Tang Chu, Chi-Yuam Chung, Ji-Ping Teng
  • Publication number: 20070224780
    Abstract: A method for dicing a wafer is provided. A layer of adhesive material is applied to the back surface of the wafer so as to provide a sufficient mechanical strength for the wafer during dicing process thereby preventing the dice diced from the wafer from undue chipping on the back surfaces and the side surfaces.
    Type: Application
    Filed: August 22, 2006
    Publication date: September 27, 2007
    Applicant: ADVANCED SEMICONDUCTOR ENGINEERING INC.
    Inventors: Fu Tang CHU, Chi Yuam CHUNG
  • Patent number: 7157872
    Abstract: A ceiling fan with an outer-rotor type DC brushless motor has a center base with multiple blades and a DC brushless motor as a driving source for the fan. The DC brushless motor includes a controller, magnetism sensors, a stator with stator windings and a rotor assembly connected to the fan and having permanent magnets interacting with the stator windings. The controller detects polarity of the permanent magnets through the magnetism sensors. Based on the detected results, the controller changes current of the stator windings to produce an inductive magnetic field with poles the same to the permanent magnets to drive the rotor assembly. Accordingly, the blades of the fan are driven to rotate.
    Type: Grant
    Filed: April 26, 2006
    Date of Patent: January 2, 2007
    Assignee: Yong Shin T. Electric Machine Co., Ltd.
    Inventor: Yung-Fu Tang
  • Patent number: 7052477
    Abstract: A massaging machine includes a massaging device and a steering mechanism for operating the massaging device. The steering mechanism has a shaft on which a drive gear and a driven seat are mounted. The drive gear is driven by a motor to actuate the massaging device to operate. The driven seat is provided with a unidirectional bearing by which the driven seat is mounted on the shaft. The unidirectional bearing is intended to disable the massaging device to engage in a reciprocating motion at the time when the drive gear is driven to turn in a reverse direction.
    Type: Grant
    Filed: October 14, 2003
    Date of Patent: May 30, 2006
    Inventors: Dong-Her Wu, Lai-Fu Tang
  • Patent number: 6913561
    Abstract: A stationary exercise apparatus includes a framework, a curved shaft, two oil pressure cylinder sets, and two pedals. The curved shaft has two curved ends and a straight portion located between the two curved ends. The two curved ends are pivoted with the framework such that the two curved ends form a deflection angle of 180 degrees when the curved shaft is driven to turn radially. The two oil pressure cylinder sets are fastened between the framework and the curved ends of the curved shaft for providing the curved shaft with a damping effect. The two pedals are mounted on the straight portion of the curved shaft for driving the curved shaft to turn radially.
    Type: Grant
    Filed: October 14, 2003
    Date of Patent: July 5, 2005
    Inventors: Dong-Her Wu, Lai-Fu Tang
  • Publication number: 20050079959
    Abstract: A stationary exercise apparatus includes a framework, a curved shaft, two oil pressure cylinder sets, and two pedals. The curved shaft has two curved ends and a straight portion located between the two curved ends. The two curved ends are pivoted with the framework such that the two curved ends form a deflection angle of 180 degrees when the curved shaft is driven to turn radially. The two oil pressure cylinder sets are fastened between the framework and the curved ends of the curved shaft for providing the curved shaft with a damping effect. The two pedals are mounted on the straight portion of the curved shaft for driving the curved shaft to turn radially.
    Type: Application
    Filed: October 14, 2003
    Publication date: April 14, 2005
    Inventors: Dong-Her Wu, Lai-Fu Tang
  • Publication number: 20050080365
    Abstract: A massaging machine includes a massaging device and a steering mechanism for operating the massaging device. The steering mechanism has a shaft on which a drive gear and a driven seat are mounted. The drive gear is driven by a motor to actuate the massaging device to operate. The driven seat is provided with a unidirectional bearing by which the driven seat is mounted on the shaft. The unidirectional bearing is intended to disable the massaging device to engage in a reciprocating motion at the time when the drive gear is driven to turn in a reverse direction.
    Type: Application
    Filed: October 14, 2003
    Publication date: April 14, 2005
    Inventors: Dong-Her Wu, Lai-Fu Tang
  • Patent number: 6691876
    Abstract: A semiconductor wafer cassette has a first side wall, a second side wall opposite the first side wall, a front surface, and a back surface opposite the front surface. A body defines an internal bay portion with slots for vertically receiving wafers, each slot of the internal bay portion having one support slab. The body also includes two parallel legs for supporting the cassette and a handle for handling the cassette.
    Type: Grant
    Filed: January 25, 2002
    Date of Patent: February 17, 2004
    Assignee: Advanced Semiconductor Engineering, Inc.
    Inventors: Yu-Pin Tsai, Chih-Min Pao, Ching-Feng Tseng, Fu-Tang Chu
  • Patent number: 6692068
    Abstract: A deck chair has a frame having a back frame, a seat frame, a leg frame, a front support frame, a rear support frame outside the back frame and two side stretchers. Two positioning members pivotally mount the back frame to the seat. Two armrest-adjusting members are respectively pivotally mounted at top ends of the front support frame and the rear support frame. When the positioning members are locked, the back frame and the seat frame can be pivoted about the positioning members with a changeless included angle.
    Type: Grant
    Filed: February 5, 2003
    Date of Patent: February 17, 2004
    Inventor: Lai-Fu Tang
  • Publication number: 20030075518
    Abstract: The present invention discloses a semiconductor wafer cassette, which is able to receive at least one wafer, comprising: a first side wall, a second side wall opposite to the first side wall, a front surface, and a back surface opposite to the front surface; the cassette further comprising a body, the body defining an internal bay portion with slots for vertically receiving a plurality of wafers, each slot of the internal bay portion having one support slab. Moreover, the body also includes two parallel legs for supporting the cassette and a handle for handling the wafer cassette.
    Type: Application
    Filed: January 25, 2002
    Publication date: April 24, 2003
    Applicant: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Yu-Pin Tsai, Chih-Min Pao, Ching-Feng Tseng, Fu-Tang Chu
  • Publication number: 20030066810
    Abstract: The present invention discloses a frame cassette comprising a case, a hollow parallelepiped with an front opening, having a bottom wall and a top wall parallel with each other, and a left side wall, a right side wall and a rear side wall perpendicular to the top wall and the bottom wall; and a plurality of frames for adhering and fixing cut wafers; characterized in that: a positioning hole is disposed on near the boundary between the bottom wall and the left side wall and the right side wall to fix the frame cassette on a personal guided vehicle.
    Type: Application
    Filed: January 25, 2002
    Publication date: April 10, 2003
    Applicant: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventor: Fu-Tang Chu
  • Patent number: 6476504
    Abstract: An adhesive pattern for attaching a semiconductor chip onto a non-uniform substrate is disclosed. The adhesive pattern comprises a double-k pattern formed on the substrate. The double-k pattern includes a longest major line and four shorter lines connected to the major line. The non-uniform substrate has a conductive circuit and a solder mask formed on the substrate including the circuit. The substrate has a die covering region for receiving the semiconductor chip. The conductive circuit of the substrate comprises a plurality of conductive traces unequally distributed on the die covering region. The double-k adhesive pattern of the present invention is applied onto the non-uniform substrate by a dispenser in a manner that the area on the substrate defined between the major line and the border of the die covering region has a trace density lower than the other area on the substrate.
    Type: Grant
    Filed: November 27, 2001
    Date of Patent: November 5, 2002
    Assignee: Advanced Semiconductor Engineering, Inc.
    Inventors: Fu Tang Chu, Ji Ping Teng
  • Patent number: D552387
    Type: Grant
    Filed: January 10, 2007
    Date of Patent: October 9, 2007
    Inventors: Dong-Her Wu, Lai-Fu Tang