Patents by Inventor Fuminori Tanaka
Fuminori Tanaka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20200319720Abstract: An input device includes an optical sensor which senses an object on a plane where the emitted light travels, an optical member which changes a path of the light emitted from the optical sensor, and a processing unit which performs input processing based on sensing results of the optical sensor; the optical sensor and the optical member form a first sensing surface consisting of a planar region in which the light emitted from the optical sensor travels and a second sensing surface that is farther from the optical sensor than the first sensing surface, and the processing unit performs the input processing based on a first sensing result of the optical sensor on the first sensing surface and a second sensing result of the optical sensor on the second sensing surface.Type: ApplicationFiled: March 17, 2020Publication date: October 8, 2020Applicant: FUNAI ELECTRIC CO., LTD.Inventors: MANABU MURAYAMA, TATSUYA ITO, FUMINORI TANAKA, KAZUYA SUDO
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Patent number: 10605923Abstract: Provided a reflecting device in which a mirror area is large, wide angle scanning is possible, and a size thereof is reduced, and particularly a downsized reflecting device that has a suitable specification as vehicle-mounted LiDAR. The reflecting device includes an oscillation part, and the oscillation part includes a mirror part supported on a support frame, and a hinge part engaging the mirror part and the support frame. The mirror part oscillates with respect to the support frame, and the hinge part has a tensile strength of 1500 MPa or higher. A mass M of the mirror part and a resonance frequency f0 of the oscillation part satisfy a relational expression (1) below, 0.49*f0+6.23?M?68.6*f0+46.Type: GrantFiled: March 5, 2018Date of Patent: March 31, 2020Assignee: FUNAI ELECTRIC CO., LTD.Inventor: Fuminori Tanaka
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Publication number: 20190179160Abstract: An aerial image display device includes a display component, an imaging component, and a first limiter. The display component has a display surface for displaying an image. The imaging component has a first reflecting surface and a second reflecting surface that are arranged perpendicular to each other along an image formation plane of the imaging component. The imaging component forms an aerial image of the image in a display area that is symmetrical with the display surface with respect to the image formation plane. The first limiter is disposed closer to the display component than the imaging component. The first limiter limits an incident angle of incident light incident on the imaging component. The first reflection surface and the second reflection surface are inclined by an angle between 30° and 60° with respect to a median plane that includes a perpendicular of each of the display surface and the image formation plane.Type: ApplicationFiled: October 30, 2018Publication date: June 13, 2019Inventors: Tatsuya Ito, Fuminori Tanaka
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Publication number: 20180252816Abstract: Provided a reflecting device in which a mirror area is large, wide angle scanning is possible, and a size thereof is reduced, and particularly a downsized reflecting device that has a suitable specification as vehicle-mounted LiDAR. The reflecting device includes an oscillation part, and the oscillation part includes a mirror part supported on a support frame, and a hinge part engaging the mirror part and the support frame. The mirror part oscillates with respect to the support frame, and the hinge part has a tensile strength of 1500 MPa or higher. A mass M of the mirror part and a resonance frequency f0 of the oscillation part satisfy a relational expression (1) below, 0.49*f0+6.23?M?68.6*f0+46.Type: ApplicationFiled: March 5, 2018Publication date: September 6, 2018Applicant: FUNAI ELECTRIC CO., LTD.Inventor: Fuminori TANAKA
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Patent number: 9971152Abstract: A projector includes a light source portion that emits laser light, a first reflection portion that is swingable and reflects the laser light from the light source portion, and a second reflection portion that is swingable and reflects the laser light from the first reflection portion. The laser light from the light source portion passes through an opening provided near the second reflection portion and is irradiated to the first reflection portion.Type: GrantFiled: November 7, 2016Date of Patent: May 15, 2018Assignee: FUNAI ELECTRIC CO., LTD.Inventor: Fuminori Tanaka
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Publication number: 20170257611Abstract: An oscillating mirror element includes a mirror portion, a drive portion that drives the mirror portion, a strain sensor capable of detecting an amount of displacement of the mirror portion, and a base including a mirror beam portion provided with the mirror portion, a sensor beam portion provided with the strain sensor, and a body portion that supports the mirror beam portion and the sensor beam portion and is provided with the drive portion.Type: ApplicationFiled: February 28, 2017Publication date: September 7, 2017Inventors: Fuminori TANAKA, Takeshi INODA, Ken NISHIOKA, Jun AKEDO
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Publication number: 20170131549Abstract: A projector includes a light source portion that emits laser light, a first reflection portion that is swingable and reflects the laser light from the light source portion, and a second reflection portion that is swingable and reflects the laser light from the first reflection portion. The laser light from the light source portion passes through an opening provided near the second reflection portion and is irradiated to the first reflection portion.Type: ApplicationFiled: November 7, 2016Publication date: May 11, 2017Inventor: Fuminori TANAKA
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Patent number: 9363595Abstract: A microphone unit includes first and second diaphragms; a substrate on a top surface of which are installed the first and second diaphragms; and a cover disposed covering the first and second diaphragms, the cover joined to an outside edge of the substrate and forming an internal space. There are formed in the substrate first and second openings that are formed respectively in the top and bottom surfaces of the substrate, and an internal sound path communicating from the first opening to the second opening. The first diaphragm is disposed on the substrate so as to cover and hide the first opening. The second diaphragm is disposed so as to seal off a partial region away from the first opening of the top surface of the substrate. A third opening is formed in the cover, and the internal space communicates to an outside space via the third opening.Type: GrantFiled: June 22, 2012Date of Patent: June 7, 2016Assignee: FUNAI ELECTRIC CO., LTD.Inventors: Ryusuke Horibe, Tomohiro Taniguchi, Fuminori Tanaka, Takeshi Inoda
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Patent number: 9357313Abstract: A microphone unit includes a microphone substrate. A plurality of diaphragm units are disposed on the microphone substrate. Each of the diaphragm units includes a diaphragm. A plurality of partition walls are disposed on the microphone substrate. Each of the partition walls surrounds the diaphragm so as to define a first area. A signal processor is disposed at a second area outside the first area and is configured to process signals output from the diaphragm units.Type: GrantFiled: April 15, 2009Date of Patent: May 31, 2016Assignee: Funai Electric Co., Ltd.Inventors: Fuminori Tanaka, Ryusuke Horibe, Takeshi Inoda, Rikuo Takano, Kiyoshi Sugiyama, Toshimi Fukuoka, Masatoshi Ono
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Patent number: 9351062Abstract: A microphone unit (1) is provided with an electro-acoustic transducer (13) which converts acoustic signals into electric signals on the basis of the oscillation of a diaphragm (134), and a housing (10) which contains the electro-acoustic transducer (13). The housing (10) is provided with: a first sound conduction space (SP1) that guides sound waves from the outside to one side of the diaphragm (134) via at least one first aperture (18) formed on the exterior of the housing (10); and a second sound conduction space (SP2) that guides sound waves from the outside to the other side of the diaphragm (134) via at least one second aperture (19) formed on the exterior of the housing (10). The total square area of at least one first aperture (18) and the total square area of at least one second aperture (19) are not the same.Type: GrantFiled: July 14, 2011Date of Patent: May 24, 2016Assignee: Funai Electric Co., Ltd.Inventors: Takeshi Inoda, Ryusuke Horibe, Fuminori Tanaka, Shuji Umeda
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Patent number: 9200742Abstract: A lateral pipe-lining method for lining a lateral pipe that intersects a main pipe. A lateral pipe-lining material has a tubular resin-absorbing material impregnated with a curable resin and has a flange formed at one end thereof. The flange is disposed on an expandable flange-pressing implement. The expandable flange-pressing implement is expanded using a heat medium that is supplied by a first fluid source and that heats the flange of the lateral pipe-lining material to bring the flange into contact with a periphery of a lateral pipe opening of the main pipe. The lateral pipe-lining material is inserted into the lateral pipe using a fluid from a second fluid source different from the first fluid source, and the curable resin impregnated in the tubular resin-absorbing material is cured to line the lateral pipe.Type: GrantFiled: April 12, 2010Date of Patent: December 1, 2015Assignee: SHONAN GOSEI-JUSHI SEISAKUSHO K.K.Inventors: Takao Kamiyama, Koji Kaneta, Kenji Fujii, Fuminori Tanaka
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Patent number: 9025794Abstract: An integrated circuit device includes a circuit board (1200?), the circuit board including a first diaphragm (714-1) that forms a first microphone, a second diaphragm (714-2) that forms a second microphone, and a differential signal generation circuit (720) that receives a first voltage signal obtained by the first microphone and a second voltage signal obtained by the second microphone, and generates a differential signal that indicates a difference between the first voltage signal and the second voltage signal.Type: GrantFiled: November 21, 2007Date of Patent: May 5, 2015Assignee: Funai Electric Co., Ltd.Inventors: Rikuo Takano, Kiyoshi Sugiyama, Toshimi Fukuoka, Masatoshi Ono, Ryusuke Horibe, Shigeo Maeda, Fuminori Tanaka, Takeshi Inoda, Hideki Choji
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Patent number: 8989422Abstract: A microphone unit (1) comprises a first vibrating part (14), a second vibrating part (15), and a housing (20) for accommodating the first vibrating part (14) and the second vibrating part (15), the housing being provided with a first sound hole (132), a second sound hole (101), and a third sound hole (133). The housing (20) is provided with a first sound path (41) for transmitting sound pressure inputted from the first sound hole (132) to one surface (142a) of a first diaphragm (142) and to one surface (152a) of a second diaphragm (152), a second sound path (42) for transmitting sound pressure inputted from the second sound hole (101) to the other surface (142b) of the first diaphragm (142), and a third sound path (43) for transmitting sound pressure inputted from the third sound hole (133) to the other surface (152b) of the second diaphragm (152).Type: GrantFiled: January 17, 2011Date of Patent: March 24, 2015Assignee: Funai Electric Co., Ltd.Inventors: Fuminori Tanaka, Ryusuke Horibe, Shuji Umeda, Takeshi Inoda
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Patent number: 8948432Abstract: A microphone unit includes a case; a diaphragm arranged inside the case; and an electric circuit unit that processes an electric signal generated in accordance with vibration of the diaphragm. The case has a first sound introducing space that introduces a sound from outside of the case to a first surface of the diaphragm via a first sound hole; and a second sound introducing space that introduces a sound from outside of the case to a second diaphragm, via a second sound hole. A resonance frequency of the diaphragm is set in the range of ±4 kHz based on the resonance frequency of at least one of the first sound introducing space and the second sound introducing space.Type: GrantFiled: December 4, 2009Date of Patent: February 3, 2015Assignees: Funai Electric Co., Ltd., Funai Electric Advanced Applied Technology Research Institute Inc.Inventors: Fuminori Tanaka, Ryusuke Horibe, Takeshi Inoda, Masatoshi Ono, Rikuo Takano, Toshimi Fukuoka
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Patent number: 8861764Abstract: An enclosure (10) of a microphone unit (1) includes a mounting portion (11) which has a mounting surface (11a) where a first vibration portion (13) and a second vibration portion (15) are mounted and in which, in the back surface (11b) of the mounting surface (11a), a first sound hole (23) and a second sound hole (25) are provided; in the enclosure (10), a first sound path (41) is provided that transmits sound waves input through the first sound hole (23) to one surface of a first diaphragm (134) and that also transmits the sound waves to one surface of a second diaphragm (154) and a second sound path (42) is provided that transmits sound waves input through the second sound hole to the other surface of the second diaphragm (154).Type: GrantFiled: May 27, 2011Date of Patent: October 14, 2014Assignee: Funai Electric Co., Ltd.Inventors: Fuminori Tanaka, Takeshi Inoda, Ryusuke Horibe
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Publication number: 20140301592Abstract: An ear pad that is an elastic member and fitted over a protrusion on an earphone device includes a main body having a hollow in which the protrusion fits, wherein the main body has, at an end, a surface having an opening communicating with the hollow, and the surface has a recess formed in a radial direction from a center of the surface toward an outside of the main body.Type: ApplicationFiled: March 28, 2014Publication date: October 9, 2014Applicant: FUNAI ELECTRIC CO., LTD.Inventor: Fuminori TANAKA
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Patent number: 8824698Abstract: There is provided an integrated circuit device having a wiring board 1200?, the wiring board 1200? including: a first vibrating membrane 714-1 which forms a first microphone; a second vibrating membrane 714-2 which forms a second microphone; and a differential signal generating circuit 720 which receives a first voltage signal obtained in the first microphone and a second voltage signal obtained in the second microphone and generates a differential signal indicating a difference between the first and second voltage signals, and a voice input device and an information processing system including the same. Accordingly, it is possible to realize a voice input element having a small size and a noise removal function with high accuracy.Type: GrantFiled: May 20, 2009Date of Patent: September 2, 2014Assignees: Funai Electric Advanced Applied Technology Research Institute Inc., Funai Electric Co., Ltd.Inventors: Rikuo Takano, Kiyoshi Sugiyama, Toshimi Fukuoka, Masatoshi Ono, Ryusuke Horibe, Fuminori Tanaka, Takeshi Inoda
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Patent number: 8824719Abstract: A microphone unit (1) comprises a first vibrating part (14), a second vibrating part (15), and a case (10) for accommodating the first vibrating part (14) and the second vibrating part (15), the case being provided with a first sound hole (132) and a second sound hole (133). The case (10) is provided with a first sound channel (41) for transmitting acoustic pressure inputted from the first sound hole (132) to one surface (142a) of a first diaphragm (142) and to one surface (152a) of a second diaphragm (152), a second sound channel (42) for transmitting acoustic pressure inputted from the second sound hole (133) to the other surface (152b) of the second diaphragm (152), and a sealed space (S) that faces the other surface (142b) of the first diaphragm (142).Type: GrantFiled: December 22, 2010Date of Patent: September 2, 2014Assignee: Funai Electric Co., Ltd.Inventors: Fuminori Tanaka, Ryusuke Horibe, Shuji Umeda, Takeshi Inoda
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Patent number: 8823115Abstract: A microphone unit converts voice into an electric signal based on the vibration of a diaphragm contained in an MEMS chip. The microphone unit includes a substrate on which the diaphragm is mounted (the MEMS chip is mounted); a cover member, having sound holes, that is disposed above the substrate so that the diaphragm is contained within the inner space formed between the cover member and the substrate; and a holding member that holds only the substrate or both of the substrate and the cover member.Type: GrantFiled: December 10, 2009Date of Patent: September 2, 2014Assignee: Funai Electric Co., Ltd.Inventors: Takeshi Inoda, Ryusuke Horibe, Fuminori Tanaka, Akira Funatsu, Michitomo Shibutani
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Patent number: 8818010Abstract: Disclosed is a microphone unit comprising a film substrate (1), electrically conductive layers (15, 16) which are formed on both substrate surfaces of the film substrate (11), and an electrical acoustic transducer unit (12) which is provided on the film substrate (11) and comprises a diaphragm capable of converting a sound pressure to an electrical signal. In the microphone unit, the linear expansion coefficient of the film substrate (11), including the electrically conductive layers (15, 16), falls within the range of 0.8 to 2.5 times, inclusive, the linear expansion coefficient of the diaphragm.Type: GrantFiled: January 20, 2010Date of Patent: August 26, 2014Assignee: Funai Electric Co., Ltd.Inventors: Takeshi Inoda, Ryusuke Horibe, Fuminori Tanaka, Tomio Ishida