Frame cassette

Abstract

The present invention discloses a frame cassette comprising a case, a hollow parallelepiped with an front opening, having a bottom wall and a top wall parallel with each other, and a left side wall, a right side wall and a rear side wall perpendicular to the top wall and the bottom wall; and a plurality of frames for adhering and fixing cut wafers; characterized in that: a positioning hole is disposed on near the boundary between the bottom wall and the left side wall and the right side wall to fix the frame cassette on a personal guided vehicle.

Description

BACKGROUND OF THE INVENTION

[0001] 1. Field of the Invention

[0002] The present invention relates to a frame cassette, and more particularly, to a frame cassette, which can be transported by a conventional personal guided vehicle.

[0003] 2. Description of Related Art

[0004] In the semiconductor process, the wafer is stored in a cassette during transportation to improve the transportation speed of the wafer between machines or protect the wafer from the particle pollution. Similarly, in the semiconductor package process, the wafer will be cut and then adhered to a frame. Therefore, the frame with those cut wafers is transported with a frame cassette between machines, such as the mounting machines and the die-bonding machine. The frame cassette can be loaded into the loading port of the machine for loading the wafer into the machine directly, so that the particle pollution in the air is avoided.

[0005] FIG. 1 is a perspective view of a conventional frame cassette made according to SEMI G77-0699 standard, comprising a case 11 and a plurality of frames 12. The case 11 is composed of a bottom wall 112 and a top wall 113 parallel with each other, and a left side wall 111, a right side wall 110 and a rear side wall 114 perpendicular to the top wall 113 and the bottom wall 112. In addition, a handle 117 is disposed on the top wall 113 of the case for holding. And, a fasten means (not shown) is disposed on the bottom wall 112 to position the frame cassette 10 on the loading port for loading the wafer into the machine. Moreover, a plurality of grooves are correspondingly disposed inside of the left side wall 111 and the right side wall 110 of the case 11 for placing the plurality of the frames, so that the breakage of the wafer due to the frame friction is avoided. A fastener 116 is disposed on the front side of the left side wall 111 to fasten the frame 12 in the frame cassette 10, so that the frame shaking or falling out of the frame cassette 10 is avoided.

[0006] The cassette can be loaded into the machines directly, when it is transported with a personal guided vehicle. The conventional personal guided vehicle, as shown in FIG. 2(a), comprises a supporting means 21, a handle 22, and wheels 23. The supporting means 21 comprises a housing 210, two frame arms 211, and two sliding trenches 212. The housing 210 is a hollow parallelepiped with an opening. Thus, the cassette can be moved into the personal guided vehicle from the opening of the housing 210. Two frame arms 211 are disposed on the left and the right sides of the bottom of the housing 210, respectively. The sliding trench 212 is buckled in the frame arm 211, so that the sliding trench 212 can slide on the frame arm 211 forwards and backwards. Two protrusions 213 are oppositely disposed in the sliding trench 212, as shown in FIG. 2(b). The cassette can be moved from the opening of the housing 210 by a robot and positioned by the protrusion 213 of the sliding trench 212. Thus, the wafer in the cassette will not be polluted by the particle in the air during transportation.

[0007] However, the frame cassette is made according to the SEMI G770699 standard and cannot be transported by the present personal guided vehicle. Therefore, to improve the productivity and decrease the waste of manpower during the semiconductor package process, the present invention discloses a frame cassette which can be transported by the personal guided vehicle. Thus, the conventional personal guided vehicle can transport not only the cassette but also the frame cassette.

SUMMARY OF THE INVENTION

[0008] A major object of the present invention is to provide a frame cassette, which can be transported by a personal guided vehicle for decreasing the waste of manpower and improving the productivity.

[0009] In order to achieve the above object and to avoid the disadvantages of the prior art, the present invention discloses a frame cassette, comprising:

[0010] a case, being a hollow parallelepiped with a front opening, having a bottom wall and a top wall parallel with each other, and a left side wall, a right side wall and a rear side wall perpendicular to the top wall and the bottom wall; and

[0011] a plurality of frames for adhering and fixing cut wafers;

[0012] characterized in that: a positioning hole is disposed on near the boundary between the bottom wall and the left side wall and the right side wall for fixing the frame cassette on a personal guided vehicle.

[0013] The foregoing and other objects and advantages of the invention and the manner in which the same are accomplished will become clearer based on the following detailed description taken in conjunction with the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

[0014] FIG. 1 is a perspective view of a conventional frame cassette;

[0015] FIGS. 2(a) and 2(b) are perspective views illustrating the structure of a conventional personal guided vehicle; and

[0016] FIG. 3 is a perspective view of a frame cassette of a preferred embodiment of the present invention.

DETAILED DESCRIPTION OF THE INVENTION

[0017] As shown in FIG. 3, a frame cassette 30 of one preferred embodiment of the present invention comprises a case 31 and a plurality of frames 32. The case 32 is hollow parallelepiped with a front opening 31 and includes a top wall 313 and bottom wall 312 parallel with each other, and a left side wall 311, a right side wall 310 and a rear side wall 314 perpendicular to the top wall 313 and the bottom wall 312. A handle (not shown) is disposed on the top wall 313 of the case 31 for holding the frame cassette. A fasten means 3 18 is disposed on the bottom wall 312 to fasten the frame cassette 30 on the loading port of the machine (not shown). Moreover, a plurality of grooves 315 are provided oppositely on the inside of the left side wall 311 and the right side wall 310 of the case 31 for placing the plurality of frames 32, so that the breakage of the wafer due to the friction between frames is avoided. For example, the frame cassette 30 for placing 12-inch wafer has 13 grooves 315. A fastener 316 is disposed in the front of the left side wall 311 or the right side wall 310 for fastening the frame 32 in the frame cassette 30, so that the frame shaking or falling out of the frame cassette 30 is avoided. The interval between the left side wall 311 and the right side wall 310 of the frame cassette 30 is the same as that between two sliding trenches 212 of the personal guided vehicle 20 (as shown in FIG. 2(a) and FIG. 2(b)).

[0018] The feature of the frame cassette 30 of the present invention is that a positioning hole 319 is disposed on near the boundary of the bottom wall 312 and the left and right side walls 311, 310, respectively. A protrusion 213 on the sliding trench 212 of the personal guided vehicle 20 will be inserted into the positioning hole 319 on the bottom wall of the frame cassette 30, while the frame cassette of the present invention is placed on the personal guided vehicle 20 (as shown in FIG. 2(a) and FIG. 2(b)). Therefore, the frame cassette 30 can be positioned on the personal guided vehicle 20 for transporting or loading into a machine. In this case, the personal guided vehicle can transport not only the cassette but also the frame cassette.

[0019] The technical contents and features of this invention have been sufficiently described in the above descriptions. It should be understood that any modifications or changes without departing from the spirits of the invention are intended to be covered in the protection scope of the invention.

Claims

1. A frame cassette applied to a personal guided vehicle for transferring a semiconductor wafer, comprising:

a case, being a hollow parallelepiped with a front opening, having a bottom wall and a top wall parallel with each other, and a left side wall, a right side wall and a rear side wall perpendicular to the top wall and the bottom wall; and

a plurality of frames for adhering and fixing cut wafers;

characterized in that: a positioning hole is disposed on near the boundary between the bottom wall and the left side wall and the right side wall to fix the frame cassette on a personal guided vehicle.

2. The frame cassette of claim 1, which is able to be applied to a 12-inch wafer.

3. The frame cassette of claim 1, wherein inside the left and the right side walls of the case are oppositely provided with a plurality of grooves for placing a plurality of the frames.

4. The frame cassette of claim 1, wherein inside the left and the right side walls of the case are oppositely provided with 13 grooves.