Abstract: A surface mount device-type low-profile oscillator is provided. A main surface of an IC chip unit is joined to a bottom surface where the external terminals of a crystal unit section are formed. An integrated circuit portion includes a circuit forming, together with the crystal unit of the crystal unit section, an oscillator circuit on the main surface of the IC chip unit, and IC terminals formed with a plurality of IC electrode terminals, and two connection terminals connecting the external terminals of the crystal unit section are provided. The IC electrode terminals and mounting terminals are electrically connected with electrical columns provided in via holes penetrating in the direction of thickness of a silicon plate of a bare chip. The crystal unit section and the IC chip unit are joined with an anisotropic conductive adhesive applied to the main surface of the IC chip unit.

Abstract: An oscillator according to the disclosure includes a crystal unit, an IC chip, an adhesive agent flow prevention film, and a lead frame. The lead frame is disposed in a peripheral area of the pair of crystal terminals and the IC chip in an approximately same surface as the one surface of the flat container of the crystal unit. The lead frame includes a wiring part that is connected to an IC terminal of the IC chip by a bonding wire and is buried in the resin mold, and a mounting terminal forming portion that extends from the wiring part and is folded along an outside of the resin mold in a back surface that is another surface side opposite to the one surface of the crystal unit so as to form a mounting terminal.

Abstract: A crystal controlled oscillator includes a crystal package and an IC chip board that includes an IC chip integrating an oscillator circuit. The crystal package includes a first container, a crystal resonator, a lid body, and an external terminal at an outer bottom surface of the first bottom wall layer of the first container. The IC chip integrates an oscillator circuit disposed at an outer bottom surface of the first bottom wall layer of the crystal package. The oscillator circuit connects to the lower side excitation electrode of the crystal resonator from the external terminal to an input side with high impedance. The oscillator circuit connects to the upper side excitation electrode to an output side with low impedance. The upper side excitation electrode is a shielding electrode of the crystal resonator.

Abstract: A crystal oscillator is configured by accommodating a crystal blank that functions as a crystal unit and an IC chip that includes at least an oscillator circuit using the crystal blank into a container in an integrated manner. In the IC chip, the oscillator circuit is connected to the crystal unit via a pair of crystal connecting terminals, an output from the oscillator circuit is supplied to a plurality of output buffers. In relation to the crystal connecting terminal having a phase opposite to that of an output from the on/off controllable output buffer, an output terminal of this output buffer is disposed farther than an output terminal of the output buffer that is not subjected to the on/off control.

Abstract: An oscillator according to the disclosure includes a crystal unit, an IC chip, an adhesive agent flow prevention film, and a lead frame. The lead frame is disposed in a peripheral area of the pair of crystal terminals and the IC chip in an approximately same surface as the one surface of the flat container of the crystal unit. The lead frame includes a wiring part that is connected to an IC terminal of the IC chip by a bonding wire and is buried in the resin mold, and a mounting terminal forming portion that extends from the wiring part and is folded along an outside of the resin mold in a back surface that is another surface side opposite to the one surface of the crystal unit so as to form a mounting terminal.

Abstract: A crystal oscillator is configured by accommodating a crystal blank that functions as a crystal unit and an IC chip that includes at least an oscillator circuit using the crystal blank into a container in an integrated manner. In the IC chip, the oscillator circuit is connected to the crystal unit via a pair of crystal connecting terminals, an output from the oscillator circuit is supplied to a plurality of output buffers. In relation to the crystal connecting terminal having a phase opposite to that of an output from the on/off controllable output buffer, an output terminal of this output buffer is disposed farther than an output terminal of the output buffer that is not subjected to the on/off control.

Abstract: A piezoelectric module includes a piezoelectric package and a circuit component package. The piezoelectric module includes a thermoset resin with solder particles interposed between a whole circumference of the opening end surface of the second depressed portion including the plurality of connecting terminals of the circuit component package and the outer bottom surface of the first depressed portion of the piezoelectric package. The plurality of external terminals of the piezoelectric package and the plurality of connecting terminals of the circuit component package are electrically connected by metal bonding. The whole circumference of the opening end surface of the second depressed portion of the circuit component package and the outer bottom surface of the first depressed portion of the piezoelectric package are bonded by melting and hardening of the thermoset resin that constitutes the thermoset resin with solder particles.

Abstract: A temperature-compensated crystal oscillator includes a crystal resonator; and an oscillator circuit for performing temperature compensation.

Abstract: A surface mount device-type low-profile oscillator is provided. A main surface of an IC chip unit is joined to a bottom surface where the external terminals of a crystal unit section are formed. An integrated circuit portion includes a circuit forming, together with the crystal unit of the crystal unit section, an oscillator circuit on the main surface of the IC chip unit, and IC terminals formed with a plurality of IC electrode terminals, and two connection terminals connecting the external terminals of the crystal unit section are provided. The IC electrode terminals and mounting terminals are electrically connected with electrical columns provided in via holes penetrating in the direction of thickness of a silicon plate of a bare chip. The crystal unit section and the IC chip unit are joined with an anisotropic conductive adhesive applied to the main surface of the IC chip unit.

Abstract: A crystal oscillator with improved tolerance to radiation such as X-rays includes: a container body; a quartz crystal blank accommodated in a first recess formed on one main surface of the container body and hermetically encapsulated in the first recess by a metal cover; and an IC chip that integrates electronic circuits including at least an oscillator circuit using the crystal blank and is accommodated in the second recess formed on the other main surface of the container body. The IC chip is fixed to the bottom surface of the second recess by flip-chip bonding such that a circuit formation plane of the IC chip is opposed to the bottom surface of the second recess. A radiation protective film is formed on the main surface other than the circuit formation plane of the IC chip.

Abstract: A temperature-controlled crystal oscillating unit and oscillator are provided, which can stabilize an output frequency thereof, have firmness against shock of falling etc., and are suitable for miniaturization and mass production. A crystal blank for the temperature-controlled crystal oscillating unit is formed by an inner region which is an oscillating plate; an outer region which surrounds the periphery of the inner region; and a connection portion which connects the inner region with the outer region. Electrodes are formed on two surfaces of the inner region, and a heater and a temperature sensor are disposed to surround the periphery of the electrode on one surface of the inner region where the electrode is formed thereon. The electrodes, the heater and the temperature sensor are respectively connected with terminals on the outer region by leads. A contact area between the temperature sensor and a crystal is increased.

Abstract: A crystal controlled oscillator includes a crystal package and an IC chip board that includes an IC chip integrating an oscillator circuit. The crystal package includes a first container, a crystal resonator, a lid body, and an external terminal at an outer bottom surface of the first bottom wall layer of the first container. The IC chip integrates an oscillator circuit disposed at an outer bottom surface of the first bottom wall layer of the crystal package. The oscillator circuit connects to the lower side excitation electrode of the crystal resonator from the external terminal to an input side with high impedance. The oscillator circuit connects to the upper side excitation electrode to an output side with low impedance. The upper side excitation electrode is a shielding electrode of the crystal resonator.

Abstract: Provided is an oscillator using an MEMS resonator, which can reduce an influence of noise of a TIA and improve phase noise characteristics of an oscillator output. The oscillator includes an MEMS resonator, a TIA, a buffer amplifier, and a current/voltage converter that couples, by electromagnetic induction, with a wiring line via which an output of the MEMS resonator is fed to the TIA, so as to convert a current flowing in the wiring line to a voltage and output the voltage to the buffer amplifier. Thus, the oscillator output is extracted from the current/voltage converter. Further, the current/voltage converter is provided in the form of an oscillation output coil provided so as to surround the wiring line in a noncontact manner, in which oscillation output coil one end is connected to ground and the other end is connected to the buffer amplifier.

Abstract: A temperature-compensated crystal oscillator includes a crystal resonator; and an oscillator circuit for performing temperature compensation.

Abstract: A crystal oscillator is configured by accommodating a crystal blank that functions as a crystal unit and an IC chip that includes at least an oscillator circuit using the crystal blank into a container in an integrated manner. In the IC chip, the oscillator circuit is connected to the crystal unit via a pair of crystal connecting terminals, an output from the oscillator circuit is supplied to a plurality of output buffers. In relation to the crystal connecting terminal having a phase opposite to that of an output from the on/off controllable output buffer, an output terminal of this output buffer is disposed farther than an output terminal of the output buffer that is not subjected to the on/off control.

Abstract: A crystal oscillator with improved tolerance to radiation such as X-rays includes: a container body; a quartz crystal blank accommodated in a first recess formed on one main surface of the container body and hermetically encapsulated in the first recess by a metal cover; and an IC chip that integrates electronic circuits including at least an oscillator circuit using the crystal blank and is accommodated in the second recess formed on the other main surface of the container body. The IC chip is fixed to the bottom surface of the second recess by flip-chip bonding such that a circuit formation plane of the IC chip is opposed to the bottom surface of the second recess. A radiation protective film is formed on the main surface other than the circuit formation plane of the IC chip.

Abstract: A temperature-controlled crystal oscillating unit and oscillator are provided, which can stabilize an output frequency thereof, have firmness against shock of falling etc., and are suitable for miniaturization and mass production. A crystal blank for the temperature-controlled crystal oscillating unit is formed by an inner region which is an oscillating plate; an outer region which surrounds the periphery of the inner region; and a connection portion which connects the inner region with the outer region. Electrodes are formed on two surfaces of the inner region, and a heater and a temperature sensor are disposed to surround the periphery of the electrode on one surface of the inner region where the electrode is formed thereon. The electrodes, the heater and the temperature sensor are respectively connected with terminals on the outer region by leads. A contact area between the temperature sensor and a crystal is increased.

Abstract: Provided is an oscillator using an MEMS resonator, which can reduce an influence of noise of a TIA and improve phase noise characteristics of an oscillator output. The oscillator includes an MEMS resonator, a TIA, a buffer amplifier, and a current/voltage converter that couples, by electromagnetic induction, with a wiring line via which an output of the MEMS resonator is fed to the TIA, so as to convert a current flowing in the wiring line to a voltage and output the voltage to the buffer amplifier. Thus, the oscillator output is extracted from the current/voltage converter. Further, the current/voltage converter is provided in the form of an oscillation output coil provided so as to surround the wiring line in a noncontact manner, in which oscillation output coil one end is connected to ground and the other end is connected to the buffer amplifier.

Abstract: A crystal oscillator in which a temperature characteristic of an oscillation frequency is improved to omit a measurement operation of the temperature characteristic of the oscillator, and manufacturing is facilitated to reduce a manufacturing time. In the crystal oscillator, a power voltage is applied to a collector of a transistor via series connection of an inductor for resonance and a resistance, a crystal unit is disposed in a loop which returns to an emitter of the transistor from a point between the inductor L4 and the resistance, and further, in the loop, a first parallel circuit in which a stationary capacitor having a negative temperature coefficient and a stationary capacitor having a zero temperature coefficient are connected in parallel with each other is inserted between an oscillation output taking point and the collector.

Abstract: A harmonic oscillator comprises a transmission line resonator in which an oscillation frequency depends on an electrical length of a transmission line and both ends of the transmission line are electrical open ends; an active element for oscillation as a negative resistance connecting to the transmission line resonator; an output line connected to a midpoint portion of the transmission line resonator; and electrical and/or physical suppressing means for suppressing a voltage displacement distribution of second harmonic among the even-order harmonics. The suppressing means is provided at a position which is at least a minimum voltage displacement portion for the second harmonic between the midpoint portion and either ends of the transmission line resonator.