Abstract: Provided are a small electronic component including: a magnetic core including at least a columnar core part; a winding coil arranged so as to surround an outer peripheral surface side of the columnar core part and formed by winding a winding wire; and a magnetic cover part formed so as to cover at least part of the magnetic core and the winding coil while following at least part of shapes of the magnetic core and the winding coil through use of a magnetic material containing a mixture of a phosphoric acid ester-based surfactant, magnetic powder, and a resin, an electronic circuit board using the small electronic component, and a method of manufacturing a small electronic component.

Abstract: Provided are a small electronic component including: a magnetic core including at least a columnar core part; a winding coil arranged so as to surround an outer peripheral surface side of the columnar core part and formed by winding a winding wire; and a magnetic cover part formed so as to cover at least part of the magnetic core and the winding coil while following at least part of shapes of the magnetic core and the winding coil through use of a magnetic material containing a mixture of a phosphoric acid ester-based surfactant, magnetic powder, and a resin, an electronic circuit board using the small electronic component, and a method of manufacturing a small electronic component.

Abstract: A silicon substrate is trimmed in an area at the top and rear surfaces at the center, and a piezoelectric vibrator is disposed therein. As shown in a top view of FIG. 1, the piezoelectric vibrator is supported by a silicon peripheral portion provided on the peripheral portion including the left and right portions of the view having a large thickness, through two beams formed by removing silicon by a known method such as etching. This supported portion corresponds to a node portion. A film structure of the piezoelectric vibrator includes, in thickness directions of the piezoelectric vibrator from the top to the bottom, an Al electrode, a PZT thin film, a Pt underlying electrode, a Ti underlayer, and an SiO2 thin film. Thereby, the piezoelectric vibrator is supported by the beams integrated with the silicon peripheral portion, thus eliminating a mechanical connection and achieving a stable connection.

Abstract: A photo-resist of a dry film patterned to form opening portions and non-opening portions is provided on a release film. An electrically conductive paste is applied by a doctor blade and thereafter is dried. Then, the release film of the dry film is removed and thereafter the dry film is adhered to a ceramic green sheet. The photo-resist is removed from the ceramic green sheet to form an electrically conductive film on the ceramic green sheet. The ceramic electronic component is manufactured by sintering the ceramic green sheet having the electrically conductive film formed.

Abstract: A silicon substrate is trimmed in an area at the top and rear surfaces at the center, and a piezoelectric vibrator is disposed therein. As shown in a top view of FIG. 1, the piezoelectric vibrator is supported by a silicon peripheral portion provided on the peripheral portion including the left and right portions of the view having a large thickness, through two beams formed by removing silicon by a known method such as etching. This supported portion corresponds to a node portion. A film structure of the piezoelectric vibrator includes, in thickness directions of the piezoelectric vibrator from the top to the bottom, an A1 electrode, a PZT thin film, a Pt underlying electrode, a Ti underlayer, and an SiO2 thin film. Thereby, the piezoelectric vibrator is supported by the beams integrated with the silicon peripheral portion, thus eliminating a mechanical connection and achieving a stable connection.

Abstract: A photo-resist 11 of a dry film 10 is patterned to form opening portions 111 and non-opening portions 112 (see FIG. 1(a)). An electrically conductive paste 21 is applied by a doctor blade 31 (see FIG. 1(b)) and thereafter is dried (see FIG. 1(c)). Then, a release film 12 of the dry film 10 is removed (see FIG. 1(d)) and thereafter the dry film 10 is adhered to a ceramic green sheet 41 (see FIG. 1(e)). The photo-resist 11 is removed from the ceramic green sheet 41 to form an electrically conductive film 42 on the ceramic green sheet 41 (see FIG. 1(e)). The ceramic electronic component is manufactured by sintering the ceramic green sheet 41 having the electrically conductive film 41 formed.

Abstract: An inductor device including a device body having a plurality of insulating layers; a plurality of conductive coil pattern units formed inside the device body between insulating layers along a single planar direction, coil pattern units adjoining each other in the single plane being centro-symmetric patterns with respect to a center point of a boundary line between unit sections containing coil pattern units; and connection portions connecting upper and lower coil pattern units separated by the insulating layers to form a coil. It is possible to obtain an inductor device able to suppress the stack deviation without complicating the production process even if the device is made small in size.

Abstract: In the multilayer inductor, the substrate thereof is composed of a constituent belonging to spinel ferrite, and is furnished with internal conductors of a main constituent being silver at the interior of the substrate. The internal conductors are drawn outside of the substrate, and the drawn portions are provided with external electrodes. The internal conductors contain manganese and bismuth, and the manganese and bismuth contents at an interface between the internal conductors and the substrate are more than those of other ranges. MnO2 of 0.02 to 0.1 wt % and Bi2O3 of 0.5 to 1.2 wt % are added to a paste of the main constituent being silver to be used to the internal conductors, and the paste is baked together with spinel ferrite material.

Abstract: A process for the production of an inductor device comprising the steps of forming a green sheet to form an insulating layer; forming a plurality of conductive coil pattern units on the surface of the green sheet in order that a plurality of unit sections each including a single coil pattern unit are arranged on the surface of the green sheet and each two coil pattern units adjoining in the substantially perpendicular direction to the longitudinal direction of the unit sections are arranged centro-symmetrically with respect to a center point of a vertical boundary line of adjoining unit sections; stacking a plurality of green sheets formed with the plurality of coil pattern units arranged in centro-symmetry and connecting the upper and lower coil pattern units separated by the green sheets to form a coil shape; and sintering the stacked green sheets.

Abstract: A method of manufacturing a multi-layer ferrite chip inductor array including an element main body composed by laminating a ferrite layer and a conductor layer in such a manner that the laminated face thereof is vertical with an element mounting surface. The method also includes furnishing a plurality of coil shaped internal conductors within the element main body, in which a coiling direction of the coil shaped internal conductor is in parallel with the element mounting surface, forming the ferrite sheets with through-holes and printing the ferrite sheets with a plurality of coil shaped internal conductors and conductor patterns with an electrically conductive material.

Abstract: A process for the production of an inductor device comprising the steps of forming a green sheet to form an insulating layer; forming a plurality of conductive coil pattern units on the surface of the green sheet in order that a plurality of unit sections each including a single coil pattern unit are arranged on the surface of the green sheet and each two coil pattern units adjoining in the substantially perpendicular direction to the longitudinal direction of the unit sections are arranged centro-symmetrically with respect to a center point of a vertical boundary line of adjoining unit sections; stacking a plurality of green sheets formed with the plurality of coil pattern units arranged in centro-symmetry and connecting the upper and lower coil pattern units separated by the green sheets to form a coil shape; and sintering the stacked green sheets.

Abstract: A method for manufacturing radio frequency module components with a surface acoustic wave element includes a gold plating step of plating gold at a component bonded portion on a conductive surface of a ceramic multi-layer substrate 40 to have a mounted electrode 43, a surface acoustic wave element mounting step of face down bonding a flip chip 30 as the surface acoustic wave element on the ceramic multi-layer substrate 40 by the gold—gold connection, a side wall formation step of bonding a side wall member 60 surrounding the flip chip 30 onto the ceramic multi-layer substrate 40 by adhesives, a lid formation step of bonding a lid member 61 enclosing an opening of the side wall onto the side wall member by adhesives, after mounting the flip chip 30, and a soldered component mounting step of mounting a soldered component 50 by the use of solder, after the lid formation step.

Abstract: A method of manufacturing a laminated ferrite chip inductor array, including the steps of printing on individual ferrite sheets having electrically communicating through holes U-shaped conductor patterns disposed 180° to one another, piling the ferrite sheets together, and sintering the piled ferrite sheets to form the inductor array.

Abstract: The surface acoustic wave elements and the other surface mounting elements are mounted on a ceramic multi-layer substrate. The surface acoustic wave elements may be flip chips face-down-bonded to the gold coated mounting electrodes of the multi-layer ceramic substrate by gold-to-gold bonding. At least the surface acoustic wave elements are covered as sealed airtight with the side walls fixed to the multi-layer ceramic substrate and a cover closing the opening of the side walls.

Abstract: In a surface electrode structure on a ceramic multi-layer substrate having on the surface SAW device mounting surface electrodes for mounting flip chips as surface-acoustic-wave devices by gold-gold bonding and soldered parts mounting surface electrodes. Further, at least the lowermost layer is made of a sintered silver conductor which is partly buried in the ceramic multi-layer substrate, a nickel or a nickel alloy layer being contained as an intermediate layer, and the topmost layer being a gold layer. Thus, a surface electrode structure on a ceramic multi-layer substrate is suitable for both mounting of SAW devices by gold-gold bonding and mounting of other parts by soldering and which enable consistent mounting of individual parts using a ceramic multi-layer substrate to provide higher reliability.

Abstract: A multi-layer ferrite chip inductor array, wherein an element main body 11 is composed by laminating a ferrite layer and a conductor layer in such a manner that the laminated face thereof is vertical with an element mounting surface 15, a plurality of coil shaped internal conductors are furnished within the element main body 11, the coiling direction of said coil shaped internal conductor being parallel with the element mounting surface, and the ferrite sheets formed with through-holes are printed with a plurality of coil shaped internal conductors and conductor patterns with the electrically conductive material, and the ferrite sheets are laminated such that the laminated face thereof is vertical with the element mounting surface. This realization of the invention depends on the production method having the process enabling to obtain the laminated body where the plurality of coil shaped internal conductors are formed, the coiling direction of said conductors being parallel with said element mounting surface.

Abstract: In the multilayer inductor, the substrate thereof is composed of a constituent belonging to spinel ferrite, and is furnished with internal conductors of a main constituent being silver at the interior of the substrate. The internal conductors are drawn outside of the substrate, and the drawn portions are provided with external electrodes. The internal conductors contain manganese and bismuth, and the manganese and bismuth contents at an interface between the internal conductors and the substrate are more than those of other ranges. MnO2 of 0.02 to 0.1 wt % and Bi2O3 of 0.5 to 1.2 wt % are added to a paste of the main constituent being silver to be used to the internal conductors, and the paste is baked together with spinel ferrite material.

Abstract: A process for the production of an inductor device comprising the steps of forming a green sheet to form an insulating layer; forming a plurality of conductive coil pattern units on the surface of the green sheet in order that a plurality of unit sections each including a single coil pattern unit are arranged on the surface of the green sheet and each two coil pattern units adjoining in the substantially perpendicular direction to the longitudinal direction of the unit sections are arranged centro-symmetrically with respect to a center point of a vertical boundary line of adjoining unit sections; stacking a plurality of green sheets formed with the plurality of coil pattern units arranged in centro-symmetry and connecting the upper and lower coil pattern units separated by the green sheets to form a coil shape; and sintering the stacked green sheets.

Abstract: In the method for the preparation of a laminated ferrite inductor device comprising the steps of: laminating a ferrite green sheet lined with and supported by a substrate film of, for example, polyethylene terephthalate provided with a penetrating through-hole and a coil pattern to a second ferrite green sheet followed by removal of the substrate film by peeling to form a laminate of ferrite green sheets to be subjected to sintering, peelability of the substrate film from the ferrite green sheet can be improved to prevent the ferrite green sheet from occurrence of defects such as breaking, crease formation and stretching by providing a snap groove of an adequate incision depth having a rectangular profile of a frame and, along the outer periphery of the snap groove, a peel-facilitating reinforcement pattern by printing with a printing paste to have a specified line width and printing thickness.

Abstract: In the multilayer inductor, the substrate thereof is composed of a constituent belonging to spinel ferrite, and is furnished with internal conductors of a main constituent being silver at the interior of the substrate. The internal conductors are drawn outside of the substrate, and the drawn portions are provided with external electrodes. The internal conductors contain manganese and bismuth, and the manganese and bismuth contents at an interface between the internal conductors and the substrate are more than those of other ranges. MnO2 of 0.02 to 0.1 wt % and Bi2O3 of 0.5 to 1.2 wt % are added to a paste of the main constituent being silver to be used to the internal conductors, and the paste is baked together with spinel ferrite material.