Abstract: An analyzer which analyzes an analyte by using the analyte and consumables, the analyzer comprising: an automatic reading device which reads a first product information related to a consumable via an identifier given to the consumable or a container containing the consumable; and a controller which permits an analysis operation when the first product information is suitable information read by the automatic reading device via the identifier, and prompts an operator to manually enter a second product information comprising information specifying the manufacturer or seller of the consumable when the automatic reading device cannot read the identifier or the information read via the identifier is not suitable as the first product information and permits the analysis operation and storage of the input second product information when the operator has entered the second product information.

Abstract: An analyzer which analyzes an analyte by using the analyte and consumables, the analyzer comprising: an automatic reading device which reads a first product information related to a consumable via an identifier given to the consumable or a container containing the consumable; and a controller which permits an analysis operation when the first product information is suitable information read by the automatic reading device via the identifier, and prompts an operator to manually enter a second product information comprising information specifying the manufacturer or seller of the consumable when the automatic reading device cannot read the identifier or the information read via the identifier is not suitable as the first product information and permits the analysis operation and storage of the input second product information when the operator has entered the second product information.

Abstract: An analyzer which analyzes an analyte by using the analyte and consumables, the analyzer comprising: an automatic reading device which reads a first product information related to a consumable via an identifier given to the consumable or a container containing the consumable; and a controller which permits an analysis operation when the first product information is suitable information read by the automatic reading device via the identifier, and prompts an operator to manually enter a second product information comprising information specifying the manufacturer or seller of the consumable when the automatic reading device cannot read the identifier or the information read via the identifier is not suitable as the first product information and permits the analysis operation and storage of the input second product information when the operator has entered the second product information.

Abstract: Disclosed is a manufacturing method of a multi-layer wiring board, which method includes: preparing connection boards, the connection boards having respectively an insulating resin composition layer, a connection conductor formed so as to pass through the insulating resin composition layer and a conductor circuit formed on the insulating resin composition layer and connected to the connection conductor; aligning the connection boards; and laminating the aligned connection boards by heating and pressing, so that the connection conductors, or the connection conductor and the conductor circuit, are conductively connected with each other, and the connection boards are mechanically connected with each other by the insulating resin composition layer. The connection boards are formed by specified processing, including use of a three-layer composite metallic layer.

Abstract: An object of the present invention is to provide a copper surface treatment method capable of keeping certainly a bonding strength between a copper surface and a resist, or between a copper surface and an insulating resin without forming irregularities having sizes of more than 1 ?m on the copper surface, and a copper treated with the method. The surface treatment method, comprising: a first step of forming, on a copper surface, a nobler metal than the copper discretely; a second step, subsequent to the first step, of forming copper oxide on the copper surface by oxidation with an alkaline solution containing an oxidizing agent; and third step of dissolving the copper oxide so as to be removed, thereby forming irregularities on the copper surface.

Abstract: A method of treating the surface of copper is provided to ensure adhesive strength between the surface of copper and an insulating layer without forming irregularities exceeding 1 ?m on the surface of copper and to improve insulation reliability between wirings. A copper whose surface is treated by the above surface treating method is also provided. The method of treating the surface of copper comprises the surface of copper comprising the steps of: forming a metal nobler than copper discretely on the surface of copper; and subsequently oxidizing the surface of copper by using an alkaline solution containing an oxidant.

Abstract: An image display system includes a display device, an input section to which video signals of an interlace scanning system are inputted, a signal converter section which increases horizontal scanning lines of the inputted video signals in number by a factor of at least two, and which generates first and second fields, each of the fields including effective scanning lines used for displaying and ineffective scanning lines not used for displaying, with the effective and ineffective scanning lines being arranged alternately in each of the fields, and a display control section which controls the display device to display the first and second fields alternately. The display control section controls the display device such that positions of the effective scanning lines of the first fields correspond with those of the ineffective scanning lines of the second fields, and vice versa.

Abstract: The present invention provides a connection board that is formed by an insulating resin composition layer made of one layer or two or more layers and a connection conductor that is formed so as to pass through the insulating resin composition layer in its thickness direction at a position where a conductor circuit is connected, and a multi-layer wiring board, a substrate for semiconductor package and a semiconductor package using the connection board, and methods for manufacturing them.

Abstract: The present invention provides a connection board that is formed by an insulating resin composition layer made of one layer or two or more layers and a connection conductor that is formed so as to pass through the insulating resin composition layer in its thickness direction at a position where a conductor circuit is connected, and a multi-layer wiring board, a substrate for semiconductor package and a semiconductor package using the connection board, and methods for manufacturing them.

Abstract: A method of treating the surface of copper is provided to ensure adhesive strength between the surface of copper and an insulating layer without forming irregularities exceeding 1 ?m on the surface of copper and to improve insulation reliability between wirings. A copper whose surface is treated by the above surface treating method is also provided. The method of treating the surface of copper comprises the surface of copper comprising the steps of: forming a metal nobler than copper discretely on the surface of copper; and subsequently oxidizing the surface of copper by using an alkaline solution containing an oxidant.

Abstract: The present invention provides a connection board that is formed by an insulating resin composition layer made of one layer or two or more layers and a connection conductor that is formed so as to pass through the insulating resin composition layer in its thickness direction at a position where a conductor circuit is connected, and a multi-layer wiring board, a substrate for semiconductor package and a semiconductor package using the connection board, and methods for manufacturing them.

Abstract: A semiconductor package substrate is provided, which can meet the move toward high integration of semiconductors. A nickel layer is plated on an electroplated copper foil to form a wiring pattern. An LSI chip is mounted on the copper foil, and terminals of the LSI chip and the wiring pattern are connected by wire bonding, followed by sealing with a semiconductor-sealing epoxy resin. Only the copper foil is dissolved away with an alkali etchant to expose nickel. With a nickel stripper having low copper-dissolving power, the nickel layer is removed to expose the wiring pattern. A solder resist is coated, and a pattern is formed in such a way that connecting terminal portions are exposed. Solder balls are placed at the exposed portions of the wiring pattern and are then fused. The wiring pattern is connected to an external printed board via the solder balls.

Abstract: The present invention provides a connection board that is formed by an insulating resin composition layer made of one layer or two or more layers and a connection conductor that is formed so as to pass through the insulating resin composition layer in its thickness direction at a position where a conductor circuit is connected, and a multi-layer wiring board, a substrate for semiconductor package and a semiconductor package using the connection board, and methods for manufacturing them.

Abstract: A symbol illuminator of game machines includes a wheel member having symbols at an outer circumferential surface thereof; a casing for the wheel member attached a printed circuit board having a plurality of illuminants; and a reflective frame member having enclosure walls expanding outwardly to a forward direction from a central part thereof, having a plurality of windows into which the illuminants are set, the illuminants being arranged so as to project inside a center part of the reflective frame member; and a projection part, having a reflective face, reflecting the light emitted by the illuminants toward at least the symbol from the inner side of the wheel member so that it can irradiate a reflex of a reflective frame member equally without spots to the symbol of wheel member and can reduce the number of the parts.

Abstract: A search is conducted through a registered large advertising list to judge whether there are at least two large ad advertisers with credit of at least one in the large ad list. If not, free printing is inhibited. If so, a search is made for small ad advertisers to check if there are at least three small ad advertisers with credit of at least one. If not, free printing is inhibited. If so, free printing is allowed. In this way, an image output system can be provided capable of producing a high image quality print with a sub image added thereto at no charge or a small charge by imposing a certain limit.

Abstract: An image display system includes a memory for storing at least one scanning line of an inputted video signal of the interlace scanning system, and reading means for repeating to read the video signal of one scanning line from the memory at a speed which is n (n is an integer of 2 or more) times of the writing speed of the video signal for the memory for a horizontal scanning period which is 1/n of the writing period and to stop reading for a horizontal scanning period of the remaining (n?1)/n for each scanning line of one field which is sequentially inputted and reading each scanning line so that the continuous fields interpolate the period of stopping of reading from the memory each other.

Abstract: A symbol illuminator of game machines includes a wheel member having symbols at an outer circumferential surface thereof; a casing for the wheel member attached a printed circuit board having a plurality of illuminants; and a reflective frame member having enclosure walls expanding outwardly to a forward direction from a central part thereof, having a plurality of windows set the illuminants thereinto, characterized in that the illuminants arranged so as to project inside a center part of the reflective frame member; and a projection part, having a reflective face, reflecting the light emitted by the illuminants toward at least the symbol from the inner side of the wheel member so that it can irradiate a reflex of a reflective frame member equally without spots to the symbol of wheel member and can reduce the number of the parts.

Abstract: An image display system includes a memory for storing at least one scanning line of an inputted video signal of the interlace scanning system, and reading means for repeating to read the video signal of one scanning line from the memory at a speed which is n (n is an integer of 2 or more) times of the writing speed of the video signal for the memory for a horizontal scanning period which is 1/n of the writing period and to stop reading for a horizontal scanning period of the remaining (n−1)/n for each scanning line of one field which is sequentially inputted and reading each scanning line so that the continuous fields interpolate the period of stopping of reading from the memory each other.

Abstract: A semiconductor package substrate is provided, which can meet the move toward high integration of semiconductors. A nickel layer is plated on an electroplated copper foil to form a wiring pattern. An LSI chip is mounted on the copper foil, and terminals of the LSI chip and the wiring pattern are connected by wire bonding, followed by sealing with a semiconductor-sealing epoxy resin. Only the copper foil is dissolved away with an alkali etchant to expose nickel. With a nickel stripper having low copper-dissolving power, the nickel layer is removed to expose the wiring pattern. A solder resist is coated, and a pattern is formed in such a way that connecting terminal portions are exposed. Solder balls are placed at the exposed portions of the wiring pattern and are then fused. The wiring pattern is connected to an external printed board via the solder balls.

Abstract: A semiconductor package substrate is provided, which can meet the move toward high integration of semiconductors. A nickel layer is plated on an electroplated copper foil to form a wiring pattern. An LSI chip is mounted on the copper foil, and terminals of the LSI chip and the wiring pattern are connected by wire bonding, followed by sealing with a semiconductor-sealing epoxy resin. Only the copper foil is dissolved away with an alkali etchant to expose nickel. With a nickel stripper having low copper-dissolving power, the nickel layer is removed to expose the wiring pattern. A solder resist is coated, and a pattern is formed in such a way that connecting terminal portions are exposed. Solder balls are placed at the exposed portions of the wiring pattern and are then fused. The wiring pattern is connected to an external printed board via the solder balls.