Patents by Inventor Fu Yang

Fu Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20080124836
    Abstract: A packaging substrate and a manufacturing method thereof are provided. The manufacturing method includes following steps. First, a first packaging substrate including several first substrate units and at least one defected substrate unit is provided. Next, the defected substrate unit is separated from the packaging substrate, and at least one opening is formed in a frame of the first packaging substrate correspondingly. Then, a second substrate unit is provided. The shape of the second substrate unit is different from the shape of the opening. Afterwards, the second substrate unit is disposed in the opening.
    Type: Application
    Filed: December 28, 2006
    Publication date: May 29, 2008
    Inventors: Ho-Ming Tong, Teck-Chong Lee, Chao-Fu Weng, Chian-Chi Lin, Che-Ya Chou, Shin-Hua Chao, Song-Fu Yang, Kao-Ming Su
  • Publication number: 20080116034
    Abstract: A bill acceptor used in a money exchanging machine includes a bill box for collecting bills, and a bill receiving and verification unit, which has a bill slot for insertion of bills, a first bill passage extending from the bill slot, a second bill passage corresponding to the bill box, a conveyor for carrying each inserted bill from the bill slot through the first bill passage to the second bill passage, a camshaft and cross linkage mechanism movable to force each inserted bill from the second bill passage into the inside of the bill box, and a sensor. The sensor is formed of an optical emitter, an optical receiver and a reflecting device and turns on an indicator light when the bill box is empty or turns off the indicator light when the bill box has bills stored therein.
    Type: Application
    Filed: January 22, 2008
    Publication date: May 22, 2008
    Inventor: Wen-Fu Yang
  • Publication number: 20080102539
    Abstract: A wire-bonding method for a wire-bonding apparatus is provided. The wire-bonding apparatus includes at least a first wire-bonder and a second wire-bonder for respectively bonding at least several first chips in a first region and several second chips in a second region on a substrate simultaneously. The wire-bonding method includes following steps. First, initial position coordinates of the first region and the second region are obtained. Next, it is determined whether a space between the first region and the second region is greater than a predetermined space. When the space between the first region and the second region is greater than the predetermined space, the first wire-bonder and the second wire-bonder respectively bond the first chips and the second chips simultaneously.
    Type: Application
    Filed: October 5, 2007
    Publication date: May 1, 2008
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Ho-Ming Tong, Teck-Chong Lee, Chao-Fu Weng, Chian-Chi Lin, Chih-Nan Wei, Song-Fu Yang, Chia-Jung Tsai, Kao-Ming Su
  • Publication number: 20080084022
    Abstract: A bill stacker detection apparatus comprises a base body, a stacker and a sensor. The sensor has a light emitting element and a light receiving element. When the stacker is moved to a position near the sensor, apertures of a protruding structure on the stacker is covered. The light receiving element is unable to receive a light beam emitted by the light emitting element. If bills fill with the stacker, a bill supporting plate then pushes a sliding block. The aperture is staggered by the sliding block. The light receiving element then receives the light beam to detect whether the stacker is disposed on the base or filled with bills.
    Type: Application
    Filed: October 9, 2006
    Publication date: April 10, 2008
    Inventor: Wen-Fu Yang
  • Publication number: 20080083486
    Abstract: A method of making a silicon rubber product with an adhesive layer on a back thereof includes the steps of: providing silicon rubber in a cavity of a mold, and then providing a solid adhesive film on the silicon rubber. After that, the mold is treated by hot molding to mold the silicon rubber and combine the silicon rubber and the adhesive film together. After hot molding treatment, it will get a silicon rubber product with an adhesive layer on a back thereof.
    Type: Application
    Filed: October 5, 2006
    Publication date: April 10, 2008
    Inventor: Wen-Fu Yang
  • Publication number: 20080085571
    Abstract: A die bonder and a die bonding method thereof are provided. The die bonder includes a wafer platform, an arranging platform, a conveyer, at least one first pick-up device and a second pick-up device. The wafer platform is for placing a wafer with several dies. The conveyer is for carrying and conveying a substrate. The first pick-up device is for picking up one of the dies and placing each die on the arranging platform. The second pick-up device is for picking up the dies on the arranging platform and placing the dies on the substrate at the same time.
    Type: Application
    Filed: October 4, 2007
    Publication date: April 10, 2008
    Inventors: Ho-Ming Tong, Kao-Ming Su, Chao-Fu Weng, Teck-Chong Lee, Chian-Chi Lin, Chia-Jung Tsai, Chih-Nan Wei, Song-Fu Yang
  • Patent number: 7352245
    Abstract: An auto-range current mirror circuit has a current sensing circuit, a front and rear stage current mirrors each has an adjustable amplifying rate. The current sensing circuit presets a threshold current and has an input current of the front stage current mirror. The current sensing current compares the input current with a threshold current and then outputs a controlling signal to the front and rear stage current mirrors to adjust a suitable amplifying rate. Therefore, a bias current of the rear stage current mirror is amplified by the suitable amplifying rate to improve the quality of output current of the rear stage current mirror.
    Type: Grant
    Filed: June 30, 2006
    Date of Patent: April 1, 2008
    Assignee: Silicon Touch Technology Inc.
    Inventors: Fu-Yang Shih, Hsu-Yuan Chin
  • Publication number: 20080044931
    Abstract: A packaging substrate and a method of manufacturing the same are provided. The method includes following steps. First, a first substrate including at least one defected packaging unit and several first packaging units is provided. The defected packaging unit and the first packaging units are arranged in an array on the first substrate. Next, the defected packaging unit is removed from the first substrate to correspondingly form at least one opening in the first substrate. Then, a second substrate including at least one second packaging unit is provided. Later, the second packaging unit is separated from the second substrate. The area of the second packaging unit is less than that of the opening. Subsequently, the second packaging unit is disposed in the opening. The edge of the second packaging unit is placed partially against an inner wall of the opening.
    Type: Application
    Filed: December 28, 2006
    Publication date: February 21, 2008
    Inventors: Ho-Ming Tong, Kao-Ming Su, Chao-Fu Weng, Che-Ya Chou, Shin-Hua Chao, Teck-Chong Lee, Song-Fu Yang, Chian-Chi Lin
  • Publication number: 20080035706
    Abstract: A wire-bonding apparatus is used for wire-bonding at least a first chip and a second chip on a substrate at the same time. The wire-bonding apparatus includes at least a first capillary, a second capillary, a driving unit, a processing unit and a database. The driving unit is used for driving the first capillary and the second capillary. The processing unit is used for outputting a command to the driving unit to control the first capillary and the second capillary. The database is used for storing an operating parameter data. The processing unit controls the first capillary and the second capillary according to the operating parameter data.
    Type: Application
    Filed: December 28, 2006
    Publication date: February 14, 2008
    Inventors: Ho-Ming Tong, Kao-Ming Su, Chao-Fu Weng, Teck-Chong Lee, Chian-Chi Lin, Chia-Jung Tsai, Chih-Nan Wei, Song-Fu Yang
  • Publication number: 20080037374
    Abstract: A time display device, which is a strip-like member to be wrapped around user's body or other object, includes a flexible circuit board and a flexible case receiving the flexible circuit board therein. The flexible circuit board is provided with a controller and a plurality of hour light emitting devices and minute light emitting devices to indicate hour and minute and two light emitting devices to indicate a.m. and p.m. The case is provided with windows associated with the light emitting devices respectively. The controller controls the predetermined light emitting devices lighting to indicate time.
    Type: Application
    Filed: August 9, 2006
    Publication date: February 14, 2008
    Inventors: Chin-Lun Chu, Wen-Fu Yang, Shun-Ming Chang
  • Publication number: 20080022337
    Abstract: A web camera has a bracket, a camera module, and two connecting assemblies. The bracket has a front bracket and a rear bracket mounted pivotally to each other. The camera module is mounted pivotally in the bracket. The connecting assemblies are mounted respectively in two sides of the bracket to mount the front and rear brackets pivotally to each other and to mount the camera module pivotally in the bracket. Each connecting assembly has a torsion spring respectively connecting securely to the front and rear brackets to provide clamping force to the bracket. Therefore, the web camera can be clamped at a desired place.
    Type: Application
    Filed: September 12, 2006
    Publication date: January 24, 2008
    Inventor: Zai-Fu Yang
  • Publication number: 20080001672
    Abstract: An auto-range current mirror circuit has a current sensing circuit, a front and rear stage current mirrors each has an adjustable amplifying rate. The current sensing circuit presets a threshold current and has an input current of the front stage current mirror. The current sensing current compares the input current with a threshold current and then outputs a controlling signal to the front and rear stage current mirrors to adjust a suitable amplifying rate. Therefore, a bias current of the rear stage current mirror is amplified by the suitable amplifying rate to improve the quality of output current of the rear stage current mirror.
    Type: Application
    Filed: June 30, 2006
    Publication date: January 3, 2008
    Applicant: SILICON TOUCH TECHNOLOGY INC.
    Inventors: Fu-Yang Shih, Hsu-Yuan Chin
  • Publication number: 20070241822
    Abstract: A chain-chopping current mirror and a method for stabilizing output currents are disclosed. The current mirror includes multiple output nodes, a bias source unit, multiple current mirroring units and multiple switch components. The bias source unit provides a reference bias according to the received current. Each of the current mirroring units outputs an output current according to the reference bias. The control terminal of each the switch component receives a clock signal and determines whether the first terminal thereof is coupled with the second terminal or the third terminal thereof according to the clock signal, wherein the first terminal of the ith switch component is coupled with the output terminal of the ith current mirroring unit, the second terminal thereof is coupled with the ith output node and the third terminal thereof is coupled with the (i+1)th output node, where i is a natural number.
    Type: Application
    Filed: June 16, 2006
    Publication date: October 18, 2007
    Inventor: Fu-Yang Shih
  • Publication number: 20070119684
    Abstract: A bill acceptor used in a money exchanging machine is disclosed to include a bill box for collecting bills, and a bill receiving and verification unit, which has a bill slot for receiving bills, a first bill passage extending from the bill slot, a second bill passage extending from one end of the first bill passage remote from the bill slot, a conveyer for carrying each inserted bill from the bill slot through the first bill passage to the second bill passage and then pushing the bill into the bill box, and a sensor for detecting the presence of a bill in the bill box.
    Type: Application
    Filed: November 30, 2005
    Publication date: May 31, 2007
    Applicant: INTERNATIONAL CURRENCY TECHNOLOGIES CORPORATION
    Inventor: Wen-Fu Yang
  • Publication number: 20070068768
    Abstract: A detachable coin sorting mechanism and coin acceptor arrangement is disclosed to include a coin acceptor having a coin acceptor module for verifying the authenticity of each inserted coin and a track assembly for the mounting of the rail unit of a coin sorting mechanism to sort coins inserted into the coin acceptor. The track assembly has a positioning space, two sliding grooves at two sides of the positioning space, and a retaining notch at the front side of the positioning space between the sliding grooves. The rail unit of coin sorting mechanism has a locating block protruded from the top, two rails protruded from the locating block at two sides and respectively coupled to the sliding grooves of the coin acceptor, a hook plate protruded from the locating block and hooked on the retaining notch of the track assembly.
    Type: Application
    Filed: November 15, 2006
    Publication date: March 29, 2007
    Applicant: INTERNATIONAL CURRENCY TECHNOLOGIES CORPORATION
    Inventor: Wen-Fu Yang
  • Publication number: 20070052127
    Abstract: A method of making a silicon rubber product on a back thereof includes the steps of: providing RTV silicon rubber in a cavity of a mold, and then heating the RTV silicon rubber for vulcanization. The vulcanized is coated with primer to help it coupled with another silicon rubber. After that, HTV silicon rubber is put in the mold, and then hot molding process is applied on the mold to integrate the silicon rubbers as a single unit. The silicon rubber product made by the method of the present invention has no problem of “bleeding”. Furthermore, the silicon rubber product may be fabricated with fine pattern and multi-stage pattern.
    Type: Application
    Filed: August 31, 2006
    Publication date: March 8, 2007
    Inventors: Chin-Lun Chu, Wen-Fu Yang
  • Patent number: 7179874
    Abstract: A biodegradable cationic polymer is disclosed. The biodegradable cationic polymer of the invention has amino groups in the backbone and side chains, self-assembles cationic complexes with nucleic acids, and delivers nucleic acids into a cell by endocytosis. The biodegradable cationic polymer of the invention also has very low cytotoxicity. Methods of making and using the biodegradable cationic polymer are further disclosed.
    Type: Grant
    Filed: November 21, 2003
    Date of Patent: February 20, 2007
    Assignee: Chia Nan University of Pharmacy and Science
    Inventors: Min-Da Shau, Jong-Yuh Cherng, Tsung-Fu Yang, Wei-Kuo Chin
  • Publication number: 20060261203
    Abstract: The present invention relates to a two-way cable winding reel. The reel includes a housing, a rotator, a worm spring, and a cable. The rotator has several protrusions on one side, and the housing has a movable stopper. One end of the stopper forms a pawl that extends between any two of the protrusions. The pawl permits rotation of the rotator in a first direction to extend the cable when a sufficient pulling force is applied to the cable, and prevents rotation of the rotator in a cable retraction direction so long as the pawl extends between the protrusions. The other end of the stopper protrudes through the housing such that a user may engage or disengage the stopper to cause the pawl to disengage from the protrusions and permit retraction of the cable to a desired length.
    Type: Application
    Filed: May 20, 2005
    Publication date: November 23, 2006
    Applicant: KYE SYSTEMS CORP.
    Inventor: Zai-Fu Yang
  • Publication number: 20060261366
    Abstract: An integrated light-emitting device includes a substrate, a reflecting layer containing at least one reflector cup molded over the substrate to define a cup-shaped recess and having a reflective surface in the cup-shaped recess, a light-generating source mounted on the substrate within the cup-shaped recess, an encapsulating layer molded over the cup-shaped recess and the light-generating source, and a brightness enhancement prism film attached onto the encapsulating layer and patterned to form a plurality of prism structures.
    Type: Application
    Filed: September 7, 2005
    Publication date: November 23, 2006
    Inventor: Pi-Fu Yang
  • Publication number: 20060245602
    Abstract: The present invention provides an anti-pop circuit including a diode. A control signal is used to change the bias of the diode so as to shunt the “pop” sound usually happening when the power is turned on or off.
    Type: Application
    Filed: April 10, 2006
    Publication date: November 2, 2006
    Inventors: Cheng-Jan Chi, Hung-Yuan Li, Sheng-Neng Yu, Sheng-Fu Yang