Abstract: For molding semiconductor chips on a wiring substrate matrix with a sealing resin, the wiring substrate matrix is placed on a lower die cavity block of a lower die, and, thereafter, an upper die is brought down, whereby an outer peripheral portion of a cavity of the upper die comes into abutment against an outer peripheral portion of a main surface of the wiring substrate matrix, causing the substrate matrix to be deformed a sufficient extent to prevent resin leakage. Thereafter, block pins provided on the upper die push down the lower die cavity block. Thus, when clamping the wiring substrate matrix using both upper and lower dies, it is possible to suppress or prevent the application of excessive pressure to the wiring substrate matrix and to suppress or prevent deformation or cracking caused by crushing of the wiring substrate matrix. Consequently, the semiconductor device manufacturing yield can be improved.

Abstract: In connection with a memory card of a block molding type there is provided a method able to prevent the occurrence of a chip crack in transfer molding. The method includes a first step wherein a substrate having plural chips constituting plural memory cards and mounted on a surface of the substrate and further having connecting terminals in recesses formed on a substrate surface opposite to the chips-mounted surface is sandwiched between a first die (upper die) installed on the chips-mounted surface side and a second die (lower die) installed on the surface side where the connecting terminal are formed. The method further includes a second step of injecting sealing resin between the first die and the substrate to seal at a time the plural chips mounted on the substrate. Projecting portions (terminal supporting elements) projecting from the surrounding portion are formed in regions of the second die which regions are positioned just under the connecting terminals.

Abstract: At the time of performing resin molding for a matrix frame in the fabrication of semiconductor integrated circuit devices, a predetermined amount of air is fed into each of first cavities in a first row and second cavities in a second row, the first and second cavities being formed in a matrix arrangement in a lower mold of a molding die, so as to pressurize the interiors of the cavities, and a sealing resin is charged into the cavities, while the pressure therein is regulated in such a manner that the charging speeds of the sealing resin become equal in all of the cavities, whereby it is possible to stabilize the quality of the product being obtained.

Abstract: A method of fabricating a semiconductor integrated circuit device uses a mold which is provided with a plurality of air vents and movable pins which are formed such that the movable pins include grooves in the distal ends thereof which project into the air vents. By clamping the mold in a state such that the distal ends of the movable pins are pushed against a multi-cavity board at the time of clamping the mold, resin can be filled while leaking air inside the cavity through the grooves formed in the distal ends of the movable pins by setting the depths of the respective air vents to a fixed value irrespective of the irregularities in thickness of the multi-cavity boards. Accordingly, it is possible to prevent insufficient filling of resin in the cavity, the leaking of resin or defective welding, whereby the yield rate of products can be enhanced.

Abstract: A method of fabricating a semiconductor integrated circuit device uses a mold which is provided with a plurality of air vents and movable pins which are formed such that the movable pins include grooves in the distal ends thereof which project into the air vents. By clamping the mold in a state such that the distal ends of the movable pins are pushed against a multi-cavity board at the time of clamping the mold, resin can be filled while leaking air inside the cavity through the grooves formed in the distal ends of the movable pins by setting the depths of the respective air vents to a fixed value irrespective of the irregularities in thickness of the multi-cavity boards. Accordingly, it is possible to prevent insufficient filling of resin in the cavity, the leaking of resin or defective welding, whereby the yield rate of products can be enhanced.

Abstract: The delivery times of semiconductor devices are shortened. The upper die of a mold is provided with an opening which runs from the outside surface of the upper die to the cavity. A movable cavity piece is installed by fitting the movable cavity piece into the opening so that the movable cavity piece can be moved up and down. In the molding process, the height of the lower face of the movable cavity piece is adjusted in accordance with the thickness of a blanket sealing body, and then sealing resin is injected into the cavity. Thus, a change in the thickness of the blanket sealing body can be easily coped with in a short time. After molding, the movable cavity piece is moved up and separated from the blanket sealing body, and thereby mold release is carried out.

Abstract: For molding semiconductor chips on a wiring substrate matrix with a sealing resin, the wiring substrate matrix is placed on a lower die cavity block of a lower die, and, thereafter, an upper die is brought down, whereby an outer peripheral portion of a cavity of the upper die comes into abutment against an outer peripheral portion of a main surface of the wiring substrate matrix, causing the substrate matrix to be deformed a sufficient extent to prevent resin leakage. Thereafter, block pins provided on the upper die push down the lower die cavity block. Thus, when clamping the wiring substrate matrix using both upper and lower dies, it is possible to suppress or prevent the application of excessive pressure to the wiring substrate matrix and to suppress or prevent deformation or cracking caused by crushing of the wiring substrate matrix. Consequently, the semiconductor device manufacturing yield can be improved.

Abstract: At the time of performing resin molding for a matrix frame in the fabrication of semiconductor integrated circuit devices, a predetermined amount of air is fed into each of first cavities in a first row and second cavities in a second row, the first and second cavities being formed in a matrix arrangement in a lower mold of a molding die, so as to pressurize the interiors of the cavities, and a sealing resin is charged into the cavities, while the pressure therein is regulated in such a manner that the charging speeds of the sealing resin become equal in all of the cavities, whereby it is possible to stabilize the quality of the product being obtained.

Abstract: At the time of performing resin molding for a matrix frame in the fabrication of semiconductor integrated circuit devices, a predetermined amount of air is fed into each of first cavities in a first row and second cavities in a second row, the first and second cavities being formed in a matrix arrangement in a lower mold of a molding die, so as to pressurize the interiors of the cavities, and a sealing resin is charged into the cavities, while the pressure therein is regulated in such a manner that the charging speeds of the sealing resin become equal in all of the cavities, whereby it is possible to stabilize the quality of the product being obtained.

Abstract: A fabricating method of a semiconductor integrated circuit device uses a mold which is provided with a plurality of air vents and movable pins which are formed such that the movable pins include grooves in distal ends thereof and project into the air vents. By clamping the mold in a state that the distal ends of the movable pins are pushed to a multi-cavity board at the time of clamping the mold, resin can be filled while leaking air inside the cavity through the grooves formed in the distal ends of the movable pins by setting the depths of the respective air vents to a fixed value irrespective of the irregularities of thicknesses of multi-cavity boards. Accordingly, it is possible to prevent the occurrence of insufficient filling of resin in the cavity, the occurrence of leaking of resin or defective welding whereby a yield rate of products can be enhanced.

Abstract: At the time of performing a resin molding for a matrix frame in the fabrication of a semiconductor integrated circuit device, a predetermined amount of air is fed into each of first cavities in a first row and second cavities in a second row, the first and second cavities being formed in a matrix arrangement in a lower mold of a molding die, to pressurize the interiors of the cavities, and a sealing resin is charged into the cavities in such a manner that the charging speeds of the sealing resin become equal in all of the cavities, whereby it is possible to stabilize the quality of product obtained.

Abstract: To improve the coupling adjustment workability and precision of a rotor, irrespective of change in bearing characteristics due to an increase of rotational speed, the apparatus detects angular frequencies (.omega.) and reference mark positions (.theta.) of the rotor; detects vibration displacements (r) of the rotor; analyzes vibration vector components (.omega.), (r) and (.theta.) of rotation synchronizing vibrations; extracts a specific angular frequency (.omega..sub.1) at which a higher harmonic vibration frequency (.omega..sub.R) matches a natural frequency of the rotor, and various rotation synchronizing vibration vector components at (.omega..sub.1), at (.omega..sub.R) and (.omega..sub.2 to .omega..sub.i), respectively; estimates static vibration vector components (r.sub.0, .theta..sub.0) at zero angular frequency (.omega..sub.0) on the basis of rotation synchronizing vibration vector components (r.sub.T, .theta..sub.T) at (.omega..sub.1 to .omega..sub.

Abstract: The vibration measuring apparatus of a rotating shaft is made up of a pair of projection groups provided radial directions of the shaft with spacings therebetween and having the same height, a source of measuring light for irradiating the projection groups, a light receiving element for receiving the measuring light reflected by the projection groups, and a calculating device for calculating a peripheral speed difference between the two projection groups spaced in the axial direction of the rotating shaft.