Abstract: A solid-state imaging apparatus of the present invention includes a structure formed of an insulating resin and having a through-aperture, a wiring pattern formed on the surface of the structure, a solid-state image pickup element connected to the wiring pattern and fitted to the structure to cover the through-aperture, and a light transmitting member fitted to the structure to be opposite to the solid-state image pickup element and to cover the through-aperture, and which further comprises, in the light transmitting member fitting area where the light transmitting member is fitted to the structure, a through-groove that communicates with the through-aperture.

Abstract: A variable capacitor for a high frequency circuit of an electrical appliance includes a chip capacitor mounted on a multilayer circuit board and interdigital capacitors formed at inner layers of the circuit board. A wiring pattern for soldering the chip capacitor is connected with the interdigital capacitors via through holes formed in the circuit board. Capacitance select portions are cut so that the capacitance best-suited to the circuit is obtained. The through holes connected to the interdigital capacitors of the inner layer are selectively disconnected from the wiring pattern for soldering the chip capacitor, thereby obtaining a variable capacitor capable of absorbing fluctuations of the circuit for selecting the best-suited capacitance.