Abstract: A device for controlling the shape of a surface of a plate-like member such as a semiconductor wafer, includes support for supporting the plate-like member from a reverse surface thereof, a holding system for holding a portion of the reverse surface of the plate-like member on the support, and a control for controlling a pressure in a closed space which is related, when the plate-like member is supported by the support, to a portion of the reverse surface of the plate-like member other than the first-mentioned portion, such that the pressure in the closed space is changeable to be increased or decreased as compared with an initial pressure in the closed space when the plate-like member is supported by the support, to control deformation of the plate-like member to thereby control the surface shape of the plate-like member.

Abstract: An oxidation catalyst having the general formula:Co.sub.a Fe.sub.b Bi.sub.c B.sub.d Sb.sub.e Ni.sub.f J.sub.g Mo.sub.h O.sub.iin which J represents at least one of the elements potassium, rubidium, and cesium, and the suffixes a, b, c, d, e, f, g, h, and i represent the numbers of cobalt, iron, bismuth, boron, antimony, nickel, J, molybdenum, and oxygen atoms, respectively, when h is 12, a is 1 to 15, b 0.3 to 8, c 0.1 to 7, d 0.1 to 3, e 0.01 to 1, f 0 to 5, g 0 to 1 (exclusive of 0), and i is 38 to 92 and is determined by total valences of other elements. There is also provided a process for manufacturing methacrolein by oxidizing isobutylene and/or tertiary butyl alcohol with molecular oxygen, characterized in that the reaction is carried out in the presence of the catalyst as defined above.